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CN-122007986-A - Hemispherical harmonic oscillator polishing device and hemispherical harmonic oscillator polishing method

CN122007986ACN 122007986 ACN122007986 ACN 122007986ACN-122007986-A

Abstract

The invention provides a hemispherical resonator polishing device and a hemispherical resonator polishing method, wherein the device ensures the clamping precision of a resonator through the cooperation of a main shaft component and a measuring system, the measuring system can measure parameters of the hemispherical resonator on line, and the spherical surface and the lip edge magnetorheological polishing of the hemispherical resonator can be controllably realized through a lip edge polishing mechanism and an inner and outer spherical surface polishing mechanism, so that the roughness and the surface quality of the hemispherical resonator are greatly improved, the comprehensive performance of the resonator is improved, the energy loss of the resonator is reduced, and the technical support is provided for the improvement of the performance of the hemispherical resonator gyroscope. By applying the technical scheme of the invention, the technical problem that the prior art cannot effectively improve the roughness and the surface morphology of the lip edge and the spherical surface of the hemispherical resonator can be solved.

Inventors

  • ZHANG YUHANG
  • XU HAIGANG
  • WANG BAOJUN
  • ZHANG CHUANZHONG
  • ZHU YI

Assignees

  • 北京自动化控制设备研究所

Dates

Publication Date
20260512
Application Date
20241111

Claims (10)

  1. 1. The hemispherical resonator polishing device is characterized by comprising an equipment base (10), an ultra-clean protection system (20), a main shaft assembly (30), a measuring system (40), a lip edge polishing mechanism (50), an inner and outer spherical polishing mechanism (60), a polishing system lifting mechanism, a polishing system translation mechanism and a magnetic fluid circulating and filtering system (80); The equipment base (10) comprises a box body (11) and a workbench, wherein the workbench, a main shaft assembly (30), a measuring system (40), a lip edge polishing mechanism (50), an inner and outer spherical polishing mechanism (60), a polishing system lifting mechanism, a polishing system translation mechanism and a magnetic fluid circulating and filtering system (80) are positioned in the box body (11); the ultra-clean protection system (20) is used for purifying the working environment inside the box body (11); the spindle assembly (30) is used for clamping the hemispherical harmonic oscillator and realizing the installation and positioning of the hemispherical harmonic oscillator; The measuring system (40) is positioned on the workbench and is used for measuring the rotation radial runout of the hemispherical harmonic oscillator clamped by the spindle assembly (30), the end surface runout of the lip edge and the internal and external spherical parameters; the lip polishing mechanism (50) is fixed on the lifting mechanism of the polishing system and the translation mechanism (70) of the polishing system, and the lip polishing mechanism (50) is used for polishing the lip; the inner and outer spherical polishing mechanism (60) is rotatably connected with the lifting and shifting mechanism of the polishing system, and the inner and outer spherical polishing mechanism (60) respectively uses an inner spherical magnetic head (61) and an outer spherical magnetic head (62) to realize magnetorheological spherical polishing of the inner and outer spherical surfaces of the hemispherical resonator; the polishing system lifting mechanism and the polishing system translation mechanism (70) are used for realizing the position adjustment of the lip edge polishing mechanism (50) and the inner and outer spherical polishing mechanism (60); the magnetic fluid circulating and filtering system (80) is fixed on the workbench and is used for continuously supplying the magnetorheological polishing liquid.
  2. 2. The hemispherical resonator polishing device according to claim 1, wherein the measuring system (40) comprises an R-axis sensor (41), a horizontal arm (42), a stand column (43) and a measuring needle, the measuring needle and the R-axis sensor (41) are mounted on the front section of the horizontal arm (42), the horizontal arm (42) is connected with the stand column (43), and the stand column (43) is fixed on the workbench.
  3. 3. The hemispherical resonator polishing device according to claim 1, wherein the spindle assembly (30) comprises an air floatation spindle and a fixture, the air floatation spindle is connected with an air supply pipeline below a table surface of the table through a hole reserved in the table, and the fixture is responsible for clamping the hemispherical resonator and placing the hemispherical resonator in a preset position.
  4. 4. The hemispherical resonator polishing device according to claim 1, wherein the lip polishing mechanism (50) comprises a lip head (51), a lip head driving motor (52), a driving shaft system (53), a lip head translation motor (54), an X-adjustment translation sliding table (55), a cam mechanism (56) and a miniature precise linear guide rail (57), and the lip head grinding motion is driven by the lip head driving motor (52) and the lip head translation motor (54) drives the lip head to reciprocate along a linear feed.
  5. 5. The hemispherical resonator polishing device according to claim 1, wherein the inner and outer spherical polishing mechanisms (60) comprise inner spherical magnetic heads (61), outer spherical magnetic heads (62), spherical shafts, magnetic head driving servo motors (63) and XY precision sliding tables (64), the spherical pendulum shafts are driven by the servo motors to move up and down, the spherical pendulum shafts swing around the spherical centers to jointly complete spherical generation with the spindle assembly (30), the magnetic head mechanisms are arranged on the spherical pendulum shafts and swing along with the pendulum shafts, the magnetic head mechanisms comprise magnetic head driving servo motors (63), inner spherical magnetic heads (61) and outer spherical magnetic heads (62), and the inner and outer magnetic heads are respectively arranged on corresponding magnetic head servo motors to rotate at high speed to drive magnetorheological polishing liquid to sweep across the hemispherical resonator spheres to form magnetorheological ribbons to complete magnetorheological spherical polishing.
  6. 6. Hemispherical resonator polishing device according to claim 1, characterized in that the inner and outer spherical polishing mechanism (60) is connected to the polishing system lifting mechanism and the polishing system translation mechanism (70) by means of crossed roller bearings.
  7. 7. The hemispherical resonator polishing device according to claim 1, wherein the lifting mechanism of the polishing system and the translation mechanism of the polishing system comprise a linear guide rail, a grating ruler and a lifting translation servo motor, the grating ruler is directly fixed on the linear guide rail through a mounting frame, and the servo motor is connected with the linear guide rail through a coupler.
  8. 8. Hemispherical resonator polishing device according to claim 1, characterized in that the hemispherical resonator polishing device further comprises a control system (90), the control system (90) being connected to the housing (11) for setting parameters of the spindle assembly (30), the lip polishing mechanism (50) and the inner and outer sphere polishing mechanism (60), and collecting, analyzing and processing data.
  9. 9. A hemispherical resonator polishing method, characterized in that the hemispherical resonator polishing method adopts the hemispherical resonator polishing device according to any one of claims 1 to 8 to realize hemispherical resonator spherical magnetorheological polishing, and specifically comprises the following steps: 1) Operating the polishing apparatus in a manual mode to move the magnetic head to a spherical machining position; 2) Adjusting a swing angle sliding table of an outer spherical surface in the spherical polishing mechanical module, enabling the end face of an outer magnetic head motor to be parallel to the end face of the rotary sliding table, adjusting an XY sliding table on the rotary sliding table, enabling the outer magnetic head to be slowly close to the outer spherical surface of the vibrator, enabling the X direction of the sliding table to fall back by 0.5mm after the outer magnetic head contacts with the outer spherical surface of the vibrator, swinging a hand wheel change-over switch to a 4-axis in a hand wheel mode, rotating a hand wheel rocker, enabling the outer magnetic head not to interfere with the spherical surface of the vibrator, and completing the outer spherical surface adjustment; 3) When the end face of the motor of the inner magnetic head is regulated to be parallel to the table top, an XY slipway connected with the inner magnetic head is regulated, when the inner magnetic head is contacted with the spherical surface, the slipway is retracted by 0.5mm in the X direction, in a hand wheel mode, a hand wheel change-over switch is swung to 4 axes, a hand wheel rocker is rotated, the inner magnetic head cannot interfere with the spherical surface of the vibrator, and then the regulation of the inner spherical surface is completed; 4) Adjusting an inlet and outlet pipeline of a pump system, arranging a short pipe which is a magnetorheological fluid outflow pipeline above a vibrator part and provides magnetorheological fluid for a polishing system, arranging a long pipe which is a magnetorheological fluid return pipe at the bottom of a harmonic oscillator above a main shaft, and pumping the magnetorheological fluid at the bottom of a turntable back into the pump system to form a closed loop; 5) Setting processing time, grinding head rotating speed direction, flow of a pump system and a time delay system in parameter setting of an operation interface; 6) In the spherical mode, starting an automatic running polishing program; 7) After polishing, in a manual mode, when the end face of the motor of the inner magnetic head is parallel to a marble Dan Pingtai, an XY slipway of the inner spherical surface is regulated, so that the inner magnetic head is far away from the spherical surface of the vibrator, and the fact that the 4-axis swing does not influence the vibrator in a hand wheel mode is ensured; 8) In a manual mode, the Z axis is restored to a safe position, magnetic powder particles adsorbed on the grinding head are removed, and the Y axis is regulated to enable the polishing equipment to restore to the safe position; 9) Under a manual mode, independently operating a second pump, and pumping the magnetorheological fluid remained in the turntable back to the pump system; 10 A manual valve in the pump system to a purge position; 11 In a spherical mode, a cleaning module in the system is operated to flush the polished harmonic oscillator; 12 Under manual mode, independently operating the second pump to pump the residual cleaning solution in the turntable into the waste liquid container; 13 Moving the drying lamp to the upper part of the harmonic oscillator, and drying the surface of the harmonic oscillator.
  10. 10. A hemispherical resonator polishing method, characterized in that the hemispherical resonator polishing method adopts the hemispherical resonator polishing device according to any one of claims 1 to 8 to realize the magnetorheological polishing of the lip edge of the hemispherical resonator, and specifically comprises the following steps: 1) Assembling a hemispherical resonator on a hemispherical resonator fixture of a cylindricity instrument spindle; 2) Moving a cylindricity instrument R shaft, moving to the vicinity of a vibrator support column, and aligning and leveling the harmonic oscillator; 3) Measuring original data of roundness, coaxiality, flatness and perpendicularity of the inner spherical surface and the outer spherical surface of the harmonic oscillator; 4) Restoring the Z axis and the R axis of the cylindricity instrument to safe positions; 5) In a manual mode, operating the inner and outer sphere polishing mechanisms to move the magnetic head to a lip processing position; 6) Adjusting a sliding table in the Z-axis direction in the end face polishing mechanical module, enabling a grinding head of the end face flat grinding to just contact the end face of the lip edge, and setting pre-pressure by adjusting the distance between the grinding head and the lip edge through the direction sliding table; 7) Adjusting an inlet and outlet pipeline of a pump system, arranging a short pipe which is a magnetorheological fluid outflow pipeline above a vibrator part, providing magnetorheological fluid for a polishing device, arranging a long pipe which is a magnetorheological fluid return pipe at the bottom of a harmonic oscillator above a main shaft, and pumping the magnetorheological fluid at the bottom of a turntable back into the pump system to form a closed loop; 8) Setting processing time, rotating speed direction of a grinding head, flow of a pump system and a time delay system in parameter setting of an operation interface of a control system; 9) In the lip mode, starting an automatic running polishing program; 10 After finishing polishing, adjusting a direction sliding table in the end face module to enable the grinding head to be far away from the lip edge position of the harmonic oscillator; 11 Under the manual mode, the Z axis is restored to the safe position, magnetic powder particles adsorbed on the grinding head are removed, and the Y axis is regulated to enable the polishing equipment to restore to the safe position; 12 Under manual mode, independently operating the second pump, and pumping the magnetorheological fluid remained in the turntable back to the pump system; 13 A manual valve in the pump system to a purge position; 14 In the lip edge mode, a cleaning module in the system is operated to flush the polished harmonic oscillator; 15 Under manual mode, independently operating the second pump to pump the residual cleaning solution in the turntable into the waste liquid container; 16 Moving the drying lamp to the position above the harmonic oscillator, and drying the surface of the harmonic oscillator; 17 After the machining is finished, the main shaft is ensured to stop rotating, a measuring program in a measuring system is operated, and flatness and verticality are measured.

Description

Hemispherical harmonic oscillator polishing device and hemispherical harmonic oscillator polishing method Technical Field The invention relates to the technical field of harmonic oscillator manufacturing, in particular to a hemispherical harmonic oscillator polishing device and a hemispherical harmonic oscillator polishing method. Background Hemispherical resonator gyroscopes have received attention in recent years due to their remarkable advantages of high precision, small volume, low cost, etc. The hemispherical resonator gyro is focused on and successfully and widely applied in the technical field of domestic and foreign inertia, especially in the fields of space scientific exploration, stable attitude and steady state of satellites, remote missile guidance, deep sea submarine navigation and the like, which is mainly due to the performance optimization of the hemispherical resonator, isotropic materials are the basis of high-quality hemispherical resonators, and the processing of the hemispherical resonator with a high-precision spherical shell structure is the core of the technology. The hemispherical resonator is used as a core sensitive component of the hemispherical resonator gyroscope and is formed by precisely machining quartz glass, the surface roughness of the resonator has a great influence on the performance of the shell vibrating gyroscope, a method for improving the surface quality and the roughness is researched, and the influence of the surface morphology of the resonator is analyzed, so that the method has great significance for improving the performance of the gyroscope. As an important component of the harmonic oscillator, the production of spherical surfaces and lips and the research on polishing methods have been largely carried out. Among them are typically plastic grinding, chemical polishing, float polishing, elastic shot processing, particle beam polishing jet polishing, and the like. However, these processing methods have disadvantages such as low polishing efficiency, easy generation of a large subsurface damage layer, difficult control of polishing, and easy reduction of verticality, flatness, roughness of the spherical surface, etc. of the lip edge of the resonator. A few of the techniques use a magnetic fluid polishing method, but the magnetic head structure is only suitable for polishing the spherical surface of the harmonic oscillator. Under the condition of ensuring the related parameters of verticality, flatness, coaxiality, roundness and the like of the harmonic oscillator, the improvement of the roughness and the surface morphology of the lip edge and the spherical surface of the harmonic oscillator still needs to be researched. The verticality, flatness, coaxiality and roundness of the lip edge of the hemispherical resonator can greatly influence the precision of the hemispherical resonator, but in the prior art, an online measuring device of the hemispherical resonator is not provided. Disclosure of Invention The present invention aims to solve at least one of the technical problems existing in the prior art. According to one aspect of the invention, a hemispherical resonator polishing device is provided, the hemispherical resonator polishing device comprises a device base, an ultra-clean protection system, a spindle assembly, a measurement system, a lip edge grinding mechanism, an inner and outer spherical polishing mechanism, a polishing system lifting mechanism and a polishing system translation mechanism and a magnetic fluid circulating filtration system, the device base comprises a box body and a workbench, the spindle assembly, the measurement system, the lip edge polishing mechanism, the inner and outer spherical polishing mechanism, the polishing system lifting mechanism and the polishing system translation mechanism and the magnetic fluid circulating filtration system are located in the box body, the ultra-clean protection system is used for realizing the purification of the working environment in the box body, the spindle assembly is used for clamping the hemispherical resonator and realizing the installation and positioning of the hemispherical resonator, the measurement system is located on the workbench and is used for measuring the radial runout of the hemispherical resonator clamped by the spindle assembly and the end runout of the lip edge and the inner and the outer spherical parameters of the magnetic fluid circulating filtration system, the lip edge polishing mechanism is fixed on the polishing system lifting mechanism and the polishing system translation mechanism, the lip edge polishing mechanism is used for realizing the polishing of the lip edge, the inner and outer spherical polishing mechanism and the polishing system translation mechanism is connected with the polishing system lifting mechanism and the polishing system translation mechanism in a rotatable mode, the spherical surface lifting mechanism and the polishing system translation mechan