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CN-122007681-A - Detection method, detection system, laser processing method and laser processing device

CN122007681ACN 122007681 ACN122007681 ACN 122007681ACN-122007681-A

Abstract

The application provides a detection method, a detection system, a laser processing method and laser processing equipment, wherein the detection method is used for detecting the laser processing quality in real time and comprises the following steps: in the process of processing a through hole on a substrate to be processed by using pulse laser, synchronously acquiring a first pulse signal from a first side of the substrate to be processed and acquiring a second pulse signal from a second side of the substrate to be processed; and recording coordinates of the through hole when the processing state is judged to be abnormal. The embodiment of the application can improve the product yield.

Inventors

  • WU HONGXIN
  • CHEN MIN
  • CHEN GUODONG
  • LV HONGJIE

Assignees

  • 深圳市大族微电子科技有限公司

Dates

Publication Date
20260512
Application Date
20260130

Claims (15)

  1. 1. A method for detecting laser processing quality in real time, the method comprising: In the process of processing a through hole on a substrate to be processed by using pulse laser, synchronously acquiring a first pulse signal from a first side of the substrate to be processed and acquiring a second pulse signal from a second side of the substrate to be processed; Determining whether the processing state of the through hole is abnormal or not based on the first pulse signal and/or the second pulse signal; and when the processing state is judged to be abnormal, recording coordinates of the through hole.
  2. 2. The method according to claim 1, wherein the first pulse signal is obtained from reflected light from laser light acting on the substrate to be processed, and the second pulse signal is obtained from transmitted light from laser light acting on the substrate to be processed.
  3. 3. The detection method according to claim 1, wherein the determination of whether the processing state of the through hole is abnormal based on the first pulse signal and/or the second pulse signal includes any one of: Determining that the processing state is abnormal under the condition that the deviation between the first pulse signal and a first preset standard signal is larger than a first deviation threshold value, wherein the first preset standard signal is a pulse signal obtained from the first side of the substrate to be processed when the processing state of the through hole meets the preset requirement; And determining that the processing state is abnormal under the condition that the deviation between the second pulse signal and a second preset standard signal is larger than a second deviation threshold value, wherein the second preset standard signal is a pulse signal obtained from the second side of the substrate to be processed under the condition that the processing state of the through hole meets the preset requirement.
  4. 4. The detection method according to claim 1, wherein the determining whether the processing state of the through hole is abnormal based on the first pulse signal and/or the second pulse signal includes: Determining whether the processing state is abnormal based on at least one characteristic parameter extracted from the first pulse signal or the second pulse signal, wherein the characteristic parameter comprises single pulse amplitude, single pulse energy, single pulse waveform, single pulse width and single pulse intensity.
  5. 5. The detection method according to claim 1, wherein the determining whether the processing state of the through hole is abnormal based on the first pulse signal and/or the second pulse signal includes: Determining whether the machining state is abnormal and a corresponding abnormality type based on at least one characteristic parameter extracted from the first pulse signal and the second pulse signal, wherein the characteristic parameter comprises a single pulse amplitude, a single pulse energy, a single pulse waveform, a single pulse amplitude, a single pulse intensity, an occurrence time delay of the second pulse signal relative to the first pulse signal and an amplitude ratio of the single pulses of the first pulse signal and the second pulse signal.
  6. 6. The method of claim 5, wherein the determination of the anomaly type comprises at least one of: If the single pulse amplitude of the first pulse signal is lower than a first amplitude range, the single pulse amplitude of the second pulse signal is lower than a second amplitude range, and the amplitude ratio is in a normal ratio range, judging that the abnormal type is abnormal in laser supply; If the single pulse amplitude of the first pulse signal deviates from a first amplitude range, the second pulse signal amplitude is lower than a second amplitude range, and the amplitude ratio deviates from a normal ratio range, judging that the abnormal type is abnormal in pollution of the surface of the substrate; and if the occurrence time delay is larger than the first time range, judging that the abnormal type is abnormal in the internal material of the substrate.
  7. 7. The detection method according to any one of claims 1 to 6, characterized in that the method further comprises: and rechecking the through holes with the processing states judged to be abnormal through the image recognition module, and screening out verified abnormal through holes.
  8. 8. The method of claim 6, wherein the method further comprises: Starting corresponding processing means according to the verified abnormal type, wherein the processing means comprises at least one of the following: Aiming at abnormal laser supply, performing laser state detection, adjusting laser emission parameters to a normal state, and then performing laser repair; aiming at abnormal surface pollution, performing surface cleaning, and then performing laser repair; and detecting abnormal material areas aiming at abnormal material in the substrate, and making scrapping determination or laser repair determination according to the characteristics of the abnormal areas.
  9. 9. A detection system for detecting laser processing quality in real time, comprising: The optical detection module is configured to synchronously acquire a first pulse signal from a first side of the substrate to be processed and acquire a second pulse signal from a second side of the substrate to be processed in the process of processing the through hole of the substrate to be processed by using pulse laser; The optical detection module comprises a first detection device and a second detection device, wherein the first detection device is arranged on the first side of the substrate to be processed to obtain a first pulse signal; The processing control module is connected with the first detection device and the first detection device; wherein the process control module comprises: A feature extraction unit configured to extract at least one feature parameter from the first pulse signal and the second pulse signal acquired synchronously; An abnormality diagnosis unit configured to determine a processing abnormality based on the at least one characteristic parameter and determine an abnormality type; A position recording unit configured to record coordinates of the through hole when it is determined that the processing state of the through hole is abnormal; and the image recognition module is configured to perform visual recheck on the position of the through hole judged to be abnormal.
  10. 10. The system of claim 9, wherein the process control module further comprises a compensation processing module configured to generate corresponding laser parameter adjustment instructions and positioning movement instructions according to the anomaly diagnosis module and/or the determined anomaly type, and control the laser processing module to make a repair to the coordinate position recorded by the position recording unit.
  11. 11. The system of claim 10, wherein the first detection device and/or the second detection device is a photodiode, an avalanche photodiode, a fiber optic sensor, an oscilloscope, or a CCD sensor, and combinations thereof.
  12. 12. A laser processing method, comprising: processing a through hole on a substrate to be processed by using pulse laser; Also included is a detection method according to any one of claims 1 to 8.
  13. 13. A laser processing apparatus, comprising: A laser processing module comprising a pulsed laser, a laser processing head, a processing station configured to emit pulsed laser light towards a substrate to be processed; Further comprising a detection system according to any of claims 9-11.
  14. 14. An electronic device comprising a processor and a memory storing computer program instructions; The processor, when executing the computer program instructions, implements the detection method according to any one of claims 1-8, or the laser machining method according to claim 12.
  15. 15. A computer readable storage medium, characterized in that the computer readable storage medium has stored thereon computer program instructions, which when executed by a processor, implement the detection method according to any of claims 1-8 or the laser machining method according to claim 12.

Description

Detection method, detection system, laser processing method and laser processing device Technical Field The present application relates to the field of laser processing technologies, and in particular, to a detection method, a detection system, a laser processing method, and a laser processing apparatus. Background In the field of pulse laser processing, for example, in the scene of processing through holes of transparent or semitransparent substrates such as glass, ceramic, silicon wafers and the like and opaque substrates such as metal and the like, the real-time control of the processing quality directly determines the product yield and the production efficiency, and abnormal problems such as laser abnormality (for example, energy fluctuation, pulse leakage), surface pollution, substrate material internal abnormality (for example, cracks) and the like are dominant factors causing abnormal through hole processing, so that timely discovery of abnormal through hole processing is a key link for ensuring the processing precision. In the related art, when detecting processing anomalies, the laser processing method relies on image analysis means after processing, namely, after finishing processing a batch of workpieces, whether processing defects exist or not is judged by manual sampling inspection of a high-power microscope or scanning of a machine vision system. In the mode, real-time detection of processing defects in the processing process cannot be realized, so that the processing defects cannot be interrupted and corrected in time, and the product yield is low. Disclosure of Invention The detection method, the detection system, the laser processing method and the laser processing equipment provided by the application can improve the product yield. In a first aspect, an embodiment of the present application provides a detection method for detecting laser processing quality in real time, where the method includes: in the process of processing a through hole on a substrate to be processed by using pulse laser, synchronously acquiring a first pulse signal from a first side of the substrate to be processed and acquiring a second pulse signal from a second side of the substrate to be processed; Judging whether the processing state of the through hole is abnormal or not based on the first pulse signal and/or the second pulse signal; When the machining state is determined to be abnormal, the coordinates of the through hole are recorded. In a second aspect, the present application provides a detection system comprising: The optical detection module is configured to synchronously acquire a first pulse signal from a first side of the substrate to be processed and acquire a second pulse signal from a second side of the substrate to be processed in the process of processing the through hole of the substrate to be processed by using pulse laser; The optical detection module comprises a first detection device and a second detection device, wherein the first detection device is arranged on the first side of the substrate to be processed to obtain a first pulse signal; The processing control module is connected with the first detection device and the first detection device; wherein the process control module comprises: A feature extraction unit configured to extract at least one feature parameter from the first pulse signal and the second pulse signal acquired synchronously; An abnormality diagnosis unit configured to determine a processing abnormality based on the at least one characteristic parameter and determine an abnormality type; A position recording unit configured to record coordinates of the through hole when it is determined that the through hole processing state is abnormal; and the image recognition module is configured to perform visual recheck on the position of the through hole judged to be abnormal. In a third aspect, an embodiment of the present application provides a laser processing method, including: processing a through hole on a substrate to be processed by using pulse laser; Also included is a detection method as in the first aspect and any one of the embodiments of the first aspect. In a fourth aspect, an embodiment of the present application provides a laser processing apparatus including: A laser processing module comprising a pulsed laser, a laser processing head, a processing station configured to emit pulsed laser light towards a substrate to be processed; Also included is a detection system as in the second aspect and any one of the embodiments of the second aspect. In a fifth aspect, an embodiment of the present application provides an electronic device comprising a processor and a memory storing computer program instructions; The processor, when executing the computer program instructions, implements a detection method as in any one of the embodiments of the first aspect, or a laser machining method as in any one of the embodiments of the second aspect. In a sixth aspect, embodiments of th