CN-122007990-A - Polishing path control method, readable storage medium, and polishing apparatus

CN122007990ACN 122007990 ACN122007990 ACN 122007990ACN-122007990-A

Abstract

The application provides a polishing path control method which is applied to polishing equipment, wherein the polishing equipment comprises a grinding head, the grinding head is used for mounting consumable materials, the grinding head is provided with a mounting surface which is in direct contact with the consumable materials, the surface of the consumable materials, which is in direct contact with a workpiece, is a working surface, polishing parameters are obtained based on an initial polishing scheme, a first polishing path, a second polishing path and a blank path are obtained according to the polishing parameters, a distance d is reserved between the first polishing path and the second polishing path, a target polishing scheme is generated according to the distance d, the size of the mounting surface and the size of the working surface, polishing scheme modification information is output according to the blank path, and the grinding head and the consumable materials are driven to polish the workpiece based on the target polishing scheme. The application also provides a readable storage medium and a polishing apparatus.

Inventors

ZHOU BING
Liao Qianshen
YUE WEILING
ZHANG NENGWEI
ZHANG SAN
HUANG MENGSHAN
LI LIN
ZHANG DAN
ZENG TAO
ZHOU JING
YAN HONGQIN

Assignees

鸿富锦精密电子（成都）有限公司

Dates

Publication Date: 20260512
Application Date: 20260129

Claims (10)

1. A polishing path control method, characterized by being applied to a polishing apparatus including a grinding head for mounting a consumable, the grinding head having a mounting surface that directly contacts the consumable, the consumable including a working surface for directly contacting a workpiece; The polishing path control method includes: acquiring polishing parameters based on an initial polishing scheme; acquiring a first polishing path, a second polishing path and an idle stroke path according to the polishing parameters, wherein a distance d is reserved between the first polishing path and the second polishing path; Generating a target polishing scheme according to the distance d, the size of the mounting surface and the size of the working surface, and outputting polishing scheme modification information according to the idle stroke path, and The grinding head and the consumable are driven to polish a workpiece based on the target polishing scheme.
2. The polishing path control method according to claim 1, wherein the step of acquiring the first polishing path and the second polishing path based on the polishing parameters comprises calculating at least the first polishing path and the second polishing path spaced apart from each other based on the initial polishing scheme when the initial polishing scheme is determined to be a planar movement based on the polishing parameters.
3. The method of claim 2, wherein the polishing parameters include polishing point coordinates and rotation parameters of the polishing head, and wherein the step of determining that the initial polishing recipe is a planar movement based on the polishing parameters includes determining that the polishing head is moving along a plane when a portion of coordinate values in the polishing point coordinates are constant and the rotation parameters are constant.
4. The polishing path control method according to claim 1, wherein the step of generating a target polishing scheme based on the pitch d, the mounting surface size, and the size of the working surface, comprises: Generating a preset numerical range according to the size of the installation surface and the size of the working surface; Generating a target polishing scheme consistent with the initial polishing scheme when the distance d is within the preset numerical range, and And when the distance d is out of the preset numerical range, the position of the first polishing path and/or the second polishing path is moved so as to generate a target polishing scheme different from the initial polishing scheme.
5. The polishing path control method according to claim 4, wherein the installation surface and the working surface are both circular, and the preset numerical range is r+r to 2R, where R > R, R is a diameter of the working surface, and R is a diameter of the installation surface.
6. The polishing path control method according to claim 4, wherein the step of moving the position of the first polishing path and/or the second polishing path comprises translating the position of the first polishing path and/or the second polishing path in a linear direction.
7. The polishing path control method according to any one of claims 1 to 6, wherein the first polishing path and the second polishing path are straight paths.
8. The polishing path control method according to any one of claims 1 to 6, wherein the first polishing path and the second polishing path are parallel to each other.
9. A readable storage medium, characterized in that a computer program is stored, which, when read, implements the steps of the polishing path control method according to any one of claims 1 to 8.
10. A polishing apparatus, comprising: A control device including a memory and a controller electrically connected to each other, the memory storing a computer program, the controller being configured to read the computer program to cause the polishing apparatus to implement the steps of the polishing path control method according to any one of claims 1 to 8; A driving device electrically connected with the control device, and And the grinding head is used for fixing consumable materials and is controlled by the driving device to polish the workpiece based on the target polishing scheme.

Description

Polishing path control method, readable storage medium, and polishing apparatus Technical Field The present application relates to the field of polishing technology, and in particular, to a polishing path control method, a readable storage medium, and a polishing apparatus using the polishing path control method. Background With the continuous improvement of the surface quality requirements of the modern manufacturing industry on precise parts, the polishing process is increasingly important as a key link for realizing high smoothness. Traditional manipulator polishing mode can only handle single work piece once, and efficiency is limited and is difficult to ensure processing uniformity. The five-axis polishing machine is widely applied to the fields of aerospace, automobile manufacturing, medical appliances and the like by virtue of the multi-degree-of-freedom cooperative control capability. However, two key efficiency bottlenecks are found in the actual mass production environment: (1) The polishing path overlap redundancy, namely when a complex curved surface is processed, the polishing path generated by the traditional programming mode has an overlapping area of 10% -15%, so that the grinding head is repeatedly resided in the processed area; (2) And the idle stroke efficiency is lost, namely, the non-processing moving time of the equipment for returning to the standby position after finishing processing a single workpiece is 3-5% of the single-piece period, and the motion trail is not optimally calculated. Disclosure of Invention In view of the above, the present application provides a polishing path control method, a readable storage medium, and a polishing apparatus, so as to improve the working efficiency of the polishing apparatus. The first aspect of the application provides a polishing path control method which is applied to polishing equipment, the polishing equipment comprises a grinding head, the grinding head is used for installing consumable materials, the grinding head is provided with an installation surface which is in direct contact with the consumable materials, the surface which is in direct contact with a workpiece is a working surface, polishing parameters are acquired based on an initial polishing scheme, a first polishing path, a second polishing path and a blank path are acquired according to the polishing parameters, a distance d is reserved between the first polishing path and the second polishing path, a target polishing scheme is generated according to the distance d, the installation surface size and the size of the working surface, polishing scheme modification information is output according to the blank path, and the grinding head and the consumable materials are driven to polish the workpiece based on the target polishing scheme. A second aspect of the present application provides a readable storage medium storing a computer program which, when read, implements the steps of the polishing path control method as described above. The third aspect of the application provides polishing equipment, comprising a control device, a driving device and a grinding head, wherein the control device comprises a memory and a controller which are mutually and electrically connected, the memory stores a computer program, the controller is used for reading the computer program to enable the polishing equipment to realize the step of the polishing path control method, the driving device is electrically connected with the control device, and the grinding head is used for fixing consumable materials and is controlled by the driving device to polish workpieces based on the target polishing scheme. According to the polishing path control method, the readable storage medium and the polishing equipment, the first polishing path, the second polishing path and the idle stroke path can be obtained according to the polishing parameters in the initial polishing scheme, on one hand, the relation between the distance d between adjacent polishing paths and the sizes of the mounting surface and the working surface is adjusted to generate a target polishing scheme, on the other hand, the polishing scheme modification information is output according to the idle stroke path, and on the basis of guaranteeing the polishing quality, the polishing efficiency of the polishing equipment can be respectively improved from two aspects of reducing the overlapping of the polishing paths and reducing the idle stroke. Drawings Fig. 1 is a schematic block diagram of a polishing apparatus according to an embodiment of the present application. Fig. 2 is a schematic view of the structure of the grinding head of fig. 1 in a state in which consumable materials are mounted thereon. FIG. 3 is a flowchart illustrating steps of a polishing path control method according to an embodiment of the present application. Fig. 4 is a schematic diagram of the positional relationship among the grinding head, consumable, and polishing path. Fig.