CN-122008057-A - Substrate polishing edge uniformity control with second fluid distribution

Abstract

Disclosed herein is a method and apparatus for dispensing a polishing liquid onto a polishing pad within a Chemical Mechanical Polishing (CMP) system. In particular, embodiments herein relate to a CMP system having a first fluid delivery arm and a second fluid delivery arm disposed above a polishing pad to dispense a liquid, such as a polishing liquid or water. The first fluid delivery arm is disposed to exceed at least 50% of the polishing pad radius and the second fluid delivery arm is disposed to exceed less than 50% of the polishing pad radius. The second fluid delivery arm is configured to dispense a polishing liquid or water onto the polishing pad to affect a polishing rate at the edge of the substrate.

Inventors

• HUANG HAOQUAN
• SONG XIKUI

Assignees

• 应用材料公司

Dates

Publication Date

20260512

Application Date

20210926

Priority Date

20200930

Claims (20)

1. 1. An apparatus for processing a substrate, comprising: a pad disposed on the table, wherein the pad has a pad radius and a central axis, the pad radius extending from the central axis; A carrier assembly configured to be disposed on a surface of the pad and having a carrier radius extending from an axis of rotation of the carrier assembly, wherein the axis of rotation is disposed at a first radial distance from the central axis; a first fluid delivery arm having a first nozzle, the first fluid delivery arm configured to provide a first fluid to a first point on the pad at a second radial distance from the central axis, and A second fluid delivery arm having a second nozzle, the second fluid delivery arm configured to provide a second fluid to a second point on the pad, the second point disposed at a third radial distance from the central axis, and A controller adapted to move the second fluid delivery arm to control a radial entry point of the second fluid under the carrier assembly.
2. 2. The apparatus of claim 1, further comprising A first actuator configured to translate the carrier assembly across the surface of the pad such that the first radial distance varies between a first radial value and a second radial value as the carrier assembly translates across the surface of the pad, and A second actuator configured to translate the second fluid transport arm over the surface of the pad such that the third radial distance varies between a third radial value and a fourth radial value as the second fluid transport arm translates over the surface of the pad, Wherein the fourth radial value is greater than the first radial value or the second radial value.
3. 3. The apparatus of claim 2, further comprising a metrology unit disposed within the platen, the metrology unit comprising a window disposed through the pad and a measurement unit, wherein the measurement unit is connected to the controller and configured to measure a polishing rate near an edge of a substrate.
4. 4. The apparatus of claim 1, wherein the second radial distance is less than the first radial distance and the third radial distance is greater than or equal to the second radial distance.
5. 5. The apparatus of claim 1, wherein the third radial distance is less than a fourth radial distance extending from the central axis to an outermost point on the carrier assembly.
6. 6. The apparatus of claim 1, wherein the first fluid delivery arm overlaps the entirety of the radial position occupied by the carrier assembly on the pad.
7. 7. The apparatus of claim 1, wherein the second fluid delivery arm extends over less than 60% of the pad radius.
8. 8. The apparatus of claim 7, wherein the second fluid delivery arm comprises: A fluid source, and A temperature control unit is fluidly coupled to the fluid source and the second fluid delivery arm.
9. 9. An apparatus for processing a substrate, comprising: A work table; a pad disposed on the table, the pad having a pad radius extending from a center axis; a carrier assembly disposed on the pad, the carrier assembly having a carrier radius extending from a rotational axis of the carrier assembly; a first fluid delivery arm extending over at least 50% of the radius of the pad and configured to provide a first fluid to a first point on the pad; A second fluid delivery arm extending less than 60% of the radius of the pad, the second fluid delivery arm configured to provide a second fluid to a second point on the pad, the second point disposed at a radial distance from the central axis, the radial distance being greater than about 40% of the radius of the pad, and A controller adapted to move the second fluid delivery arm to control a distance between a second point on the pad and the carrier assembly.
10. 10. The apparatus of claim 9, further comprising a metrology unit connected to the controller and configured to measure a polishing rate near an edge of a substrate.
11. 11. The apparatus of claim 9, wherein the second fluid delivery arm comprises: A bottom plate; A rotary actuator coupled to the base plate; an extension member extending over the pad, and A nozzle coupled to the extension member and disposed over the pad.
12. 12. The apparatus of claim 11, wherein the first fluid delivery arm overlaps the entirety of the radial position occupied by the carrier assembly on the pad.
13. 13. The apparatus of claim 11, further comprising: A fluid source, and A temperature control unit is fluidly coupled to the fluid source and the second fluid delivery arm.
14. 14. The apparatus of claim 9, wherein the load bearing assembly is disposed at least 10% of a total radius of the pad from a center of the pad and no more than 90% of the total radius of the pad from the center of the pad.
15. 15. A method of polishing a substrate, comprising: pushing the substrate against a surface of a pad of a polishing system using a carrier assembly, wherein the pad has a pad radius and a central axis, the pad radius extending from the central axis; translating the carrier assembly across the surface of the pad while rotating the carrier assembly about an axis of rotation; dispensing a first fluid from a first fluid delivery arm onto the pad at a first temperature and a first flow rate, wherein the first fluid is delivered to the pad at a second radial distance measured from the central axis; synchronizing movement of the carrier assembly with delivery of a second fluid from a second fluid delivery arm onto the pad, wherein: synchronizing the movement of the carrier assembly with the delivery of the second fluid includes synchronizing movement of the second fluid delivery arm with movement of the carrier assembly, The second fluid is delivered to the pad at a third radial distance measured from the central axis such that the third radial distance is greater than the second radial distance, an The first fluid and the second fluid are simultaneously delivered onto the pad; stopping the dispensing of the second fluid, and Stopping the dispensing of the first fluid.
16. 16. The method of claim 15, wherein the first fluid is different from the second fluid.
17. 17. The method of claim 15, wherein the third radial distance is less than a fourth radial distance extending from the central axis to an outermost point on the carrier assembly.
18. 18. The method of claim 15, wherein the temperature of the second fluid is controlled by a temperature control unit to adjust the polishing rate.
19. 19. The method of claim 15, wherein the second fluid is dispensed onto the pad at a radial location outward from an innermost edge of the carrier assembly relative to the central axis of the pad but inward from an outermost edge of the carrier assembly relative to the central axis of the pad.
20. 20. The method of claim 15, further comprising adjusting a temperature and a concentration of a combination of the first fluid and the second fluid by delivery of the second fluid onto the pad.

Description

Substrate polishing edge uniformity control with second fluid distribution The present application is a divisional application of the application patent application with the application number of "202111127684.8", 9/26/2021, and the application name of "substrate polishing edge uniformity control with second fluid distribution". Technical Field Embodiments of the present disclosure generally relate to Chemical Mechanical Polishing (CMP) systems for manufacturing semiconductor devices. In particular, embodiments herein relate to apparatus and methods for uniform removal of material at the edge of a substrate during a CMP process. Background Chemical Mechanical Polishing (CMP) is commonly used in the manufacture of semiconductor devices to planarize or polish a layer of material deposited on a substrate surface. In a typical CMP process, a substrate is held in a substrate carrier that presses the back surface of the substrate against a rotating polishing pad in the presence of a polishing liquid. Typically, the polishing solution comprises an aqueous solution of one or more chemical components and nano-sized abrasive particles suspended in the aqueous solution. Material is removed over the entire material layer surface of the substrate in contact with the polishing pad by a combination of chemical and mechanical activities provided by the polishing liquid and the relative motion of the substrate and the polishing pad. The slurry is typically dispensed onto the polishing pad from the first arm toward the center of the polishing pad such that the slurry moves toward the outer edge of the polishing pad as the polishing pad rotates. The polishing liquid typically accumulates near the edge of the substrate below the substrate carrier. Accumulation of the polishing liquid near the edge of the substrate causes non-uniformity in the substrate material removal profile and increases or decreases the removal rate near the edge. Even when the polishing liquid is uniformly dispersed under the substrate, the interaction between the substrate and the retaining ring of the substrate carrier during the CMP process may cause non-uniformity near the edge of the substrate. Accordingly, there is a need in the art for articles and related methods that address the above-described problems. Disclosure of Invention The present disclosure relates generally to a chemical mechanical polishing apparatus. More specifically, the present disclosure relates to a first fluid distribution arm and a second fluid distribution arm that distribute a polishing liquid. In one embodiment, an apparatus for processing a substrate is disclosed that includes a pad disposed on a platen, wherein the pad has a pad radius and a central axis, the pad radius extending from the central axis. The apparatus further includes a carrier assembly configured to be disposed on a surface of the pad and having a carrier radius extending from an axis of rotation of the carrier assembly, wherein the axis of rotation is disposed at a first radial distance from the central axis, a first fluid delivery arm having a first nozzle configured to provide the first fluid to a first point on the pad at a second radial distance from the central axis, and a second fluid delivery arm having a second nozzle configured to provide the second fluid to a second point on the pad, the second point disposed at a third radial distance from the central axis, wherein the second radial distance is less than the first radial distance and the third radial distance is greater than or equal to the second radial distance. In another embodiment of the present disclosure, an apparatus for processing a substrate includes a platen, a pad disposed on the platen, the pad having a pad radius extending from a central axis, a carrier assembly disposed on the pad, the carrier assembly having a carrier radius extending from a rotational axis of the carrier assembly, a first fluid delivery arm extending over at least 50% of the pad radius, and a second fluid delivery arm extending over less than 60% of the pad radius. The first fluid delivery arm is configured to provide a first fluid to a first point on the pad and the second fluid delivery arm is configured to provide a second fluid to a second point on the pad. The second point is disposed at a radial distance from the central axis that is greater than about 40% of the radius of the pad. In another embodiment of the present disclosure, a method of polishing a substrate includes pushing the substrate against a surface of a pad of a polishing system using a carrier assembly, wherein the pad has a pad radius and a central axis, the pad radius extending from the central axis. The carrier assembly translates across the surface of the pad while rotating the carrier assembly about the axis of rotation, wherein translating the carrier assembly across the surface of the pad causes a first radial distance measured from the center axis to the axis of rotation to vary betw