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CN-122008421-A - Method for purging and replacing air

CN122008421ACN 122008421 ACN122008421 ACN 122008421ACN-122008421-A

Abstract

The invention discloses a method for blowing and replacing air, which relates to the technical field of the method for blowing and replacing air, and comprises the following steps of S1, firstly starting a pneumatic valve to drive nitrogen into the inner side of a wafer cutting device through an air inlet pipe for use, S2, restarting an automatic rotating air sweeping port to sweep air from the inner side of the wafer cutting device, S3, enabling a door valve to seal the wafer cutting device, S4, exhausting air through a connecting valve and discharging the air into the inner side of a shell for purifying treatment, and arranging an air inlet mechanism on the right side of the wafer cutting device.

Inventors

  • YANG YONG
  • ZHOU QIANG
  • Tian Maochuang
  • Jin Chaojian

Assignees

  • 浙江晶睿电子科技有限公司

Dates

Publication Date
20260512
Application Date
20251224

Claims (10)

  1. 1. A method of purging displaced air comprising the steps of; s1, firstly, starting a pneumatic valve (4) to drive nitrogen into the inner side of a wafer cutting device (1) through an air inlet pipe (6) for use; s2, restarting the automatic rotating air sweeping opening (3) to sweep air on the inner side of the wafer cutting device (1); S3, a gate valve (7) can seal the wafer cutting device (1); s4, exhausting by a connecting valve (8), and discharging the exhaust gas to the inner side of the shell (9) for purification treatment; An air inlet mechanism is arranged on the right side of the wafer cutting device (1), a purifying mechanism, a mounting mechanism and an unlocking mechanism are respectively arranged on the left side of the wafer cutting device (1), and the mounting mechanism and the unlocking mechanism are matched with the purifying mechanism; The air inlet mechanism comprises a replacement pipe (2), an automatic rotary air sweeping port (3), a pneumatic valve (4), a connecting pipe (5), an air inlet pipe (6) and a door valve (7); the replacement pipe (2) is installed in the bottom of shell (9), and automatic rotatory wind gap (3) are installed on the top of replacement pipe (2), and pneumatic valve (4) are linked together with replacement pipe (2) and intake pipe (6) respectively, and connecting pipe (5) are linked together with pneumatic valve (4) and gate valve (7) respectively, and gate valve (7) cooperate with wafer cutting device (1).
  2. 2. The method for purging displaced air according to claim 1, wherein the purifying mechanism comprises a connecting valve (8), a housing (9), an air outlet pipe (10), a door plate (12), three activated carbon plates (13), a seal ring (14) and an oxygen concentration detector (25) The connecting valve (8) is installed on the wafer cutting device (1), the shell (9) is communicated with the connecting valve (8), the air outlet pipe (10) is installed at the top of the shell (9), the outer side of the door plate (12) is in sliding contact with the left side of the shell (9), the active carbon plate (13) is fixedly connected with the door plate (12), and the oxygen concentration detector (25) is fixedly installed on the air outlet pipe (10).
  3. 3. A method of purging displaced air as claimed in claim 1, wherein the mounting mechanism comprises a fixed mount (15), a conformable mount (16), a spring (17) and a fixed block (18); the fixing frame (15) is fixedly arranged on the shell (9), the attaching frame (16) is in sliding connection with the door plate (12), the attaching frame (16) is fixedly connected with the spring (17), the spring (17) is fixedly connected with the fixing block (18), and the fixing block (18) is fixedly connected with the door plate (12).
  4. 4. A method of purging displaced air as claimed in claim 1, wherein the unlocking mechanism comprises a handle (19), a driver plate (20), a control plate (21), a rotating lever (22), a carriage (23) and a pulling lever (24); Handle (19) and door plant (12) fixed connection drive board (20) and laminating frame (16) fixed connection that are located the top position, drive board (20) and control panel (21) sliding connection, dwang (22) respectively with handle (19) and control panel (21) swivelling joint, carriage (23) and control panel (21) sliding connection carriage (23) and fixed block (18) sliding connection, pulling rod (24) respectively with laminating frame (16) and fixed block (18) fixed connection that are located the top position that are located the bottom position.
  5. 5. A method of purging displaced air according to claim 2, characterized in that the housing (9) is provided with bursting discs (11) on both the left and right sides, the number of bursting discs (11) being two.
  6. 6. A method of purging displaced air according to claim 2, characterized in that the outer sides of the three activated carbon plates (13) are provided with sealing rings (14), the outer sides of the activated carbon plates (13) and the sealing rings (14) being in sliding contact with the inner wall of the housing (9).
  7. 7. A method for purging and displacing air according to claim 3, wherein the door plate (12) is provided with two vertical sliding grooves symmetrically arranged, and the two attaching frames (16) are respectively connected with the inner walls of the two vertical sliding grooves in a sliding manner.
  8. 8. The method for purging and displacing air as claimed in claim 4, wherein the driving plate (20) is provided with a mounting chute, and the control plate (21) is slidably connected to an inner wall of the mounting chute.
  9. 9. The method for purging and replacing air according to claim 4, wherein the control board (21) is provided with a driving chute, and the left side of the sliding frame (23) is slidingly connected with the inner wall of the driving chute.
  10. 10. A method for blowing and displacing air according to claim 3, wherein the inner sides of the fixing frames (15) are provided with rectangular grooves, the outer sides of the attaching frames (16) are in sliding contact with the inner walls of the rectangular grooves, and both the side, close to each other, of the two fixing frames (15) and the side, far away from each other, of the two attaching frames (16) are of oblique structures.

Description

Method for purging and replacing air Technical Field The invention relates to the technical field of air replacement purging methods, in particular to a method for purging air replacement. Background In wafer dicing (and back-end processes such as dicing, grinding, etc.), an air displacement stage (i.e., an ultra-high-cleanliness vertical laminar flow stage) is an indispensable infrastructure. Its application directly relates to the yield of the product; its core action: Particulate contamination removal, which is to produce a significant amount of silicon powder, diamond particles, or sapphire debris (depending on the material) during dicing, which, once deposited on the active area (Die) of the wafer, can cause short circuits, reduced performance, or complete failure, and the vertically downward laminar flow of clean air acts like a "curtain" of air, continually blowing these particles off the wafer surface and draining them away through the lower suction opening; the precise equipment such as a precise guide rail, a main shaft, an optical alignment system and the like of the cutting machine are very afraid of dust, and the maintenance period and the service life of the equipment can be greatly prolonged in a clean environment; The temperature and humidity control and the static electricity control are realized, namely the high-level air replacement platform can integrate temperature and humidity control, and an antistatic material is adopted to prevent the static electricity from adsorbing dust or damaging a chip; providing a stable environment, namely isolating disturbance caused by activities of external personnel and air flow; When the method for purging the replacement air in the prior art is used, the replacement air is not efficient, the purification treatment of the replaced waste gas is inconvenient, and the subsequent use is easy to influence, so the invention provides a method for purging the replacement air, which is used for solving the problems. Disclosure of Invention The application aims to provide a method for purging replacement air, which aims to solve the problems that the method for purging replacement air in the prior art is low in replacement air efficiency, and is inconvenient to purify the replaced waste gas and easy to influence subsequent use. In order to achieve the aim, the application provides the following technical scheme that the method for purging the replacement air comprises the following steps of; s1, firstly, starting a pneumatic valve to drive nitrogen into the inner side of a wafer cutting device through an air inlet pipe for use; S2, restarting the automatic rotating air sweeping port to sweep air on the inner side of the wafer cutting device; S3, a gate valve can seal the wafer cutting device; s4, exhausting by a connecting valve, and discharging the exhaust gas to the inner side of the shell for purification treatment; an air inlet mechanism is arranged on the right side of the wafer cutting device, a purifying mechanism, a mounting mechanism and an unlocking mechanism are respectively arranged on the left side of the wafer cutting device, and the mounting mechanism and the unlocking mechanism are matched with the purifying mechanism; the air inlet mechanism comprises a replacement pipe, an automatic rotary air sweeping port, a pneumatic valve, a connecting pipe, an air inlet pipe and a gate valve; The replacement pipe is installed in the bottom of shell, and automatic rotatory wind gap of sweeping is installed on the top of replacement pipe, and pneumatic valve is linked together with replacement pipe and intake pipe respectively, and the connecting pipe is linked together with pneumatic valve and valve respectively, and the valve cooperatees with wafer cutting device. By means of the structure, the pneumatic valve is started to drive nitrogen into the inner side of the wafer cutting device, and the automatic rotary air sweeping opening is utilized to sweep air, so that the efficiency and uniformity of gas replacement are effectively improved, the sealing performance of the replacement process is ensured by the door valve sealing device, waste gas is discharged to the inner side of the shell by the connecting valve to be purified, and the problems of low replacement gas efficiency and inconvenient waste gas treatment are solved. Preferably, the purifying mechanism comprises a connecting valve, a shell, an air outlet pipe, a door plate, three active carbon plates, a sealing ring and an oxygen concentration detector The connecting valve is installed on wafer cutting device, and the shell is linked together with the connecting valve, and the top at the shell is installed to the outlet duct, and the outside of door plant and the left side sliding contact of shell, active carbon plate and door plant fixed connection, oxygen concentration detector fixed mounting are on the outlet duct. Further, the purification mechanism guides waste gas into the shell through the con