CN-122008271-A - Modularized multi-mode touch sensing method for robot and application thereof

CN122008271ACN 122008271 ACN122008271 ACN 122008271ACN-122008271-A

Abstract

The invention discloses a modularized multi-mode touch sensing method for a robot and application thereof, wherein the method comprises the steps of detecting external physical quantity through a plurality of sensing units which are distributed, wherein each sensing unit comprises a touch array sensor, a thermocouple and a flexible tension sensor; the multi-mode signal conditioning module is provided with an upper-level input interface and a lower-level output interface, provides power supply and line scanning control signals for all the multi-mode signal conditioning modules through a high-speed data processing and communication module, synchronously collects the output analog voltage signals, converts the analog voltage signals into digital signals, packages the digital signals into data packets and transmits the data packets to an upper-level system, and the synchronous collection step adopts an interrupt driving mechanism. The invention greatly improves the performance of the robot touch sensing system, improves the expansibility and reduces the cost.

Inventors

LI XIU
FANG YUXUAN
LI ZHE

Assignees

清华大学深圳国际研究生院

Dates

Publication Date: 20260512
Application Date: 20260306

Claims (10)

1. A modularized multi-mode touch sensing method for a robot is characterized by comprising the following steps of detecting external physical quantities through a plurality of sensing units which are distributed, wherein each sensing unit comprises a touch array sensor for detecting contact pressure, a thermocouple for detecting temperature and a flexible tension sensor for detecting tensile tension; the synchronous acquisition step adopts an interrupt driving mechanism, wherein the interrupt driving mechanism is used for triggering a plurality of analog-to-digital conversion chips to start conversion at the same time by a periodic conversion starting signal, a conversion state signal triggers an interrupt service program when conversion is completed, each analog-to-digital conversion chip is in a time-sharing gating mode in the interrupt service program to read conversion data and store the conversion data in a buffer area, and the data are read from the buffer area and packaged in a main program cycle.
2. The method of claim 1, wherein the electrical signal output by the tactile array sensor is conditioned by an inverting amplifier circuit, the electrical signal output by the thermocouple is conditioned by an in-phase amplifier circuit, and the electrical signal output by the flexible tension sensor is conditioned by a voltage divider circuit.
3. The method of claim 1 or 2, wherein the interrupt service routine performs the operations of gating an analog-to-digital conversion chip according to a current index, reading conversion data of a plurality of channels of a current line of the chip, storing the data in a first-in-first-out FIFO buffer, and updating the chip and the line index.
4. The method of claim 1, wherein in the main program loop, after reading data from the buffer, the data is reassembled according to the analog-to-digital conversion chip and the row address information of the data source, and each complete sensor unit is assembled into a data packet, and the data packet includes a frame header, a module identifier, haptic data, temperature data, tension data, and a checksum.
5. The modularized multi-mode touch sensing system for the robot is characterized by comprising a sensing unit, a sensor module and a control unit, wherein the sensing unit is distributed on the surface of an object to be detected and comprises a touch array sensor for detecting pressure, a thermocouple for detecting temperature and a flexible tension sensor for detecting tensile tension; the system comprises a sensing unit, at least one multi-mode signal conditioning module, a high-speed data processing and communication module, a master control unit and a digital data acquisition and synchronization unit, wherein the multi-mode signal conditioning module is electrically connected to the sensing unit and comprises a signal conditioning unit and a bus interface unit, the signal conditioning unit is used for receiving and conditioning electric signals output by the touch array sensor, a thermocouple and a flexible tension sensor, the bus interface unit is used for receiving power wires, ground wires and control signals from the outside and outputting the power wires, the ground wires and the control signals, the high-speed data processing and communication module is electrically connected to the multi-mode signal conditioning module and comprises a master control unit and at least one analog-digital conversion unit, the master control unit is used for generating the control signals and sending the control signals to the multi-mode signal conditioning module through the bus interface unit, and the analog-digital conversion unit is used for synchronously acquiring multipath analog signals conditioned by the signal conditioning unit and converting the multipath analog signals into digital signals and reading and processing the digital signals, and the master control unit coordinates the generation of the control signals, the conversion of the analog-digital conversion unit and the digital signals through time sequence control logic of interrupt driving, and the high-speed data processing and communication module is used for realizing high-speed synchronous acquisition of the whole system.
6. The multi-mode signal conditioning module is characterized by comprising a signal conditioning unit, an upper-level input interface, a lower-level output interface and an analog voltage output interface, wherein the signal conditioning unit is used for conditioning an electric signal output by an accessed sensing unit and converting the electric signal into an analog voltage signal for output, the sensing unit comprises a touch array sensor, a thermocouple and a flexible tension sensor, the upper-level input interface is used for accessing a power line and a control signal line from a data processing module or an upper-level multi-mode signal conditioning module, the lower-level output interface is used for leading the power line and the control signal line out to the lower-level multi-mode signal conditioning module, the analog voltage output interface is used for outputting the analog voltage signal to the data processing module, and the upper-level input interface and the lower-level output interface adopt the same bus protocol, so that a plurality of multi-mode signal conditioning modules can be in bus cascade through the upper-level input interface and the lower-level output interface.
7. The multi-mode signal conditioning module of claim 6, wherein the signal conditioning unit comprises an analog switch for gating each row signal of the tactile array sensor, an inverting amplifier circuit for conditioning each column signal of the tactile array sensor, a two-stage in-phase amplifier circuit for conditioning the thermocouple output signal, and a voltage divider circuit for conditioning the flexible tension sensor output signal.
8. A high-speed data processing and communication module is characterized by comprising a microcontroller, a plurality of analog-to-digital conversion chips, wherein analog input channels of the analog-to-digital conversion chips are respectively connected to an analog voltage output interface of the multi-mode signal conditioning module according to claim 6 or 7 to receive analog voltage signals, all the analog-to-digital conversion chips share a data bus of the microcontroller and a control signal line except a chip selection signal, each analog-to-digital conversion chip is respectively connected to an independent chip selection pin of the microcontroller, the microcontroller is configured to generate a periodic conversion starting signal and simultaneously output the periodic conversion starting signal to all the analog-to-digital conversion chips to trigger synchronous conversion, a conversion state signal sent out after conversion of any analog-to-digital conversion chip enters an interrupt service program, in the interrupt service program, the analog-to-digital conversion chips are gated in a time-sharing mode through the control chip selection signal and read conversion data of the gated chips through the data bus and stored in a buffer, and in a main program cycle, the data is read from the buffer and uploaded through the communication interface.
9. The robot dexterous hand comprises a palm and a plurality of fingers and is characterized by further comprising a plurality of multi-mode signal conditioning modules according to claim 6 or 7 and a high-speed data processing and communication module according to claim 8, wherein the multi-mode signal conditioning modules are connected in a bus cascading mode and are distributed and integrated on the surfaces of the palm and the fingers, a touch array sensor and a thermocouple connected with the multi-mode signal conditioning modules are arranged on the touch surfaces of the palm and the fingers, and the flexible tension sensor is connected with joints of the fingers in a bridging mode.
10. A robot is characterized in that, comprising the robot smart hand of claim 9.

Description

Modularized multi-mode touch sensing method for robot and application thereof Technical Field The invention relates to the technical field of robot sensing, in particular to a modularized multi-mode touch sensing method for a robot and application thereof. Background Successful execution of the smart operation of the robot is highly dependent on the rich perceived information and real-time feedback that the device can acquire. In recent years, the robot hand has made remarkable progress in the design of mechanical structures, however, the development speed of external perception systems required for supporting fine operations is still lagging behind the progress of mechanical structures and driving functions. In particular, for multi-finger hands, how to stably and reliably acquire high-precision and high-bandwidth force and position or other perception information is still an unresolved technical difficulty. The touch sensing is used as a core technology for realizing intelligent perception and man-machine interaction of the robot, and the performance of the touch sensing directly determines the accuracy, safety and adaptability of the operation of the robot. Sensors configured by the dexterous hand can be divided into two main categories, internal and external. The internal sensor comprises moment, position, speed, acceleration sensor and the like, and is mainly used for sensing the state of the robot and realizing motion control and dynamic balance. External sensors are used to sense external conditions such as contact stress, object position, shape, texture, temperature, etc. However, at the external perception level, there is a general problem of insufficient sensor configuration, mainly manifested in the following aspects: 1. The prior proposal is limited to a single sensing mode, can only provide tactile pressure sensing, and is difficult to meet the multi-dimensional task demands such as contact detection, slip sensing, object attribute (hardness, texture, thermal conductivity) identification and the like. 2. The expansibility is poor, the sensor array is mostly in fixed configuration, is usually designed aiming at a specific dexterous hand or a specific position thereof, and is difficult to adapt to dexterous hands and mechanical clamping jaws with different configurations or different degrees of freedom, so that the system has high reconstruction cost and is difficult to meet different requirements. 3. The data transmission bottleneck is that the touch sensor array is used as a matrix sensor, and the sensor is usually sampled in a scanning mode, so that the problem of complex space-time protocol is solved, and the sampling rate is limited by a plurality of factors such as row-column scanning frequency, analog-digital conversion frequency, communication protocol and the like. At present, the sampling rate of the piezoresistive sensing system in the market is generally lower than 50Hz, and the high-frequency controller is difficult to support, so that the piezoresistive sensing system becomes a key bottleneck for limiting the system performance. 4. The integration complexity is high, the existing external sensor scheme and the robot smart hand are mutually independent, and an external signal conditioning circuit, independent data acquisition equipment and a complex wiring scheme are needed to be relied on. In the limited space of the smart hand, the wiring quantity is severely limited, and the geometric irregularity of the curved surface contact structure of the smart hand is difficult to directly install the sensor on the surface of the finger of the robot. 5. The cost effectiveness is insufficient, the high-performance commercial touch sensor is high in price, and the low-cost commercial sensor has the performance defects of single mode, poor expansibility, low frame rate and the like, and does not have the potential of being applied to a target scene through simple secondary development. Disclosure of Invention The invention aims to solve the technical problem of how to construct a robot touch sensing system which can realize high-bandwidth data acquisition, multi-mode information fusion, high system expansibility and easy integration, and provides a modularized multi-mode touch sensing method for a robot and application thereof. In order to achieve the above purpose, the present invention adopts the following technical scheme: A modularized multi-mode touch sensing method for robots comprises the following steps of detecting external physical quantities through a plurality of sensing units which are distributed, wherein each sensing unit comprises a touch array sensor used for detecting contact pressure, a thermocouple used for detecting temperature and a flexible tension sensor used for detecting stretching tension, electric signals output by the corresponding sensing units are conditioned through a plurality of multi-mode signal conditioning modules respectively to be converted into analog vol