CN-122008354-A - Punching forming method and die for flexible circuit board

Abstract

The invention relates to the technical field of flexible circuit board manufacturing, in particular to a punching forming method and a die of a flexible circuit board. The punching and forming method comprises the following steps of S1, designing a flexible circuit board assembly, designing the position to be punched of the flexible circuit board assembly into multiple sections, alternately distributing the sections to A, B groups, rotating the group A around the axis for 180 ℃ and overlapping the group B, designing a punching and forming die according to the group A, punching the flexible circuit board assembly by adopting the punching and forming die to form a punching groove A, S3, punching the flexible circuit board assembly again around the axis for 180 ℃ to form a punching groove B, and combining the punching groove A and the punching groove B together to form the finished punching. The punching method uses the same punching forming die to complete the complete separation, and compared with the conventional multi-set die, the method effectively saves the cost and improves the production efficiency.

Inventors

• LI SHOUGANG
• YUAN ZHI
• LI JUN

Assignees

• 台山市精诚达电路有限公司

Dates

Publication Date

20260512

Application Date

20260128

Claims (10)

1. 1. The punching and forming method of the flexible circuit board is characterized by comprising the following steps of: S1, designing flexible circuit board imposition, designing positions to be punched of the flexible circuit board imposition into a plurality of sections, alternately distributing the sections to A, B groups, rotating the group A around the axis for 180 ℃ and overlapping the group B; s2, punching the flexible circuit board splice by adopting a punching forming die to form a punching groove A; S3, the flexible circuit board assembly is rotated around the axis for 180 degrees to be punched again, a punching groove B is formed, and the punching groove A and the punching groove B are combined together to complete punching.
2. 2. The die-cutting molding method of a flexible circuit board according to claim 1, wherein the flexible circuit board is centrosymmetric.
3. 3. The die-cutting molding method of the flexible circuit board according to claim 1, wherein the width of the punching groove A is 0.8-1.2 mm.
4. 4. The die-cutting molding method of a flexible circuit board according to claim 1, wherein an aspect ratio of the punched groove a is <25.
5. 5. A punching forming die for a flexible circuit board is characterized by comprising an upper die and a lower die, wherein a punch is arranged on the upper die, and the punch which is obtained by rotating the punch around the axis of the upper die by 180 degrees are spliced together to obtain a pattern which is the same as the pattern to be punched in shape and size.
6. 6. The die-cutting and forming die for flexible circuit boards according to claim 5, wherein when there are at least two of said punches, adjacent two of said punches are disposed at intervals.
7. 7. The die-cutting forming die for flexible circuit board according to claim 5, wherein when the number of the punches is at least two, the punches are the same or different from each other.
8. 8. The die-cutting forming die for flexible circuit board according to claim 5, wherein the lower die is provided with a die hole that mates with the punch.
9. 9. The die-cutting forming die for flexible circuit board according to claim 8, wherein a scrap port is provided below the die hole.
10. 10. The die-cut molding die for flexible circuit board according to claim 9, wherein the waste port is in an inverted funnel shape.

Description

Punching forming method and die for flexible circuit board Technical Field The invention relates to the technical field of flexible circuit board manufacturing, in particular to a punching forming method and a die of a flexible circuit board. Background In the large-scale die-cut production of FPCs (flexible circuit boards), how to balance efficiency, cost and quality is a core challenge for the industrial production of FPCs. The main stream technical scheme has the following remarkable defects: 1. The complex product often needs multiple sets of dies to complete different procedures such as inner holes, shapes and the like so as to reduce one-time blanking force and improve the quality of a section, or a single die is used but a micro connecting rib is reserved for circulation, for example, the Chinese patent application No. 200420103530.0 is applied, which leads to the follow-up procedures of laser, punch secondary plate separation or manual breaking, increases the cost of equipment, manpower and time, possibly introduces mechanical stress, burrs or pollution, leads to the residual rate after plate separation to exceed 5 percent, and damages the consistency and the reliability of the product. 2. In order to adapt to the installation of a plurality of sets of dies or ensure the strength of micro connecting ribs, a larger interval must be reserved on the splicing of the FPC units, so that the utilization rate of the base materials is low, and the cost of raw materials is increased. Disclosure of Invention The invention aims to solve the technical problem of providing a punching forming method of a flexible circuit board without adopting a plurality of sets of dies or retaining micro connecting ribs and a die thereof. In order to solve the technical problems, the technical scheme adopted by the invention is that the punching and forming method of the flexible circuit board comprises the following steps: S1, designing flexible circuit board imposition, designing positions to be punched of the flexible circuit board imposition into a plurality of sections, alternately distributing the sections to A, B groups, rotating the group A around the axis for 180 ℃ and overlapping the group B; s2, punching the flexible circuit board splice by adopting a punching forming die to form a punching groove A; S3, the flexible circuit board assembly is rotated around the axis for 180 degrees to be punched again, a punching groove B is formed, and the punching groove A and the punching groove B are combined together to complete punching. The invention adopts another technical scheme that the punching forming die for the flexible circuit board comprises an upper die and a lower die, wherein the upper die is provided with a punch, and the punch which is obtained by rotating the punch around the axis of the upper die by 180 degrees are spliced together to obtain a pattern which is the same as the pattern to be punched in shape and size. The die-cutting forming die used by the die-cutting method has the advantages that the die-cutting forming die used by the die-cutting method is extremely simple in structure, no movable rotating parts are needed, and an independent FPC veneer without connecting rib residues can be produced at one time. The flexible circuit board suitable for the design of specific 'alternate segmentation' imposition is characterized in that the reserved groove segments after the first punching naturally form a rigid support network, the stable support imposition is subjected to external rotation operation to carry out the second punching, and finally the same punching forming die is used for completing complete separation. Drawings FIG. 1 is a schematic diagram of a structure of a slot A formed after S2 according to an embodiment of the present invention; FIG. 2 is a schematic diagram of a structure after S3 punching according to an embodiment of the present invention; Description of the reference numerals: 1. The flexible circuit board is assembled, 2, the punching groove A and 3, the punching groove B. Detailed Description In order to describe the technical contents, the achieved objects and effects of the present invention in detail, the following description will be made with reference to the embodiments in conjunction with the accompanying drawings. Referring to fig. 1 and 2, a method for punching a flexible circuit board includes the following steps: S1, designing flexible circuit board imposition, designing positions to be punched of the flexible circuit board imposition into a plurality of sections, alternately distributing the sections to A, B groups, rotating the group A around the axis for 180 ℃ and overlapping the group B; s2, punching the flexible circuit board splice by adopting a punching forming die to form a punching groove A; S3, the flexible circuit board assembly is rotated around the axis for 180 degrees to be punched again, a punching groove B is formed, and the punching groove A and the punch