Search

CN-122008046-A - Grinding device for processing silicon crystal cylinder

CN122008046ACN 122008046 ACN122008046 ACN 122008046ACN-122008046-A

Abstract

The invention provides a grinding device for processing silicon crystal cylinders, which belongs to the technical field of silicon crystal cylinder processing and comprises a supporting platform, a first driving assembly, a clamping assembly, an arc limiting plate, a second driving assembly and a grinding assembly, wherein the grinding assembly is arranged on one side of the supporting platform, the clamping assembly is arranged on the side of a supporting supply table, the first driving assembly is arranged on the side wall of the supporting platform and is used for driving the clamping assembly to horizontally reciprocate, when the clamping assembly moves in one direction, a certain group of silicon crystal cylinders on the upper part of the supporting platform can be clamped, and when the clamping assembly moves in the other direction, the clamped silicon crystal cylinders can be driven to move over the grinding assembly and further ground by the grinding assembly. Compared with the prior art, the embodiment of the invention can realize continuous automatic grinding treatment of a plurality of silicon crystal cylinders and has the advantages of good grinding effect and high grinding efficiency.

Inventors

  • ZHOU JUN

Assignees

  • 淮安豪杰创芯半导体设备有限公司

Dates

Publication Date
20260512
Application Date
20260409

Claims (10)

  1. 1. The grinding device for processing the silicon crystal cylinder is characterized by comprising a supporting platform (10), a first driving component (20), a clamping component (30), an arc limiting plate (40), a second driving component (50) and a grinding component (60), The grinding component (60) is arranged at one side of the supporting platform (10), The clamping component (30) is arranged at the side of the support supply table (10), The first driving component (20) is arranged on the side wall of the supporting platform (10) and is used for driving the clamping component (30) to horizontally reciprocate, When the clamping component (30) moves towards one direction, a certain group of silicon crystal cylinders at the upper part of the supporting platform (10) can be clamped, When the clamping component (30) moves to the other direction, the clamped silicon crystal cylinder can be driven to move over the grinding component (60) so as to be ground by the grinding component (60), The arc limiting plate (40) is rotatably arranged at the upper part of the supporting platform (10) and is used for limiting a plurality of silicon crystal cylinders to be ground, The second driving assembly (50) is arranged at the side of the supporting platform (10) and used for driving the arc limiting plate (40) to rotate in a reciprocating mode.
  2. 2. The grinding device for processing silicon wafer cylinders according to claim 1, wherein the first driving assembly (20) comprises a first telescopic cylinder (201), a bracket plate (203) and a first piston rod (204), The first telescopic cylinders (201) are provided with two groups, the two groups of the first telescopic cylinders (201) are respectively and fixedly arranged on opposite side walls of the supporting platform (10), the first piston rods (204) are provided with two groups, the two groups of the first piston rods (204) are respectively arranged at the output ends of the two groups of the first telescopic cylinders (201), the supporting plates (203) are provided with two groups, the two groups of the supporting plates (203) are respectively arranged outside the two groups of the first piston rods (204), The clamping assembly (30) comprises a second telescopic cylinder (301), a second piston rod (302) and a clamping plate (304), The telescopic cylinder (301) of second is equipped with two sets of, two sets of telescopic cylinder (301) respectively fixed mounting is in two sets of on mounting panel (203) lateral wall, second piston rod (302) are equipped with two sets of, two sets of second piston rod (302) set up respectively in two sets of telescopic cylinder (301) output, splint (304) are equipped with two sets of, two sets of splint (304) are installed respectively in two sets of telescopic cylinder (301) of second piston rod (302) keep away from the one end of corresponding the telescopic cylinder of second, two sets of splint (304) relative distribution.
  3. 3. The grinding device for processing the silicon crystal cylinder according to claim 2, wherein a limit sleeve (104) is fixedly arranged on the side wall of the supporting platform (10), the limit sleeve (104) is movably sleeved outside the first piston rod (204), a pushing block (206) is fixedly arranged outside the first piston rod (204), The second drive assembly (50) includes a first linear rack bar (501) and an arcuate rack (502), The arc-shaped rack (502) is fixedly arranged on the arc-shaped outer wall of the arc-shaped limiting plate (40), the first linear rack rod (501) is arranged below the arc-shaped limiting plate (40) and meshed with the arc-shaped rack (502), a stop block (506) is fixedly arranged at the bottom of the first linear rack rod (501), a sliding sleeve (202) is sleeved outside the first piston rod (204) in a sliding mode, one end of the sliding sleeve (202) is connected with the stop block (506) through a first elastic piece (205), and the first elastic piece (205) is used for providing elastic support for the sliding sleeve (202).
  4. 4. A grinding device for silicon wafer cylinder processing according to claim 3, wherein the second driving assembly (50) further comprises a guide rod (503), a second elastic member (504) and a damping sleeve (505), Guide bar (503) fixed mounting is in on supporting platform (10) lateral wall, guide channel has been seted up to first straight rack pole (501) inside, guide bar (503) one end pass through the support with supporting platform (10) lateral wall fixed connection, the other end extend to inside the guide channel and with first straight rack pole (501) clearance fit, second elastic component (504) one end with the support links to each other, the other end with first straight rack pole (501) links to each other, is used for right first straight rack pole (501) provides elastic support, damping sleeve (505) are fixed to be set up guide bar (503) outside.
  5. 5. The grinding device for silicon crystal cylinder processing according to claim 1, wherein an arc-shaped groove (102) is formed in the upper edge of the supporting platform (10), the lower end of the arc-shaped limiting plate (40) extends into the arc-shaped groove (102), a sliding rail groove (103) is formed in the inner wall of the arc-shaped groove (102), and a sliding rail (401) matched with the sliding rail groove (103) is fixedly arranged on the arc-shaped outer wall of the arc-shaped limiting plate (40).
  6. 6. Grinding device for processing silicon wafer cylinders according to claim 1, characterized in that one end of the support platform (10) is provided with an upwardly extending support ramp (101).
  7. 7. The grinding device for processing silicon wafer cylinders according to claim 2, wherein the grinding assembly (60) comprises an annular grinding belt (601), a side support plate (602), a grinding motor and a belt roller, The side support plates (602) are provided with two groups, the two groups of side support plates (602) are distributed oppositely, the belt rollers are provided with two groups, the two groups of belt rollers are rotatably arranged between the two groups of side support plates (602), the annular grinding belt (601) is sleeved between the two groups of belt rollers, and the grinding motor is fixedly arranged on one group of side support plates (602) side walls and used for driving one group of belt rollers to rotate.
  8. 8. The grinding device for processing the silicon crystal cylinder according to claim 7, wherein the clamping plate (304) is in running fit with the second piston rod (302), a transmission gear (303) is fixedly arranged on one side of the clamping plate (304), and a second linear rack rod (603) capable of being meshed with the transmission gear (303) is fixedly arranged on the side supporting plate (602).
  9. 9. The grinding device for processing a silicon wafer cylinder according to claim 4, wherein the first elastic member (205) and the second elastic member (504) are springs or metal elastic sheets.
  10. 10. The grinding device for processing the silicon crystal cylinder according to claim 7, wherein the supporting platform (10), the supporting inclined table (10) and the bottom of the side supporting plate (602) are fixedly provided with supporting legs.

Description

Grinding device for processing silicon crystal cylinder Technical Field The invention belongs to the technical field of silicon crystal cylinder processing, and particularly relates to a grinding device for silicon crystal cylinder processing. Background Silicon wafers are round materials made of silicon single crystals, which are a base material in the manufacture of semiconductor devices, and crystal columns, which are one of the forms of such materials, are cylindrical silicon single crystals formed during crystal growth after melting silicon, which can be cut into thin sheets and then used for manufacturing various semiconductor devices. At present, when processing the silicon crystal cylinder, need to grind the circumference to the silicon crystal cylinder for the radial dimension of silicon crystal cylinder satisfies the requirement, among the prior art, when carrying out the grinding to a plurality of silicon crystal cylinders, need the manual work to put a certain silicon crystal cylinder on the centre gripping station, then utilize fixture to carry out the centre gripping to this silicon crystal cylinder, stability when guaranteeing silicon crystal cylinder grinding, later carry out the grinding to the circumference of this silicon crystal cylinder with the help of grinding mechanism, need manual release its clamping state after the current silicon crystal cylinder finishes grinding, then take current silicon crystal cylinder off the centre gripping station and change next silicon crystal cylinder, then carry out centre gripping and grinding to next silicon crystal cylinder, therefore, it is clear that the continuous automatic grinding of a plurality of silicon crystal cylinders can't be realized to prior art, there is the defect that silicon crystal cylinder grinding efficiency is low, need to improve. Disclosure of Invention Aiming at the defects of the prior art, the technical problem to be solved by the embodiment of the invention is to provide a grinding device for processing a silicon crystal cylinder. In order to solve the technical problems, the invention provides the following technical scheme: the grinding device for processing the silicon crystal cylinder comprises a supporting platform, a first driving component, a clamping component, an arc limiting plate, a second driving component and a grinding component, The grinding component is arranged at one side of the supporting platform, The clamping component is arranged at the side of the support supply table, The first driving component is arranged on the side wall of the supporting platform and is used for driving the clamping component to horizontally reciprocate, When the clamping component moves towards one direction, the clamping component can clamp a certain group of silicon crystal cylinders at the upper part of the supporting platform, When the clamping component moves to the other direction, the clamped silicon crystal cylinder can be driven to move over the grinding component so as to be ground by the grinding component, The arc limiting plate is rotatably arranged on the upper part of the supporting platform and is used for limiting a plurality of silicon crystal cylinders to be ground, The second driving assembly is arranged on the side of the supporting platform and used for driving the arc-shaped limiting plate to rotate in a reciprocating mode. As a further development of the invention, the first drive assembly comprises a first telescopic cylinder, a bracket plate and a first piston rod, The first telescopic cylinders are provided with two groups, the two groups of first telescopic cylinders are respectively and fixedly arranged on opposite side walls of the supporting platform, the first piston rods are provided with two groups, the two groups of first piston rods are respectively arranged at the output ends of the two groups of first telescopic cylinders, the support plates are provided with two groups, the two groups of support plates are respectively arranged outside the two groups of first piston rods, The clamping assembly comprises a second telescopic cylinder, a second piston rod and a clamping plate, The second telescopic cylinders are arranged in two groups, the two groups of the second telescopic cylinders are respectively and fixedly arranged on the side walls of the two groups of the support plates, the second piston rods are arranged in two groups, the second piston rods are respectively arranged at the two groups of the output ends of the second telescopic cylinders, the clamping plates are arranged in two groups, the two groups of the clamping plates are respectively arranged at the two groups of the clamping plates, the second piston rods are far away from one ends corresponding to the second telescopic cylinders, and the two groups of the clamping plates are distributed relatively. As a further improvement scheme of the invention, a limit sleeve is fixedly arranged on the side wall of the supporting platf