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CN-122007688-A - Copper sheet processing method capable of preventing slag residue on back surface

CN122007688ACN 122007688 ACN122007688 ACN 122007688ACN-122007688-A

Abstract

The application relates to the technical field of post-treatment of metal devices, in particular to a copper sheet processing method for preventing slag residue on the back surface, which comprises the following steps of firstly, polishing the surface of a copper sheet; the method comprises the steps of polishing a copper sheet, removing impurities on the surface of the copper sheet, depositing a metal sacrificial layer on the back surface of the copper sheet, fixing the metal sacrificial layer on a carrier through a wax layer to enable the back surface of the copper sheet to face the carrier, approaching the front surface of the copper sheet to laser cutting equipment, carrying out laser cutting processing on the copper sheet through the laser cutting equipment, cooling the processed copper sheet, heating the wax layer, separating the copper sheet from the carrier, removing wax remained on the copper sheet, and removing the metal sacrificial layer on the back surface of the copper sheet. According to the application, the copper sheet material with no impurity residue on the surface can be obtained by depositing the metal sacrificial layer on the back of the copper sheet material to be processed.

Inventors

  • ZHAO WEI
  • WANG XINGGANG
  • YU HAICHAO

Assignees

  • 强一半导体(苏州)股份有限公司

Dates

Publication Date
20260512
Application Date
20260327

Claims (8)

  1. 1. A copper sheet processing method for preventing slag residue on the back surface is characterized by comprising the following steps: polishing the surface of the copper sheet (1); step two, removing surface impurities of the copper sheet (1) subjected to polishing treatment; step three, depositing a metal sacrificial layer (2) on the back surface of the copper sheet (1); Fixing the metal sacrificial layer (2) on the carrier (4) through the wax layer (3) so that the back surface of the copper sheet (1) faces the carrier (4); Step five, approaching the front surface of the copper sheet (1) to laser cutting equipment, carrying out laser cutting processing on the copper sheet (1) by the laser cutting equipment, and then cooling the processed copper sheet (1); step six, heating the wax layer (3), and then separating the copper sheet (1) from the carrier (4); Step seven, removing wax remained on the copper sheet (1); and step eight, removing the metal sacrificial layer (2) on the back of the copper sheet (1).
  2. 2. The method for processing the copper sheet for preventing the backside slag residue according to claim 1, wherein the second step comprises the following steps: s1, wiping the copper sheet (1) with absolute ethyl alcohol to remove greasy dirt and particulate matters on the surface of the copper sheet (1); s2, waiting for the natural volatilization of the absolute ethyl alcohol on the surface of the copper sheet (1).
  3. 3. The method for processing the copper sheet for preventing the backside slag residue according to claim 1, wherein the fourth step comprises the following steps: S1, uniformly smearing solid wax on a carrier (4) to form a wax layer (3) on the carrier (4); S2, attaching the surface of one side, away from the copper sheet (1), of the metal sacrificial layer (2) to the wax layer (3); And S3, the metal sacrificial layer (2) and the wax layer (3) are kept relatively fixed in a pressurizing and cooling mode.
  4. 4. A copper sheet processing method for preventing slag residue on the back surface according to any one of claims 1 to 3, wherein the metal sacrificial layer (2) is an aluminum sacrificial layer; in the eighth step, the back of the copper sheet (1) is upwards and then placed in a sacrificial layer solution, wherein the sacrificial layer solution is selected from any one or a combination of a NaOH solution and a KOH solution.
  5. 5. A copper sheet processing method for preventing slag residue on the back surface according to any one of claims 1 to 3, wherein in the fifth step, the laser cutting device is operated and simultaneously nitrogen is adopted to assist in blowing away slag on the front surface of the copper sheet (1).
  6. 6. The method for processing copper sheet with back slag residue prevention as in any one of claims 1-3, wherein step seven comprises the steps of: s1, placing the copper sheet (1) in absolute ethyl alcohol for ultrasonic cleaning so as to remove wax remained on the copper sheet (1); S2, placing the copper sheet (1) in pure water for ultrasonic cleaning to remove absolute ethyl alcohol remained on the copper sheet (1).
  7. 7. A method for processing copper sheet with back slag prevention as defined in any one of claims 1 to 3, wherein the thickness of the metal sacrificial layer (2) is in the range of 0.5 to 2.0 μm.
  8. 8. The method for processing a copper sheet with backside slag residue prevention as in any one of claims 1-3, further comprising a step nine, wherein the step nine comprises the steps of: S1, placing the copper sheet (1) with the metal sacrificial layer (2) removed in pure water for ultrasonic cleaning to remove residual impurities; s2, immersing the cleaned copper sheet (1) into isopropanol for dehydration so as to replace water on the surface of the copper sheet (1), avoiding water marks left by evaporation of residual moisture in the drying process, and reducing the risk of oxidization of the surface of the copper sheet (1); s3, transferring the dehydrated copper sheet (1) into a nitrogen drying tank for drying so as to remove residual isopropanol.

Description

Copper sheet processing method capable of preventing slag residue on back surface Technical Field The invention relates to the technical field of metal device post-treatment, in particular to a copper sheet processing method for preventing slag residue on the back surface. Background The laser cutting is used as one of core application technologies in the laser processing field, and is widely applied in the metal material processing field by virtue of the remarkable advantages of high cutting precision, high speed, small heat affected zone and the like, and is particularly suitable for processing requirements of industries such as aerospace, automobile manufacturing, electronic equipment and the like on precise metal parts. The working principle is that a high-energy density laser beam is utilized to generate high temperature, so that a metal material is quickly melted, and the laser beam is used for cutting along a preset contour on the surface of the material by relatively moving the metal material or the laser beam, so that a workpiece with a required shape and size is obtained. In the actual processing process of laser cutting metal materials, when laser beams penetrate through the surfaces of the materials, two migration states of molten matters generated by high temperature effect occur, wherein one part of molten matters splashes to the front surface of the materials, the other part of molten matters infiltrates to the back surface of the materials, and after the laser processing is finished, the molten matters can be cooled and adhered on the surfaces of the materials along with temperature reduction to form slag. In order to reduce the influence of slag on the processing quality, the current field generally adopts a mode of optimizing process parameters to control, specifically comprises the steps of adjusting laser power, cutting rate, auxiliary gas pressure and the like, and the methods can reduce the slag amount on the front surface of metal materials such as copper sheets to a certain extent. Meanwhile, aiming at residual slag, post-treatment means such as acid washing, mechanical erasure and the like are adopted in the industry to remove the residual slag. However, the prior art scheme still has the defects that on one hand, the front slag quantity can be reduced only by adjusting the technological parameters, and the slag penetrating to the back of the material is difficult to control, and on the other hand, the prior post-treatment methods of acid washing, mechanical erasure and the like have inherent defects, chemical agents in the acid washing process are easy to erode a metal matrix, mechanical erasure can cause the problems of scratch, roughness increase and the like of the surface of the material, and the surface integrity of the metal material such as copper sheets and the like is seriously damaged, so that the subsequent assembly precision and the service performance of a workpiece are influenced. In view of this, it is an object of the present invention to solve the above-described problems of the prior art. Disclosure of Invention The invention aims to provide a copper sheet processing method for preventing slag residue on the back surface. In order to achieve the above purpose, the invention adopts the following technical scheme: a copper sheet processing method for preventing slag residue on the back surface comprises the following steps: Step one, polishing the surface of a copper sheet; step two, removing surface impurities of the copper sheet subjected to the polishing treatment; step three, depositing a metal sacrificial layer on the back of the copper sheet; fixing the metal sacrificial layer on the carrier through the wax layer so that the back surface of the copper sheet faces the carrier; step five, the front surface of the copper sheet is close to laser cutting equipment, the laser cutting equipment is used for carrying out laser cutting processing on the copper sheet, and then the processed copper sheet is cooled; step six, heating the wax layer, and then separating the copper sheet from the carrier; Step seven, removing the wax remained on the copper sheet; And step eight, removing the metal sacrificial layer on the back of the copper sheet. In the first step, the surface layer of the copper sheet is removed (about 10 um) by polishing (grinding) to remove scratches and other defects on the surface of the copper sheet. And thirdly, depositing a metal sacrificial layer on the back of the copper sheet, wherein the metal sacrificial layer prevents slag from adhering to the back of the copper sheet. And fourthly, fixing the metal sacrificial layer on the carrier through the wax layer, and conveniently fixing and processing. In the fifth step, the copper sheet can be naturally cooled to room temperature (25 ℃) after the copper sheet is processed. In the sixth step, the processed copper sheet is taken out from the laser cutting equipment, the copper sheet and the carrier are p