CN-122007962-A - Numerical control center vacuum negative pressure chip removal device and method suitable for deep hole machining
Abstract
The invention discloses a numerical control center vacuum negative pressure chip removal device and method suitable for deep hole machining, wherein the numerical control center vacuum negative pressure chip removal device comprises a base, a negative pressure adsorption component, a vacuum gauge, a filter box, a filter basket, a gas-liquid separator and a control box, wherein the base is used for supporting and fixing all parts of the whole chip removal device, the negative pressure adsorption component is arranged on the upper surface of the base, the vacuum gauge is arranged on the negative pressure adsorption component and is used for measuring the vacuum degree in the negative pressure adsorption component, the filter box is arranged on one side of the negative pressure adsorption component on the base, the filter basket is provided with a plurality of filter baskets which are sequentially arranged in the filter box from top to bottom, the discharge end of the gas-liquid separator is connected with the filter basket, the feed end of the gas-liquid separator is connected with a flexible chip guide pipe, the other end of the flexible chip guide pipe is connected with a mounting hole communicated with an inner hole chip removal tool on a main shaft of the numerical control center, and the gas outlet end of the gas-liquid separator is connected with the gas suction end of the negative pressure adsorption component.
Inventors
- ZHAO BAOYIN
Assignees
- 深圳市鸣仁实业有限公司
Dates
- Publication Date
- 20260512
- Application Date
- 20260227
Claims (10)
- 1. Numerical control center vacuum negative pressure chip removal device suitable for deep hole processing, characterized by comprising: The chip removing device comprises a base (1), wherein the base (1) is used for supporting and fixing all parts of the whole chip removing device; The negative pressure adsorption component (2), the negative pressure adsorption component (2) is arranged on the upper surface of the base (1); The vacuum gauge (3) is arranged on the negative pressure adsorption component (2) and is used for measuring the vacuum degree inside the negative pressure adsorption component (2); the filter box (6) is arranged on one side of the negative pressure adsorption component (2) on the base (1); The filter baskets (7) are arranged in the filter box (6) from top to bottom, and the filter holes of the filter baskets (7) are sequentially reduced from top to bottom; The device comprises a gas-liquid separator (9), wherein the discharge end of the gas-liquid separator (9) is connected with a filter basket (7), the feed end of the gas-liquid separator (9) is connected with a flexible chip guide pipe (10), and the other end of the flexible chip guide pipe (10) is connected with a mounting hole (62) on a numerical control center spindle, which is communicated with an inner hole chip removal cutter; The control box (4), control box (4) are installed in base (1) front end, just control box (4) are continuous with negative pressure adsorption component (2) and vacuum gauge (3) electrical property.
- 2. The numerical control center vacuum negative pressure chip removal device suitable for deep hole machining according to claim 1 is characterized in that a first bolt hole (11) is formed in the corner of the base (1), the first bolt hole (11) is used for fixing the base (1) on the numerical control center, two supporting rods (12) are arranged on the inner side of the base (1), a plurality of second bolt holes (13) are formed in the two supporting rods (12), the supporting rods (12) are matched with the second bolt holes (13) and used for connecting a negative pressure adsorption assembly (2) and a filter box (6), a plurality of third bolt holes (14) are formed in the front end of the base (1), and the third bolt holes (14) are used for connecting with a control box (4).
- 3. The numerical control center vacuum chip removal device suitable for deep hole machining according to claim 1, wherein the negative pressure adsorption component (2) comprises a negative pressure buffer tank (21) and a variable frequency vacuum pump (22), a bearing platform (211) is arranged on the upper surface of the negative pressure buffer tank (21), a plurality of fourth bolt holes (212) are formed in the bearing platform (211), the fourth bolt holes (212) are used for being connected with a gas-liquid separator (9), the variable frequency vacuum pump (22) is fixed on the bearing platform (211), an air suction pipe (221) is arranged at the air suction end of the variable frequency vacuum pump (22), the air suction pipe (221) is communicated with the negative pressure buffer tank (21), an exhaust connector (222) is arranged at the top of the variable frequency vacuum pump (22), a junction box (223) is arranged on the side surface of the variable frequency vacuum pump (22), a first communication line (224) is arranged on the side surface of the junction box (223), a first connecting female connector (225) is arranged at the end of the first communication line (224), the first connecting female connector (225) is connected with a control box (4), negative pressure pins (213) are arranged at the two ends of the negative pressure buffer tank (21), a plurality of negative pressure buffer tanks (213) are arranged at the two ends of the negative pressure buffer tank (213), and a tee joint (217) is arranged on the negative pressure adsorption tank, and one end of the tee joint (217) is vertically upwards arranged.
- 4. The numerical control center vacuum negative pressure chip removal device suitable for deep hole machining according to claim 3, wherein a connecting pipe (31) is arranged on the back of the vacuum gauge (3), a threaded connector (32) is arranged at the bottom end of the connecting pipe (31), the threaded connector (32) is in threaded connection with a three-way connector (217), a second communication line (33) is arranged on the side face of the vacuum gauge (3), a second connecting female connector (34) is arranged at the end of the second communication line (33), and the second connecting female connector (34) is electrically connected with the control box (4).
- 5. The numerical control center vacuum negative pressure chip removal device suitable for deep hole machining according to claim 4 is characterized in that a plurality of connecting male heads (41) are arranged at the top of the control box (4), a control panel (42) is arranged on the front surface of the control box (4), supporting feet (43) are arranged in the middle of the bottom surface of the control box (4), fixing feet (44) are arranged at the bottom ends of the supporting feet (43), a plurality of fixing holes (45) are formed in the fixing feet (44), the control box (4) penetrates through the fixing holes (45) through bolts and is fixed on a base (1), a control module is arranged inside the control box (4), the control module is connected with a power supply module, an alarm module and a data acquisition module, the control module adopts a PLC controller, the power supply module is convenient for supplying power to the whole chip removal device, and the alarm module is used for sending an audible and visual alarm signal when detecting that the vacuum degree exceeds a preset range, reminding a worker to check and processing in time, and the data acquisition module is used for acquiring data on the vacuum gauge (3) and judging the vacuum degree inside a negative pressure buffer tank (21) conveniently.
- 6. The numerical control center vacuum negative pressure chip removal device suitable for deep hole machining according to claim 1 is characterized in that mounting feet (61) are arranged at the front end and the rear end of the bottom of the filter box (6), a plurality of mounting holes (62) are formed in the mounting feet (61), clamping grooves (63) are formed in the tops of the front end face and the rear end face of the filter box (6), a first limiting supporting edge (64) and a second limiting supporting edge (65) are sequentially arranged on the inner side of the filter box (6) from bottom to top and used for limiting and supporting a filter basket (7), a feeding pipe (66) is arranged at the top of the side face of the filter box (6), and a drain pipe is arranged at the bottom of the side face of the filter box (6).
- 7. The numerical control center vacuum negative pressure chip removal device suitable for deep hole machining according to claim 6, wherein the top cross-sectional area of the filter basket (7) is larger than the bottom cross-sectional area, a frame (71) is arranged at the top edge of the filter basket (7), handles (72) are arranged at the front end and the rear end of the inner side of the filter basket (7), and pull openings (73) are formed in the handles (72).
- 8. The numerical control center vacuum negative pressure chip removal device suitable for deep hole machining according to claim 6 is characterized in that a negative pressure guide pipe (91) is arranged at the top of the gas-liquid separator (9), the negative pressure guide pipe (91) is used for being connected with the air suction end of the negative pressure adsorption component (2), a first connecting cap (92) is arranged at the end part of the negative pressure guide pipe (91), a material receiving pipe (93) is arranged in the middle of the side surface of the gas-liquid separator (9), a second connecting cap (94) is arranged at the end part of the material receiving pipe (93), a one-way valve (95) is arranged at the bottom end of the gas-liquid separator (9), a material discharging pipe (96) is connected at the bottom end part of the one-way valve (95), a connecting pin (98) is arranged at the bottom of the gas-liquid separator (9), and a plurality of connecting holes (99) are formed in the connecting pin (98) and used for filtering the gas-liquid separator (9).
- 9. The numerical control center vacuum negative pressure chip removal device suitable for deep hole machining according to claim 1 is characterized in that hexagonal parts (101) are rotatably arranged at two ends of the flexible chip guide tube (10), rotary joints (102) are arranged at the ends of the hexagonal parts (101), the hexagonal parts (101) are matched with the rotary joints (102) and used for connecting the flexible chip guide tube (10) with a numerical control center and a gas-liquid separator (9), spiral guide protrusions (103) are arranged on the inner wall of the flexible chip guide tube (10), the spiral lift angle is 15-30 degrees, chips can be guided to flow orderly along the spiral direction, friction between the chips and the inner wall of a channel is reduced, adhesion accumulation of the chips is avoided, and the inner pipe diameter of the flexible chip guide tube (10) is gradually increased from an inlet end to an outlet end to form a gradual change channel.
- 10. A numerical control center vacuum negative pressure chip removal method suitable for deep hole machining, which uses the numerical control center vacuum negative pressure chip removal device suitable for deep hole machining according to any one of claims 1-9, and is characterized by comprising the following specific steps: s100, fixing a base (1) beside a numerical control center, fixing all parts of the whole chip removal device on the base (1), realizing complete assembly of the chip removal device, communicating a control box (4) with a control end of the numerical control center, and facilitating linkage control of the chip removal device; s200, connecting one end of the flexible chip guide tube (10) which is not connected with the gas-liquid separator (9) with a mounting hole (62) which is arranged on the numerical control center spindle and is communicated with the inner hole chip removal cutter, so as to ensure that negative pressure adsorption force directly acts on the inner hole chip removal cutter; S300, setting a vacuum degree preset range of a negative pressure adsorption assembly (2) through a control panel (42) on a control box (4), controlling a variable frequency vacuum pump (22) to start through the control box (4), gradually forming negative pressure in a negative pressure buffer tank (21), detecting the vacuum degree in the tank by a vacuum gauge (3) in real time, transmitting a detection signal to the control box (4), and regulating the rotating speed of the variable frequency vacuum pump (22) by the control box (4) to enable the negative pressure to be stable within the preset range; S400, starting a numerical control center main body, enabling an inner hole chip removal tool to conduct deep hole machining on hardware, enabling chips generated in the machining process to sequentially pass through an inner chip guide hole of the inner hole chip removal tool, a mounting hole (62) of a main shaft, a flexible chip guide pipe (10) and a gas-liquid separator (9) and be sucked into a filter box (6) under the action of negative pressure, enabling cutting fluid to enter the filter box (6) together with the chips, filtering the cutting fluid through a filter basket (7), enabling the cutting fluid to be deposited at the bottom of a collecting box, and enabling the chips to be intercepted on the filter basket (7); S500, in the machining process, the control box (4) adjusts the rotating speed of the variable-frequency vacuum pump (22) in real time according to machining parameters (aperture, hole depth and cutting speed) of the numerical control center and detection signals of the pressure sensor, when the machining of a large aperture, a deep hole or cutting amount is large, the rotating speed of the variable-frequency vacuum pump (22) is increased, the negative pressure is increased, the rapid discharge of chips is ensured, when the machining of a small aperture, a shallow hole or cutting amount is small, the rotating speed of the variable-frequency vacuum pump (22) is reduced, the negative pressure is reduced, the energy consumption is saved, and if the negative pressure exceeds a preset range, an alarm module sends out audible and visual alarm to remind workers of checking; S600, after machining is completed, the numerical control center main body is closed firstly, then the variable frequency vacuum pump (22) is closed, a drain pipe arranged at the bottom of the filter box (6) is opened, filtered cutting fluid is discharged for recycling, the filter basket (7) is drawn out, chips in the filter basket (7) are cleaned, whether the filter basket (7) is blocked or not is checked, cleaning or replacement is carried out if the filter basket is blocked, sealing conditions among all parts are checked, and sealing elements are replaced in time if the sealing fails, so that the sealing performance of the next machining is ensured.
Description
Numerical control center vacuum negative pressure chip removal device and method suitable for deep hole machining Technical Field The invention relates to the technical field of numerical control machining, in particular to a numerical control center vacuum negative pressure chip removal device and method suitable for deep hole machining. Background In the field of hardware processing, deep hole processing (usually, the ratio L/D of the depth of a finger hole to the aperture is more than or equal to 5) is a processing technology with higher technical difficulty, and is widely applied to the production of hardware products such as automobile parts, aerospace parts, dies, hydraulic elements and the like, and the processing quality of the processing technology directly influences the performance and the service life of the products. In the hardware deep hole machining process, a machining tool penetrates into a workpiece, a chip containing space is narrow, a chip removing channel is long and tortuous, chip discharging difficulty is extremely high, and the quality of a chip removing effect directly determines the accuracy, efficiency and tool loss of deep hole machining, so that the method is one of core bottlenecks for limiting hardware deep hole machining quality improvement. At present, when the existing numerical control center is used for processing a hardware deep hole, the common chip removal mode mainly comprises three modes of gravity chip removal, high-pressure liquid chip removal and common negative pressure chip removal. The gravity chip removal mode is simple in structure and low in cost, is only suitable for shallow hole machining, is suitable for deep hole machining, is high in hardness due to the fact that chip removal channels are long, the self gravity of chips is limited, alloy structural steel such as 45# steel, 40Cr and 20CrMnTi which are commonly used in hardware machining is high in hardness, iron chips are strong in toughness in the cutting process, are easy to form a winding shape or a block shape, are extremely easy to pile up and block in the chip removal channels, chip removal is incomplete, residual chips can be severely rubbed with a cutter and a hole wall, the hole wall can be scratched, machining precision is reduced (the dimensional tolerance requirement of IT6-IT7 level cannot be met), cutter abrasion is further increased, cutter breakage is even caused, workpieces are scrapped, and production efficiency is seriously affected. The high-pressure liquid chip removal mode is characterized in that chips are flushed out of a chip removal channel through the high-pressure cutting liquid, the chip removal efficiency is relatively high, a high-pressure hydraulic system is additionally arranged, the equipment input cost is high, the use amount of the high-pressure cutting liquid is large, the production cost is increased, the waste of the cutting liquid and the pollution to the environment can be caused, meanwhile, the high-pressure liquid easily permeates into a main shaft, the sealing structure and the bearing part of the main shaft are damaged, the service life of a numerical control center is shortened, and small chips are difficult to thoroughly flush out by the high-pressure liquid, so that the problem of chip removal residue still exists. The common negative pressure chip removal mode can solve the problems to a certain extent, but the conventional common negative pressure chip removal device has the defects that firstly, a negative pressure generation mechanism adopts a vacuum pump with fixed rotating speed, negative pressure cannot be adjusted in real time according to working conditions such as aperture, hole depth and cutting amount of hardware deep hole machining, when large aperture and deep hole are machined, the negative pressure is insufficient, chips are not smoothly discharged, chip removal channels are easy to block, when small aperture and shallow hole are machined, the negative pressure is too large, energy consumption is increased, workpieces are possibly adsorbed and deformed, machining accuracy is affected, secondly, the chip removal channels are unreasonable in design, inner wall friction resistance is large, chips are easily attached to the inner wall of the channels, particularly aluminum chips, copper chips and the like with high viscosity, chip removal channels are extremely easy to block, the chip removal channels of the conventional device are of fixed structures, machining tools with different apertures and numerical control centers with different specifications cannot be adapted, thirdly, the chips and the cutting fluids cannot be effectively separated, and the collected chips carry a large amount of cutting fluids, are inconvenient to clean, waste is caused, and subsequent treatment cost is increased. In view of the above, there is a need in the market to develop a vacuum negative pressure chip removal device and method that has thorough chip removal, s