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CN-122008069-A - Polishing machine, polishing pad detection method, polishing pad detection device, polishing pad detection equipment, polishing pad detection product and polishing pad detection medium

CN122008069ACN 122008069 ACN122008069 ACN 122008069ACN-122008069-A

Abstract

The invention provides a polishing machine, a polishing pad detection method, a polishing pad detection device, detection equipment, a product and a medium, and belongs to the technical field of semiconductor manufacturing. The polishing machine comprises an upper fixed disc, a mechanical arm, a swing arm servo motor, an air cylinder, an upper fixed disc servo motor, a support, a plurality of industrial cameras and a drying mechanism, wherein the upper fixed disc is arranged on the upper fixed disc, the upper fixed disc is arranged at one end of the mechanical arm, the other end of the mechanical arm is connected with the swing arm servo motor, the swing arm servo motor is used for driving the mechanical arm to do rotary motion, the air cylinder and the upper fixed disc servo motor are arranged between the upper fixed disc and the mechanical arm, the air cylinder is used for driving the upper fixed disc to move in the vertical direction, the upper fixed disc servo motor is used for driving the upper fixed disc to do rotary motion, the support, the industrial cameras and the drying mechanism are arranged on the support, the drying mechanism is used for drying the upper polishing pad, and the industrial cameras are used for shooting the upper polishing pad so as to obtain a plurality of original images. The technical scheme of the invention can efficiently and accurately detect the abnormal condition of the polishing pad.

Inventors

  • YANG XINZHUO

Assignees

  • 西安奕斯伟材料科技股份有限公司
  • 西安奕斯伟硅片技术有限公司

Dates

Publication Date
20260512
Application Date
20260320

Claims (10)

  1. 1. The utility model provides a burnishing machine, its characterized in that includes upper fixed disk (1), be provided with on upper fixed disk (1) and polish pad (2), the burnishing machine still includes: The mechanical arm (3) and the swing arm servo motor (4), the upper fixed disc (1) is arranged at one end of the mechanical arm (3), the other end of the mechanical arm (3) is connected with the swing arm servo motor (4), and the swing arm servo motor (4) is used for driving the mechanical arm (3) to do rotary motion; The cylinder (5) and the upper fixed disc servo motor (6) are arranged between the upper fixed disc (1) and the mechanical arm (3), the cylinder (5) is used for driving the upper fixed disc (1) to move along the vertical direction, and the upper fixed disc servo motor (6) is used for driving the upper fixed disc (1) to do rotary motion; Support (7), a plurality of industry camera (8) and drying mechanism, drying mechanism with a plurality of industry camera (8) set up on support (7), drying mechanism is used for right go up polishing pad (2) dry operation, industry camera (8) are used for right go up polishing pad (2) shoot to obtain a plurality of primitive images, primitive image is used for the analysis go up polishing pad (2) are unusual, and a plurality of industry camera (8) are linear arrangement, and each the shooting region of industry camera (8) exists the overlap.
  2. 2. The polishing machine according to claim 1, wherein the drying mechanism comprises a plurality of air nozzles (9), each air nozzle (9) being fixed on a bracket (7) and being arranged at a distance from each industrial camera (8); wherein, the air blowing areas of the air nozzles (9) are provided with overlapping areas, and the degree of the included angle between the air blowing direction of the air nozzle (9) and the horizontal plane is between 25 degrees and 35 degrees.
  3. 3. The polisher according to claim 1, further comprising: the processor is used for obtaining a detection result corresponding to the upper polishing pad (2) according to the original image; The audible and visual alarm (10) is used for sending an alarm signal when the upper polishing pad (2) is abnormal; And the display screen (11) is used for displaying the detection result corresponding to the upper polishing pad (2) when the upper polishing pad (2) is abnormal.
  4. 4. A polishing pad inspection method applied to the polishing machine as claimed in any one of claims 1 to 3, comprising: After the polishing process of the silicon wafer (12) is finished, the control cylinder (5) drives the upper fixed disk (1) to rise to a first preset position; an upper fixed disc servo motor (6) is controlled to drive the upper fixed disc (1) to rotate for a preset time period; the control cylinder (5) drives the upper fixed disc (1) to ascend to a second preset position, and the second preset position is higher than the first preset position; controlling a swing arm servo motor (4) to drive the mechanical arm (3) to rotate to a third preset position, and controlling a drying mechanism to continuously dry the upper polishing pad (2) when the mechanical arm (3) starts to rotate; controlling the upper fixed disc servo motor (6) to drive the upper fixed disc (1) to rotate for one circle at a preset speed, and controlling the industrial camera (8) to shoot the upper polishing pad (2) at a preset frame rate in the process of rotating the upper fixed disc (1) to obtain a plurality of original images; and obtaining detection results corresponding to the upper polishing pad (2) according to the plurality of original images.
  5. 5. The polishing pad inspection method according to claim 4, wherein the obtaining the inspection result corresponding to the upper polishing pad (2) from the plurality of original images comprises: Preprocessing the plurality of original images to obtain target images corresponding to the original images; and respectively comparing and analyzing the target images with a reference image to obtain the detection result, wherein the reference image is an image obtained by image acquisition of the unused surface of the polishing pad in good condition.
  6. 6. The polishing pad inspection method according to claim 4, applied to the polishing machine according to claim 3, the method further comprising: In the case where the detection result indicates that there is abnormality in the upper polishing pad (2), at least one of the following is performed: controlling the audible and visual alarm (10) to send out an alarm signal; And a control display screen (11) displays the detection result corresponding to the upper polishing pad (2).
  7. 7. A polishing pad inspection apparatus, applied to the polishing machine as claimed in any one of claims 1 to 3, comprising: The first control module is used for controlling the cylinder (5) to drive the upper fixed disc (1) to rise to a first preset position after the polishing process of the silicon wafer (12) is finished; the second control module is used for controlling the upper fixed disc servo motor (6) to drive the upper fixed disc (1) to rotate for a preset time period; the third control module is used for controlling the air cylinder (5) to drive the upper fixed disc (1) to rise to a second preset position, and the second preset position is higher than the first preset position; the fourth control module is used for controlling the swing arm servo motor (4) to drive the mechanical arm (3) to rotate to a third preset position, and controlling the drying mechanism to continuously dry the upper polishing pad (2) when the mechanical arm (3) starts to rotate; The fifth control module is used for controlling the upper fixed disc servo motor (6) to drive the upper fixed disc (1) to rotate for one circle at a preset speed, and controlling the industrial camera (8) to shoot the upper polishing pad (2) at a preset frame rate in the process of rotating the upper fixed disc (1) so as to obtain a plurality of original images; and the first processing module is used for obtaining detection results corresponding to the upper polishing pad (2) according to the plurality of original images.
  8. 8. An inspection apparatus comprising a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the processor implements the polishing pad inspection method of any one of claims 4 to 6 when the computer program is executed by the processor.
  9. 9. A computer program product comprising computer instructions which, when executed by a processor, implement the steps of the polishing pad detection method according to any one of claims 4 to 6.
  10. 10. A readable storage medium having stored thereon a program or instructions which, when executed by a processor, implement the steps in the polishing pad detection method according to any one of claims 4 to 6.

Description

Polishing machine, polishing pad detection method, polishing pad detection device, polishing pad detection equipment, polishing pad detection product and polishing pad detection medium Technical Field The invention relates to the technical field of semiconductor manufacturing, in particular to a polishing machine, a polishing pad detection method, a polishing pad detection device, a polishing pad detection equipment, a polishing pad detection product and a polishing pad detection medium. Background In the field of semiconductor silicon wafer manufacturing, double-painting polishing (Double Side Polishing) of a silicon wafer is an important process for guaranteeing the surface flatness quality of the silicon wafer. In the polishing process, a polishing Pad (Pad) attached to the fixed disk is directly contacted with the surface of the silicon wafer, and the surface state of the polishing Pad has an important influence on the polishing effect of the silicon wafer. In the long-term use process of the polishing pad on the fixed disk, the defects such as polishing pad cracking (shown in figure 1), breakage (shown in figure 2) and the like can occur due to friction, abrasion, carrier burrs and the like, and if the defects are not found in time, the abnormal polishing pad is used for polishing, the quality problems such as surface scratch and flatness deterioration of the silicon wafer can be caused, and the performance and subsequent processing procedures of the silicon wafer are seriously affected. At present, the damage detection of the polishing pad on the fixed disk mainly depends on manual visual inspection, and the manual detection needs to be stopped, so that a large amount of time is occupied, the production efficiency is reduced, the precision of the manual detection is limited by the influence of factors such as experience and responsibility of personnel, and the like, and the conditions of missed detection and false detection are easy to occur. In addition, in the prior art, some automatic detection methods are also available, such as fixing a single camera on the periphery of the fixed disc, and shooting and detecting the polishing pad of the fixed disc, but because the fixed disc of the double-sided polishing machine has a large size, the single camera is difficult to cover the polishing pad on the whole surface, and detection dead areas exist, so that the detection effect is not ideal. In addition, polishing liquid and water used in the silicon wafer polishing process can be attached to the surface of a polishing pad after polishing is finished, and the residual polishing liquid and water are easy to drop on the surface of a camera along with the swinging or rotation of a fixed disc, so that the definition and detection precision of image capturing are affected. Therefore, there is a need for an efficient and accurate method for detecting anomalies in polishing pads that avoids the influence of water droplets on the camera. Disclosure of Invention The invention provides a polishing machine, a polishing pad detection method, a polishing pad detection device, a polishing pad detection equipment, a polishing pad detection product and a polishing pad detection medium, which can detect abnormal conditions of the polishing pad efficiently and accurately. In order to achieve the above purpose, the technical scheme adopted by the embodiment of the invention is as follows: The utility model provides a burnishing machine, includes the upper fixed disk, is provided with the polishing pad on the upper fixed disk, and the burnishing machine still includes: The upper fixed disc is arranged at one end of the mechanical arm, the other end of the mechanical arm is connected with the swing arm servo motor, and the swing arm servo motor is used for driving the mechanical arm to do rotary motion; The cylinder is used for driving the upper fixed disc to move along the vertical direction, and the upper fixed disc servo motor is used for driving the upper fixed disc to rotate; support, a plurality of industry camera and drying mechanism, drying mechanism and a plurality of industry camera set up on the support, and drying mechanism is used for carrying out dry operation to last polishing pad, and industry camera is used for taking a picture to last polishing pad to obtain a plurality of primitive images, primitive images are used for analyzing whether to go up polishing pad and have unusually, and a plurality of industry cameras are linear the arranging, and the shooting region of each industry camera exists the overlap. In some embodiments, the drying mechanism comprises a plurality of air nozzles, each air nozzle being fixed on the bracket and being spaced apart from each industrial camera; wherein, the overlapping area is arranged between the blowing areas of each air nozzle, and the degree of the included angle between the air blowing direction of each air nozzle and the horizontal plane is between 25 degrees and 35 de