CN-122008065-A - Double-sided polishing device for workpiece and double-sided polishing method for workpiece

Abstract

The invention aims to provide a double-sided grinding device and a double-sided grinding method for a workpiece, which can improve the collapse of the peripheral shape of the workpiece. The temperature of the polishing slurry is individually adjusted for each of the plurality of slurry supply systems.

Inventors

• No moto

Assignees

• 胜高股份有限公司

Dates

Publication Date

20260512

Application Date

20250923

Priority Date

20241111

Claims (7)

1. 1. A double-sided grinding device for a workpiece, Comprises an upper platen and a lower platen, A plurality of slurry discharge holes are provided in one or both of the upper platen and the lower platen, It is characterized in that the method comprises the steps of, A plurality of slurry supply systems having a plurality of slurry discharge holes; The slurry supply systems are each provided with a separate slurry temperature adjustment device.
2. 2. The apparatus for double-sided lapping of a workpiece according to claim 1, wherein, The plurality of slurry discharge holes forming the plurality of slurry supply systems are arranged so as to be different in platen radius position or area.
3. 3. A double-sided lapping apparatus for workpieces as claimed in claim 1 or 2, wherein, A plurality of temperature measuring devices for measuring the temperature of the polishing surface of the workpiece are provided on one or both of the upper platen and the lower platen; The aforementioned plurality of temperature measurement devices are configured such that they differ in platen radius location or area.
4. 4. A double-sided grinding method for workpieces is characterized in that, The method includes a single temperature adjustment step of individually adjusting the temperature of the polishing slurry for each of a plurality of slurry supply systems formed by a plurality of slurry discharge holes provided in one or both of the upper platen and the lower platen.
5. 5. The method for double-sided lapping of a workpiece according to claim 4, wherein, The slurry discharge holes forming the slurry supply systems are arranged so as to be different in a radial position or area of the platen for each slurry supply system; In the individual temperature adjustment step, the temperature of the polishing slurry is adjusted so that the temperature of the polishing slurry discharged from the slurry discharge holes arranged at a position or a region closer to the center of the platen is lower.
6. 6. The method for double-sided lapping of a workpiece according to claim 5, wherein, A temperature measuring step of measuring the temperature of the polishing surface of the workpiece at different platen radius positions or areas; in the individual temperature adjustment step, the temperature of the polishing slurry is adjusted so that the temperature difference between the different platen radius positions or regions measured in the temperature measurement step approximates to a target value.
7. 7. The method for double-sided lapping of a workpiece according to claim 6, wherein, In the individual temperature adjustment step, the temperature of the polishing slurry is adjusted using an index Δt/Δd obtained by dividing a temperature difference Δt between the different platen radius positions measured in the temperature measurement step by a difference Δd between the distances between the upper platen and the lower platen.

Description

Double-sided polishing device for workpiece and double-sided polishing method for workpiece Technical Field The present invention relates to a double-sided polishing apparatus for a workpiece and a double-sided polishing method for a workpiece. Background Conventionally, in double-sided polishing of a workpiece such as a semiconductor wafer, it has been proposed to control the slurry temperature so that the temperature of the polished surface of the workpiece during polishing becomes a target temperature (see patent document 1). In the technique described in patent document 1, a temperature sensor is used to measure the temperature in the polishing chamber, and slurry whose temperature is adjusted by a single slurry temperature adjusting device is supplied to a plurality of slurry discharge holes provided in the upper platen. Prior art literature Patent literature Patent document 1, japanese patent No. 4275125. Disclosure of Invention Technical problem to be solved by the invention However, in the method of patent document 1, it is known that the slurry temperature distribution in the surface of the stage cannot be controlled, and therefore the wafer peripheral shape is liable to Roll-off (hereinafter referred to as "sagging"). That is, in the double-sided polishing, the polishing slurry easily flows to the outer peripheral side by centrifugal force. Therefore, the amount of the slurry supplied on the inner peripheral side becomes smaller and the frictional force becomes relatively larger, and the slurry on the outer peripheral side is relatively more easily cooled by the slurry. As a result, the temperature of the polishing surface on the inner peripheral side of the platen is relatively easily increased as compared with the outer peripheral side, and the polishing action on the inner peripheral side is relatively advantageous, resulting in the above-described sagging. Accordingly, an object of the present invention is to provide a double-sided polishing apparatus for a workpiece and a double-sided polishing method for a workpiece, which can improve sagging of the outer peripheral shape of the workpiece. Means for solving the technical problems The gist of the present invention is as follows. (1) A double-sided workpiece polishing device is provided with an upper platen and a lower platen, and a plurality of slurry discharge holes are provided in one or both of the upper platen and the lower platen. (2) The apparatus for double-sided polishing of a workpiece according to (1) above, wherein the plurality of slurry discharge holes forming the plurality of slurry supply systems are arranged so as to be different in platen radius position or area. (3) The apparatus for polishing both surfaces of a workpiece according to the above (1) or (2), wherein a plurality of temperature measuring devices for measuring the temperature of the polishing surface of the workpiece are provided on one or both of the upper platen and the lower platen, and the plurality of temperature measuring devices are disposed at different platen radius positions or areas. (4) A double-sided polishing method for a workpiece, characterized by comprising a single temperature adjustment step of individually adjusting the temperature of polishing slurry for each of a plurality of slurry supply systems each having a plurality of slurry discharge holes provided in one or both of an upper platen and a lower platen. (5) The method for double-sided polishing of a workpiece according to (4) above, wherein the plurality of slurry discharge holes forming the plurality of slurry supply systems are arranged so as to be different for each of the slurry supply systems at a position or region of the platen radius, and wherein in the individual temperature adjustment step, the temperature of the polishing slurry is adjusted so that the lower the temperature of the polishing slurry discharged from the slurry discharge holes arranged at a position or region closer to the platen center. (6) The method for double-sided polishing of a workpiece according to (5) above, further comprising a temperature measurement step of measuring the temperature of the polishing surface of the workpiece at different platen radius positions or areas, wherein in the individual temperature adjustment step, the temperature of the polishing slurry is adjusted so that the temperature difference between the different platen radius positions or areas measured in the temperature measurement step is close to a target value. (7) The method for double-sided polishing of a workpiece according to (6) above, wherein in the individual temperature adjustment step, the temperature of the polishing slurry is adjusted using an index Δt/Δd obtained by dividing a temperature difference Δt between the different platen radius positions measured in the temperature measurement step by a difference Δd between the platen distances of the upper platen and the lower platen. Effects of the invention According t