CN-122008075-A - Wafer carrying disc angle adjusting device of thinning machine

Abstract

The invention discloses an angle adjusting device for a wafer carrying disc of a thinning machine, which comprises a fixed point and two adjusting points, wherein the fixed point is fixed in height, a height adjusting device is arranged in the adjusting points, the height adjusting device comprises an adjusting screw, an adjusting shaft, a speed reducer and an adjusting rod, the adjusting rod is connected with an input shaft of the speed reducer, an output shaft of the speed reducer is connected with the adjusting screw through a coupler, the adjusting screw is in threaded connection with the adjusting shaft, a key groove is formed in the adjusting shaft, a sliding key is arranged in the key groove and used for limiting the adjusting shaft to rotate, and the adjusting shaft only moves up and down. The invention realizes the angle adjustment of the wafer carrier disc by matching the fixed point with the adjusting point, compensates the displacement generated by the deformation of the supporting device, restores the flatness of the wafer carrier disc, can effectively improve the adjustment precision by adjusting the speed reducer, meets the high precision requirement of wafer production, and the speed reducer at the bottom is not bearing, reduces the loss of the speed reducer in use and prolongs the service life of the speed reducer.

Inventors

• TANG JUN
• LI HUI
• ZHANG XIAOLU
• LUO HANCHANG

Assignees

• 南京晶升装备股份有限公司

Dates

Publication Date

20260512

Application Date

20260323

Claims (10)

1. 1. The utility model provides a attenuate quick-witted wafer carries a set angle adjusting device, its characterized in that, includes a fixed point and two regulatory points, fixed point highly is fixed, be equipped with high adjusting device in the regulatory point, high adjusting device includes adjusting screw (1), regulating spindle (2), speed reducer (9), adjusts pole (10), adjust pole (10) and speed reducer (9) input shaft connection, speed reducer (9) output shaft passes through shaft coupling (8) and is connected with regulating screw (1), regulating screw (1) and regulating spindle (2) threaded connection, and open on regulating spindle (2) has the keyway, installs sliding key (4) in the keyway, and sliding key (4) are used for restricting regulating spindle (2) rotation, make regulating spindle (2) only reciprocate.
2. 2. The angle adjusting device for the wafer carrier of the thinning machine according to claim 1, wherein screw holes are formed in the upper end and the lower end of the adjusting shaft (2), one screw hole is used for being connected with the adjusting screw (1), and the other screw hole is used for being connected with the wafer carrier.
3. 3. The wafer carrier angle adjustment device of a thinning machine according to claim 1, characterized in that the adjustment lever (10) is connected with a motor.
4. 4. The wafer carrier angle adjusting device of the thinning machine according to claim 1, wherein one end of the adjusting shaft (2) far away from the adjusting screw (1) is provided with a spherical washer (6).
5. 5. The wafer carrier angle adjusting device of the thinning machine according to claim 1, wherein a fixing flange (3) is arranged on the outer side of the adjusting screw (1), and a bearing (13) is arranged between the fixing flange (3) and the adjusting screw (1).
6. 6. The wafer carrier angle adjusting device of the thinning machine according to claim 5, wherein a bearing pressing end cover (5) is arranged outside the bearing (13).
7. 7. The wafer carrier angle adjustment apparatus of claim 1, wherein a screw is provided in the fixed point.
8. 8. The wafer carrier angle adjustment apparatus of claim 1, wherein the fixed point is located on the same circumference as the adjustment point.
9. 9. The wafer carrier angle adjustment apparatus of claim 8, wherein the fixed points are circumferentially equidistant from the adjustment points.
10. 10. The wafer carrier angle adjustment apparatus of claim 1, wherein the fixed point and the adjustment point are connected to the wafer carrier by a flange.

Description

Wafer carrying disc angle adjusting device of thinning machine Technical Field The invention relates to the technical field of wafer processing, in particular to an angle adjusting device for a wafer carrying disc of a thinning machine. Background The grinding wheel of the grinding head of the thinning machine generates downward pressure in the process of thinning the wafer, after long-time processing and use, a supporting device at the three-point supporting position of the wafer carrying disc is deformed, the angle of the wafer carrying disc cannot be accurately adjusted, and then the plane angle of the wafer is affected, so that larger deviation of the wafer TTV (difference between the maximum thickness and the minimum thickness of a silicon wafer) occurs, and therefore, an adjusting device capable of adjusting the plane angle of the wafer carrying disc is needed, and the angle of the wafer carrying disc is adjusted under the condition that the supporting device is deformed, so that the wafer TTV is reduced, and the thickness uniformity of the wafer is improved. Disclosure of Invention Aiming at the defects, the invention provides the wafer carrying disc angle adjusting device of the thinning machine. According to the technical scheme, the wafer carrier disc angle adjusting device of the thinning machine comprises a fixed point and two adjusting points, wherein the fixed point is fixed in height, the adjusting points are internally provided with a height adjusting device, the height adjusting device comprises an adjusting screw rod, an adjusting shaft, a speed reducer and an adjusting rod, the adjusting rod is connected with an input shaft of the speed reducer, an output shaft of the speed reducer is connected with the adjusting screw rod through a coupler, the adjusting screw rod is in threaded connection with the adjusting shaft, a key groove is formed in the adjusting shaft, a sliding key is arranged in the key groove and used for limiting the adjusting shaft to rotate, and the adjusting shaft only moves up and down. Further, screw holes are formed in the upper end and the lower end of the adjusting shaft respectively, one screw hole is used for being connected with the adjusting screw, and the other screw hole is used for being connected with the wafer carrying disc. Further, the adjusting rod is connected with the motor. Further, a spherical washer is arranged at one end, far away from the adjusting screw rod, of the adjusting shaft. Further, the outside of the adjusting screw is provided with a fixed flange, and a bearing is arranged between the fixed flange and the adjusting screw. Furthermore, a bearing pressing end cover is arranged on the outer side of the bearing. Further, a screw is arranged in the fixed point. Further, the fixed point and the adjusting point are positioned on the same circumference. Further, the fixed points and the adjusting points are distributed at equal distances on the circumference. Further, the fixed point and the adjusting point are connected with the wafer carrying disc through flanges. Compared with the prior art, the invention has the advantages that the angle adjustment of the wafer carrier disc is realized by matching the fixed point with the adjusting point, the displacement generated by the deformation of the supporting device is compensated, the flatness of the wafer carrier disc is recovered, the adjustment precision can be effectively improved by adjusting the speed reducer, the high-precision requirement of wafer production is met, the speed reducer at the bottom is not loaded, the loss of the speed reducer in use is reduced, and the service life of the speed reducer is prolonged. Drawings FIG. 1 is a schematic view of the overall structure of an angle adjusting device according to the present invention; FIG. 2 is a top view of the angle adjustment apparatus of the present invention; FIG. 3 is a schematic view of a height adjustment device according to the present invention; FIG. 4 is a cross-sectional view showing the structure of the height adjusting apparatus A-A according to the present invention; Fig. 5 is a sectional view showing the structure of the angle adjusting device D-D of the present invention. Detailed Description As shown in fig. 1 and 2, a wafer carrier angle adjusting device of a thinning machine in this embodiment includes a fixing point 21 and two adjusting points 22, where the three points are located on the same circumference and are equidistantly distributed. The fixed point is internally provided with a screw which is fixed in height and cannot be adjusted. As shown in fig. 3 and 4, a height adjusting device is arranged in the adjusting point, the height adjusting device comprises an adjusting screw 1, an adjusting shaft 2, a speed reducer 9 and an adjusting rod 10, the adjusting rod 10 is connected with an input shaft of the speed reducer 9, an output shaft of the speed reducer 9 is connected with the adjusting screw 1 through a co