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CN-122008067-A - Device for reducing residual water on surface of cleaned silicon wafer and control method thereof

CN122008067ACN 122008067 ACN122008067 ACN 122008067ACN-122008067-A

Abstract

The invention relates to a device for reducing residual water on the surface of a cleaned silicon wafer and a control method thereof, belonging to the technical field of semiconductor silicon wafer processing, comprising a grinding rotary seat, wherein an upper frame is arranged on the grinding rotary seat, a grinding roller for processing the silicon wafer on the grinding rotary seat is arranged on the upper frame, the grinding machine is characterized in that a grinding table is arranged between the grinding roller and the grinding rotary seat, a grinding frame is arranged on the grinding roller, an adjusting swing arm for adjusting the height of the grinding frame is arranged between two ends of the grinding frame and the upper frame, and an air flow air knife assembly fixedly connected with the upper frame is arranged above the grinding frame. The air flow air knife assembly comprises a blowing pipe, a plurality of blowing nozzles communicated and fixed with the blowing pipe are arranged at the lower end of the blowing pipe, and a guide plate for adjusting the blowing angle of dry air is arranged below the blowing nozzles. The combined silicon wafer processing structure combining mechanical grinding, negative pressure liquid suction and airflow air knife drying solves the problem of liquid residue in the silicon wafer grinding processing process.

Inventors

  • SHI JIANQUN

Assignees

  • 杭州中欣晶圆半导体股份有限公司

Dates

Publication Date
20260512
Application Date
20260323

Claims (9)

  1. 1. The device for reducing residual water on the surface of the cleaned silicon wafer comprises a grinding rotary seat (7), wherein an upper frame (1) is arranged on the grinding rotary seat (7), a grinding roller (4) for processing the silicon wafer on the grinding rotary seat (7) is arranged on the upper frame (1), the device is characterized in that a grinding table (6) is arranged between the grinding roller (4) and the grinding rotary seat (7), a grinding frame (3) is arranged on the grinding roller (4), an adjusting swing arm (5) for adjusting the height of the grinding frame (3) is arranged between two ends of the grinding frame (3) and the upper frame (1), an air flow air knife assembly (2) fixedly connected with the upper frame (1) is arranged above the grinding frame (3), the air flow air knife assembly (2) comprises a blowing pipe (9), a plurality of blowing nozzles (16) which are fixedly communicated with the grinding pipe (9) are arranged at the lower end of the grinding roller, and a blowing guide plate (15) is arranged below the blowing nozzles (16).
  2. 2. The device for reducing residual water on the surface of the cleaned silicon wafer as set forth in claim 1, wherein the blow-drying pipe (9) is provided with an air flow cover (8) fixed with the upper frame (1), the rear end of the blow-drying pipe (9) is provided with an air source connecting pipe (11) penetrating through the air flow cover (8), and a plurality of air inlet connectors (10) are arranged between the air source connecting pipe (11) and the blow-drying pipe (9).
  3. 3. The device for reducing residual water on the surface of the cleaned silicon wafer as set forth in claim 2, wherein a rotating shaft (14) for driving the deflector (15) to adjust the angle is arranged between the deflector (15) and the air flow cover (8), a reciprocating motor (13) is arranged on one side of the rotating shaft (14), and a fixed disc (12) is arranged between the reciprocating motor (13) and the air flow cover (8).
  4. 4. The device for reducing residual water on the surface of the cleaned silicon wafer as set forth in claim 1, wherein the grinding table (6) comprises a silicon wafer tray (19), a placing groove (20) is formed in the silicon wafer tray (19), a negative pressure liquid suction component (17) is arranged on the periphery of the silicon wafer tray (19), and a liquid collecting ring groove (18) is formed between the negative pressure liquid suction component (17) and the silicon wafer tray (19).
  5. 5. The device for reducing residual water on the surface of the cleaned silicon wafer as set forth in claim 4, wherein the negative pressure liquid suction assembly (17) comprises a negative pressure ring pipe (22), a plurality of negative pressure suction nozzles (21) communicated with the liquid collecting ring groove (18) are arranged at the front end of the negative pressure ring pipe (22), a liquid collecting recovery pipe (24) is arranged at the rear end of the negative pressure ring pipe (22), and a negative pressure generator (23) is arranged between the negative pressure ring pipe (22) and the liquid collecting recovery pipe (24).
  6. 6. The control method of the device for reducing residual water on the surface of the silicon wafer after cleaning according to claim 5, comprising the following steps: Firstly, silicon wafers are loaded and positioned, and the silicon wafers to be processed are placed in a placing groove (20) of a silicon wafer tray (19) of a grinding table (6) to ensure that the silicon wafers are firmly positioned; Secondly, grinding and processing with cooling liquid, starting a grinding rotary seat (7) to drive a silicon wafer to rotate, cooling and lubricating a grinding area by using the cooling liquid, and accurately adjusting the height of a grinding frame (3) by adjusting a swing arm (5) to enable a grinding roller (4) to precisely grind the surface of the silicon wafer; The third step, the negative pressure liquid suction component (17) positioned at the periphery of the grinding table starts to work, the negative pressure generator (23) generates negative pressure, and the cooling liquid splashed or flowing to the edge of the silicon wafer is timely sucked into the liquid collecting ring groove (18) through the negative pressure suction nozzle (21) and is recovered through the liquid collecting recovery pipe (24) so as to prevent a large amount of cooling liquid from remaining on the back surface of the silicon wafer; Step four, preliminary draining and rotation are carried out after grinding, after grinding processing is finished, a grinding roller (4) is lifted, a grinding rotary seat (7) continues to rotate at a high speed, and most of the cooling liquid on the surface of the silicon wafer is thrown away by utilizing centrifugal force; Step five, a dynamic air knife sweeps, and after the silicon wafer is spin-dried or is static, an air flow air knife assembly (2) is started, an air source enters a blowing dry pipe (9) and blows dry air downwards through a plurality of blowing nozzles (16); The negative pressure suction nozzle (21) sucks the liquid gathered in the liquid collecting ring groove (18) rapidly, and the blown water is prevented from flowing back again or attaching to the back of the silicon wafer; and seventh, after the surface of the silicon wafer is confirmed to be dry and clean, stopping the air knife and rotating, and discharging.
  7. 7. The control method for the device for reducing residual water on the surface of the cleaned silicon wafer according to claim 6, wherein a rotating shaft (14) for driving the guide plate (15) to adjust the angle is arranged between the guide plate (15) and the air flow cover (8), a reciprocating motor (13) is arranged on one side of the rotating shaft (14), a fixed disc (12) is arranged between the reciprocating motor (13) and the air flow cover (8), the reciprocating motor (13) is controlled to drive the guide plate (15) to swing in a reciprocating manner through the rotating shaft (14), so that air flow of the air knife scans and sweeps in a certain angle, the dead angle of sweeping is effectively eliminated, and the uniformity and the efficiency of water removal are improved.
  8. 8. The method of claim 6, wherein the air supply pressure is adjusted to control the blowing speed and the air quantity, and the air supply is heated to accelerate the drying.
  9. 9. The method of claim 6, wherein the control system controls the grinding rotary base (7) to stop grinding, and then continuously rotates at 1000-3000 rpm for a certain time for 10-30 seconds to achieve preliminary spin-drying.

Description

Device for reducing residual water on surface of cleaned silicon wafer and control method thereof Technical Field The invention relates to the technical field of semiconductor silicon wafer processing, in particular to a device for reducing residual water on the surface of a cleaned silicon wafer and a control method thereof. Background In the manufacturing process of semiconductor silicon wafers, lapping (grinding) is an important process for thinning the thickness of the silicon wafer. In the actual processing process, a large amount of heat is generated due to high-speed friction between the grinding roller and the silicon wafer, and cooling and lubrication are required to be continuously performed by spraying cooling liquid. After the silicon wafer is processed by the grinding machine, the silicon wafer needs to be cleaned in a cleaning part, the silicon wafer slowly advances through a track of the cleaning part, then small openings formed in an upper stainless steel pipe and a lower stainless steel pipe are fixed at an outlet of the cleaning part for blowing, and the water on the surface of the silicon wafer is dried. Because the stainless steel tube is fixed at the outlet of the cleaning part of the grinding machine, the blowing angle is not easy to adjust, and a small amount of water remains on the surface of the silicon wafer. The silicon wafer with residual water is measured on a measuring machine, so that measurement errors are easily caused, and real data of the silicon wafer quality cannot be fed back well. However, existing grinding equipment and processes have the following significant problems: 1. The residual water on the surface is difficult to thoroughly remove, and a large amount of cooling liquid is adhered to the surface of the silicon wafer after the grinding processing is finished. Conventional removal methods typically rely solely on centrifugal force generated by high speed rotation to spin-dry the liquid. The mode has limited effect on removing the microscopic water film on the surface of the silicon wafer, and water marks or residual impurities are often left on the surface of the silicon wafer. 2. And the back surface pollution problem is that the cooling liquid is easy to splash or flow to the back surface of the silicon wafer along the edge in the grinding process. If an effective interception and recovery mechanism is lacking, the cooling liquid can be remained between the silicon wafer and the carrier, so that the back surface of the silicon wafer is polluted, and the yield of subsequent procedures is affected. 3. The dead angle exists in the drying of the air knife, namely, although part of equipment introduces the air knife for drying, the traditional fixed air knife has single air flow direction, is difficult to cover all areas on the surface of the silicon wafer, and easily has a blowing dead angle, so that partial areas remain moisture, and the drying uniformity is poor. Disclosure of Invention The invention mainly solves the defects in the prior art, and provides a device for reducing residual water on the surface of a cleaned silicon wafer and a control method thereof, which combine a composite silicon wafer processing structure of mechanical grinding, negative pressure liquid suction and airflow air knife drying, and solve the problem of liquid residue in the silicon wafer grinding processing process. The technical problems of the invention are mainly solved by the following technical proposal: The utility model provides a reduce device of washing back silicon chip surface residual water, includes the lapping rotary seat, the lapping rotary seat on be equipped with the frame, the frame of going up on be equipped with the lapping roller of processing the silicon chip on the lapping rotary seat, lapping roller and lapping rotary seat between be equipped with the lapping platform, the lapping roller on be equipped with the lapping frame, lapping frame both ends and last frame between be equipped with the regulation swing arm of adjusting the lapping frame height, lapping frame top be equipped with last frame fixed connection's air current air knife assembly. The air flow air knife assembly comprises a blowing pipe, a plurality of blowing nozzles communicated and fixed with the blowing pipe are arranged at the lower end of the blowing pipe, and a guide plate for adjusting the blowing angle of dry air is arranged below the blowing nozzles. Preferably, the air-drying pipe is provided with an air-flow cover shell fixed with the upper frame, the rear end of the air-drying pipe is provided with an air-source connecting pipe penetrating through the air-flow cover shell, and a plurality of air-inlet connectors are arranged between the air-source connecting pipe and the blow-drying pipe. Preferably, a rotating shaft for driving the guide plate to adjust the angle is arranged between the guide plate and the air flow housing, a reciprocating motor is arranged on one side of the rot