CN-122007657-A - Integrated circuit board surface laser cutting power control system based on computer

CN122007657ACN 122007657 ACN122007657 ACN 122007657ACN-122007657-A

Abstract

The invention discloses a computer-based integrated circuit board surface laser cutting power control system, and relates to the technical field of circuit board cutting; the optical path integrated module comprises a composite laser source, an optical path switching unit and a self-adaptive focusing unit, wherein the process execution module can switch the ultraviolet cutting unit, the micro-water guide cutting unit and the invisible cutting unit to be in butt joint with the optical path integrated module according to the cutting requirement of a circuit board; according to the invention, through the accurate matching of the composite laser source and the multi-cutting unit, the full-coverage processing of different types of integrated circuit boards is realized; meanwhile, the rough positioning and accurate calibration logic of the optical path switching unit and the universal focusing design of the self-adaptive focusing unit reduce the response time and positioning deviation of switching, and the secondary dedicated focusing of the cutting unit is matched, so that the stability and the accuracy of laser cutting under different schemes are ensured, the problems of low efficiency, accumulated error and the like caused by the traditional multi-equipment switching processing are solved, and the overall suitability and the production efficiency of circuit board cutting are improved.

Inventors

WANG XIAOJUN
YANG XU
WANG YONG
CHEN XINGHAI

Assignees

广东诺正电子股份有限公司

Dates

Publication Date: 20260512
Application Date: 20260318

Claims (10)

1. The integrated circuit board surface laser cutting power control system based on the computer is characterized by comprising an optical path integrated module, a process execution module and a monitoring control module; The optical path integrated module is used for outputting laser beams according to a circuit board cutting scheme, wherein the circuit board cutting scheme comprises an ultraviolet cutting scheme, a micro-water guide cutting scheme and a stealth cutting scheme; The process execution module is used for switching the corresponding laser cutting unit according to the circuit board cutting scheme to execute the circuit board cutting scheme, wherein the laser cutting unit comprises an ultraviolet cutting unit, a micro water guide cutting unit and a stealth cutting unit; The monitoring control module is used for switching the monitoring sensor according to a cutting scheme of the circuit board and adjusting the laser beam output by the light path integration module according to monitoring data of the monitoring sensor, wherein the monitoring sensor comprises an infrared temperature sensor, a plasma monitoring sensor and an OCT module.
2. The computer-based integrated circuit board surface laser cutting power control system of claim 1, wherein the optical path integration module comprises a composite laser source, an optical path switching unit, and an adaptive focusing unit; the composite laser source integrates a plurality of lasers, and the plurality of lasers comprise a nanosecond ultraviolet laser, an infrared/green light pulse laser and a femtosecond/picosecond infrared laser; the light path switching unit performs light source switching through the high-speed electric control reflecting mirror group and the acoustic optical modulator; The adaptive focusing unit is used for automatically adjusting the focusing parameters of the switched laser beams.
3. The computer-based integrated circuit board surface laser cutting power control system of claim 1, wherein switching the corresponding laser cutting unit to perform the circuit board cutting scheme according to the circuit board cutting scheme comprises: Selecting a target cutting unit from the laser cutting units according to a circuit board cutting scheme; And switching the target cutting unit to enable the target cutting unit to be in butt joint with the optical path integrated module, and completing cutting of the integrated circuit board by utilizing the laser beam output by the optical path integrated module.
4. The computer-based integrated circuit board surface laser cutting power control system of claim 1, wherein adjusting the laser beam output by the optical path integration module according to the monitoring data of the monitoring sensor comprises: extracting an optimal numerical value corresponding to the monitoring data, wherein the monitoring data comprises temperature data, plasma signal intensity or OCT scanning signal intensity; and when the monitoring data deviate from the corresponding optimal numerical value and the data deviation exceeds a preset deviation threshold, adjusting the laser beam according to the data deviation.
5. The computer-based integrated circuit board surface laser cutting power control system of claim 1, further comprising a table and an environmental control module; the workbench is used for realizing positioning and fixing of the integrated circuit board; The environment control module is used for guaranteeing the stability of the processing environment.
6. The computer-based integrated circuit board surface laser cutting power control system of claim 1, wherein switching the monitoring sensor according to the circuit board cutting scheme comprises: Selecting a main sensor and an auxiliary sensor according to a circuit board cutting scheme; and switching the main sensor and the auxiliary sensor to monitor the cutting process, acquiring main data by using the selected main sensor, and acquiring auxiliary data by using the auxiliary sensor.
7. The computer-based integrated circuit board surface laser cutting power control system of claim 6, wherein adjusting the laser beam output by the optical path integration module according to the monitoring data of the monitoring sensor comprises: Extracting a monitoring data set, wherein the monitoring data set comprises main data and auxiliary data; and adjusting the laser beam output by the light path integration module based on the monitoring data set so as to improve the adjustment precision of the laser beam through the auxiliary data.
8. The computer-based integrated circuit board surface laser cutting power control system of claim 7, wherein when the circuit board cutting scheme is an ultraviolet cutting scheme, adjusting the laser beam output by the optical path integration module based on the monitoring data set comprises: Extracting main data and auxiliary data in the monitoring data set, wherein the main data is temperature data, the auxiliary data is an OCT scanning result, and the OCT scanning result comprises a material reference thickness and an actual cutting depth; matching the optimal temperature value of the actual cutting depth through a temperature depth mapping model according to a cutting layer matching temperature depth mapping model of the circuit board, and expanding the optimal temperature value serving as a center to obtain an optimal temperature; And when the temperature data deviates from the corresponding optimal temperature and the temperature deviation exceeds a preset temperature threshold, adjusting the laser beam according to the temperature deviation.
9. The computer-based integrated circuit board surface laser cutting power control system of claim 7, wherein when the circuit board cutting scheme is a micro-water guide cutting scheme, adjusting the laser beam output by the optical path integration module based on the monitoring data set comprises: Extracting main data and auxiliary data in the monitoring data set, wherein the main data is temperature data, the auxiliary data is environment data I, the temperature data comprises micro water column water temperature and material surface temperature of a cutting area, and the environment data I comprises air pressure data and humidity data; performing primary correction on the plasma signal intensity by using the temperature data, and performing secondary correction by using the environment data to obtain corrected plasma signal intensity; And when the corrected plasma signal intensity deviates from the corresponding optimal signal intensity and the intensity deviation exceeds a preset deviation threshold, adjusting the laser beam and the water pressure according to the intensity deviation.
10. The computer-based integrated circuit board surface laser cutting power control system of claim 7, wherein adjusting the laser beam output by the optical path integration module based on the monitoring data set when the circuit board cutting scheme is a stealth cutting scheme comprises: Extracting main data and auxiliary data in the monitoring data set, wherein the main data are scanning signal data, the auxiliary data are environment data II, and the environment data comprise temperature data and humidity data; And when the corrected scanning signal data deviate from the corresponding optimal scanning signal and the signal deviation exceeds a preset deviation threshold, adjusting the laser beam according to the signal deviation.

Description

Integrated circuit board surface laser cutting power control system based on computer Technical Field The invention belongs to the technical field of circuit board cutting, and particularly relates to a computer-based integrated circuit board surface laser cutting power control system. Background In the field of integrated circuit board processing, laser cutting has become a mainstream processing mode because of the core advantages of high precision and low damage, and three mainstream laser cutting technical schemes, namely ultraviolet laser cold cutting, micro-water guide laser cutting and invisible cutting, are formed in the industry at present. In the prior art, various cutting schemes all rely on dedicated laser sources, cutting units and matched optical path systems to form a relatively independent processing equipment system, and corresponding single equipment is required to be selected for production according to the requirements of materials, thickness, processing precision and the like of a circuit board. However, the prior art has the technical limitations that on one hand, a single laser cutting device can only adapt to the processing requirements of a specific type of integrated circuit board, when facing different scenes such as a conventional circuit board, a flexible circuit board, a high-precision packaging substrate and the like, different processing devices are required to be replaced, so that the equipment investment cost is increased, the problem of low processing efficiency is caused by production flow interruption caused by device switching, on the other hand, the optical path systems of different devices are mutually independent, a unified optical path integration and switching mechanism is lacking, positioning deviation is easy to generate in the device switching process, the focusing parameters of all the devices are required to be independently debugged, the cutting precision is influenced by error accumulation, and the processing suitability, the stability and the production efficiency are difficult to be considered. In order to solve the technical problems, the invention provides a computer-based integrated circuit board surface laser cutting power control system. Disclosure of Invention The invention aims to at least solve one of the technical problems in the prior art, and therefore, the invention provides a computer-based integrated circuit board surface laser cutting power control system. In order to achieve the above object, a first aspect of the present invention provides a computer-based integrated circuit board surface laser cutting power control system, which includes an optical path integration module, a process execution module, and a monitoring control module; The circuit board cutting scheme comprises an ultraviolet cutting scheme, a micro-water guide cutting scheme and a stealth cutting scheme; The process execution module is used for switching the corresponding laser cutting unit according to the circuit board cutting scheme to execute the circuit board cutting scheme, wherein the laser cutting unit comprises an ultraviolet cutting unit, a micro-water guide cutting unit and a stealth cutting unit; the monitoring control module is used for switching the monitoring sensor according to the cutting scheme of the circuit board and adjusting the laser beam output by the optical path integration module according to the monitoring data of the monitoring sensor, wherein the monitoring sensor comprises an infrared temperature sensor, a plasma monitoring sensor and an OCT module. In one possible implementation, the optical path integration module includes a composite laser source, an optical path switching unit, and an adaptive focusing unit; The composite laser source integrates a plurality of lasers, and the plurality of lasers comprise a nanosecond ultraviolet laser, an infrared/green light pulse laser and a femtosecond/picosecond infrared laser; the light path switching unit performs light source switching through the high-speed electric control reflecting mirror group and the acoustic optical modulator; the adaptive focusing unit is used for automatically adjusting the focusing parameters of the switched laser beams. In one possible implementation, switching the corresponding laser cutting unit according to the circuit board cutting scheme to perform the circuit board cutting scheme includes: selecting a target cutting unit from the laser cutting units according to a circuit board cutting scheme; And switching the target cutting unit to enable the target cutting unit to be in butt joint with the optical path integrated module, and completing cutting of the integrated circuit board by utilizing the laser beam output by the optical path integrated module. In one possible implementation, adjusting the laser beam output by the optical path integration module according to the monitoring data of the monitoring sensor includes: extracting an optimal numerical value correspondi