Search

CN-122008042-A - Brake pad polishing device

CN122008042ACN 122008042 ACN122008042 ACN 122008042ACN-122008042-A

Abstract

The application discloses a brake pad polishing device which comprises a mounting frame, a transmission mechanism, a plurality of placement mechanisms and a polishing mechanism, wherein the placement mechanisms comprise mounting blocks, suckers and clamping assemblies, the mounting blocks are fixedly connected to the tops of the transmission mechanisms, the suckers are fixedly arranged on the tops of the transmission mechanisms, the clamping assemblies comprise pressure conduction units, trigger units, adjusting units and clamping units which are arranged in the mounting blocks, the trigger units are matched with guide structures on the mounting frame, the pressure conduction units are triggered to act when the placement mechanisms move along with the transmission mechanisms, the pressure conduction units transmit driving force to the adjusting units through fluid pressure, and the clamping units are provided with elastic buffer structures. Therefore, double limiting and flexible clamping of the brake pad can be realized, the clamping stability of the brake pad is effectively improved, and rigidity damage is reduced, so that the polishing quality and efficiency of the brake pad are effectively improved.

Inventors

  • YU YONGKANG
  • XIAO YANGJIANG

Assignees

  • 江苏长江新能源车业有限公司

Dates

Publication Date
20260512
Application Date
20260314

Claims (8)

  1. 1. A brake pad polishing device is characterized by comprising a mounting frame, a transmission mechanism, a polishing mechanism and a plurality of placing mechanisms, wherein, The transmission mechanism is arranged on the inner side of the mounting frame, and the plurality of placing mechanisms and the polishing mechanism are respectively arranged on the transmission mechanism; the placing mechanism comprises a mounting block, a sucker and a clamping component, wherein, The mounting block is fixedly connected to the top of the transmission mechanism; The top of the transmission mechanism is also fixedly provided with a sucker; the clamping component comprises a pressure conduction unit arranged in the mounting block, a triggering unit matched with the pressure conduction unit, an adjusting unit driven by the pressure conduction unit and a clamping unit connected with the adjusting unit, The triggering unit is matched with the guide structure on the mounting frame, and triggers the pressure conduction unit to act when the placing mechanism moves along with the transmission mechanism; the pressure conduction unit transmits driving force to the adjusting unit through fluid pressure, and the clamping unit is provided with an elastic buffer structure.
  2. 2. The brake pad polishing apparatus according to claim 1, wherein the polishing mechanism comprises a mounting case fixedly connected to the mounting frame and provided with a through groove, a polishing assembly disposed in the through groove for polishing the brake pad, and a dust removing assembly disposed inside the mounting case for collecting polishing dust, The dust removal assembly comprises a collecting unit for collecting chips, a negative pressure generating unit for generating negative pressure to adsorb the chips, a flow guiding unit for guiding the chips to flow to the collecting unit and a chip removing unit for discharging the collected chips, wherein the flow guiding unit is provided with a filtering structure for preventing the chips from entering the negative pressure generating unit.
  3. 3. The brake pad polishing apparatus according to claim 1, wherein the pressure conduction unit includes a storage chamber opened inside the installation block, the storage chamber being filled with hydraulic oil; The trigger unit comprises two trigger rods which are connected in the storage cavity in a sliding mode, one ends of the two trigger rods penetrate through the mounting blocks, and two guide blocks which are fixed on the inner wall of the mounting frame and located above the transmission mechanism.
  4. 4. The brake pad polishing apparatus according to claim 3, wherein the adjusting unit comprises two adjusting chambers, two adjusting plates and two adjusting rods, the two adjusting chambers are symmetrically arranged in the mounting block, the two adjusting plates are respectively and slidably connected in the two adjusting chambers, one ends of the two adjusting rods are respectively and fixedly connected to one sides of the two adjusting plates, which are far away from each other, and the other ends of the two adjusting rods respectively penetrate through the two adjusting chambers; the installation block is internally provided with a connecting channel, the storage cavity is communicated with a trigger zone formed on one side of the adjusting plate in the adjusting cavity through the connecting channel, and hydraulic oil can enter the trigger zone through the connecting channel and push the adjusting plate to move; and a second spring is fixedly connected between one side, far away from the adjusting rod, of the adjusting plate and the inner wall of the adjusting cavity.
  5. 5. The brake pad polishing apparatus according to claim 4, wherein the clamping unit comprises two connecting plates and two squeeze plates, the two connecting plates are respectively and fixedly connected to one ends of the two adjusting rods, which are far away from the adjusting plates, and the two squeeze plates are respectively and fixedly connected to one sides of the two connecting plates, which are close to each other; The elastic buffer structure comprises a connecting rod and a first spring, one end of the connecting rod is fixedly connected to one side, close to the connecting plate, of the extruding plate, the other end of the connecting rod penetrates through the connecting plate, and the first spring is sleeved on the connecting rod, and two ends of the first spring are fixedly connected with the extruding plate and the connecting plate respectively.
  6. 6. The brake pad polishing apparatus according to claim 2, wherein the polishing member is any one of a belt sander, a grinding wheel, and a polishing wheel, and the polishing member is detachably connected to the top of the inner wall of the through groove.
  7. 7. The brake pad polishing apparatus according to claim 2, wherein the flow guiding unit comprises a connecting cavity and an introduction channel, the connecting cavity is opened inside the installation shell, the inner wall of the connecting cavity is opened with introduction holes which are uniformly distributed and communicated with the through groove, and the introduction channel is opened at the top of the inner wall of the connecting cavity and communicated with the collecting unit; The filter structure is a filter screen fixedly connected to the inner wall of the guide channel between the negative pressure generating unit and the collecting unit, and the filter screen is detachably connected with the inner wall of the guide channel.
  8. 8. The brake pad polishing apparatus according to claim 7, wherein the collecting unit is a collecting chamber provided inside the mounting case; The negative pressure generating unit is a fan arranged in an installation cavity in the installation shell, and an exhaust groove communicated with the installation cavity is formed in the top of the installation shell; the chip removal unit comprises a rotating shaft, a plurality of division plates and a motor, wherein, The rotating shaft is rotatably connected to the inner wall of the collecting cavity; The plurality of partition plates are uniformly distributed and fixedly connected to the surface of the rotating shaft, and a separation part is formed between two adjacent partition plates; The motor is fixedly arranged on the mounting shell, and an output shaft of the motor is fixedly connected with one end of the rotating shaft; the inside of the installation shell and below the collecting cavity are also provided with a discharge groove communicated with the outside.

Description

Brake pad polishing device Technical Field The application relates to the technical field of polishing equipment, in particular to a brake pad polishing device. Background The brake pad is used as a core execution component of an automobile brake system, and in the production process, burrs, an oxide layer and uneven mold residues are easy to remain on the surface of the brake pad after the brake pad made of semi-metal, ceramic or organic polymer materials is processed by pressing, sintering or forming processes, and the defects can cause uneven stress when the brake pad is contacted with a brake disc, so that a polishing procedure is a key link of brake pad production. In the related art, a brake pad polishing device generally continuously conveys a brake pad to a position below a polishing unit (such as a grinder and a belt sander) through a transmission belt to finish surface polishing, and in order to prevent the brake pad from shifting or falling off in the transmission and polishing process, a pneumatic sucker is often relied on as a main fixing means, and the bottom surface of the brake pad is adsorbed by utilizing negative pressure to realize preliminary positioning. However, the clamping effect of the pneumatic sucker is sensitive to the cleanliness of the bottom surface of the brake pad, if dust, scraps or greasy dirt are remained on the bottom surface, the negative pressure sealing is easy to be insufficient, the unstable clamping condition occurs, meanwhile, in order to avoid the phenomenon that the workpiece is displaced due to insufficient clamping force under high-speed transmission, the conventional device is often required to control the transmission speed, the clamping stability is ensured through low-speed transmission, and the overall production efficiency is limited to a certain extent. In addition, some devices are for further promoting fixed effect, can additionally set up mechanical briquetting auxiliary clamping, but this kind of briquetting is mostly rigid structure, under polishing vibration effect, probably causes wearing and tearing to the brake block surface, especially to the brake block of brittle material such as pottery, exists the damage risk, influences the product percent of pass. Disclosure of Invention The present application aims to solve at least one of the technical problems in the related art to some extent. Therefore, an object of the present application is to provide a brake pad polishing device, which can realize dual limiting and flexible clamping of a brake pad, effectively improve the clamping stability of the brake pad, reduce the rigidity damage, and thereby effectively improve the quality and efficiency of brake pad polishing. In order to achieve the above object, a first aspect of the present application provides a brake pad polishing device, which comprises a mounting frame, a transmission mechanism, a polishing mechanism and a plurality of placement mechanisms, wherein the transmission mechanism is arranged on the inner side of the mounting frame, the placement mechanisms and the polishing mechanism are respectively arranged on the transmission mechanism, the placement mechanisms comprise mounting blocks, suckers and clamping components, the mounting blocks are fixedly connected to the top of the transmission mechanism, the suckers are fixedly arranged on the top of the transmission mechanism, the clamping components comprise pressure conduction units arranged in the mounting blocks, trigger units matched with the pressure conduction units, adjusting units driven by the pressure conduction units and clamping units connected to the adjusting units, the trigger units are matched with guide structures on the mounting frame, the pressure conduction units are triggered to act when the placement mechanisms move along with the transmission mechanism, the pressure conduction units transmit driving force to the adjusting units through fluid pressure, and the clamping units are provided with elastic buffer structures. The brake pad polishing device can realize double limiting and flexible clamping of the brake pad, effectively improve the clamping stability of the brake pad, reduce the rigidity damage and further effectively improve the polishing quality and efficiency of the brake pad. In addition, the brake pad polishing device provided by the application can also have the following additional technical characteristics: Further, polishing mechanism including fixed connection in on the mounting bracket and set up the installation shell of logical groove, set up in lead to the inslot and be used for carrying out polishing process's polishing subassembly and setting up in the installation shell inside and be used for collecting polishing piece's dust removal subassembly, wherein, dust removal subassembly is including the collection unit that is used for collecting piece, the negative pressure that produces the negative pressure in order to adsorb piece takes place