CN-122008598-A - Preparation method and material of microchip piezoelectric yarn reinforced resin matrix composite material

CN122008598ACN 122008598 ACN122008598 ACN 122008598ACN-122008598-A

Abstract

The application relates to the technical field of composite material preparation, and particularly discloses a preparation method and a material of a microchip piezoelectric yarn reinforced resin matrix composite material; the method comprises the steps of taking piezoelectric polymers as spinning raw materials, preparing a piezoelectric polymer fiber net on the surface of a silver-plated aramid fiber core layer to obtain piezoelectric core-spun yarns, weaving silver-plated aramid fibers on the surface of the piezoelectric core-spun yarns to obtain initial piezoelectric yarns, uniformly coating polypropylene on the surface of the initial piezoelectric yarns after melting to obtain target piezoelectric yarns, connecting the target piezoelectric yarns with microchips to obtain microchip fibers, and integrating the microchip fibers with a resin matrix through a three-dimensional weaving process to obtain the microchip piezoelectric yarn reinforced resin matrix composite material. Based on the scheme, the prepared microchip piezoelectric yarn reinforced resin matrix composite material has the characteristics of high strength, no external power supply, long-distance identification and wireless communication.

Inventors

WANG PEIYUAN
FAN WEI
LI JUANZI
LONG JING
MIAO YAPING
ZHANG JINZHAO
ZHOU DAMING
HUANG XINGBAO
LING ZHENGYANG

Assignees

西安工程大学

Dates

Publication Date: 20260512
Application Date: 20260409

Claims (10)

1. A method for preparing a microchip piezoelectric yarn reinforced resin matrix composite material, which is characterized by comprising the following steps: Preparing a piezoelectric polymer fiber net on the surface of a silver-plated aramid fiber core layer by taking a piezoelectric polymer as a spinning raw material to obtain a piezoelectric core-spun yarn; Coating silver-plated aramid fiber on the surface of the piezoelectric core-spun yarn in a braiding manner to obtain initial piezoelectric yarn; Uniformly coating the surface of the initial piezoelectric yarn after melting polypropylene to obtain a target piezoelectric yarn; Connecting the target piezoelectric yarn with a microchip to obtain microchip fibers; Integrating the microchip fiber and the resin matrix through a three-dimensional weaving process to obtain the microchip piezoelectric yarn reinforced resin matrix composite material.
2. The method for preparing the microchip piezoelectric yarn reinforced resin matrix composite material according to claim 1, wherein the preparing the piezoelectric polymer fiber net on the surface of the silver-plated aramid core layer to obtain the piezoelectric core spun yarn comprises the following steps: preparing a piezoelectric polymer fiber net on the surface of the silver-plated aramid fiber core layer by an electrostatic spinning parallel electrode method to obtain the piezoelectric core spun yarn; The electrostatic spinning parallel electrode method is used for enabling spinning solution to form jet flow through applying a high-voltage electric field, and the jet flow is deposited on the surface of the silver-plated aramid core layer between the receiving electrodes; The piezoelectric polymer is polyvinylidene fluoride and/or polyvinylidene fluoride trifluoroethylene copolymer.
3. The preparation method of the microchip piezoelectric yarn reinforced resin matrix composite material according to claim 2, wherein the spinning voltage of the electrostatic spinning parallel electrode method is 15-25 kV, the spinning distance is 8-15 cm, the spinning speed is 0.5-2 mL/h, the receiving electrode distance is 5-10 cm, the ambient temperature is 20-30 ℃, and the ambient humidity is 30% -50%.
4. The method for preparing the microchip piezoelectric yarn reinforced resin matrix composite material according to claim 1, wherein the step of knitting and coating silver-plated aramid on the surface of the piezoelectric core-spun yarn to obtain an initial piezoelectric yarn comprises the following steps: Coating the silver-plated aramid fiber on the surface of the piezoelectric core-spun yarn in a braiding manner through a two-dimensional braiding process to obtain the initial piezoelectric yarn; the silver-plated aramid fiber has the same diameter as that of silver-plated aramid fiber used in the silver-plated aramid fiber core layer, and the diameter is 50-200 mu m; The weaving density of the two-dimensional weaving process is 20-40 pieces/10 cm, and the weaving angle is 30-60 degrees.
5. The method for preparing the microchip piezoelectric yarn reinforced resin matrix composite material according to claim 1, wherein the step of uniformly coating the polypropylene on the surface of the initial piezoelectric yarn after melting to obtain the target piezoelectric yarn comprises the following steps: The polypropylene is uniformly coated on the surface of the initial piezoelectric yarn after being melted through a melt spinning process, so that the target piezoelectric yarn is obtained; wherein the melting temperature of the melt spinning process is 170-200 ℃, and the spinning speed is 1-3 m/min; The thickness of the polypropylene coating layer of the target piezoelectric yarn is 10-50 mu m, the melting point is 160-170 ℃, and the tensile strength is greater than or equal to 20MPa.
6. The method for preparing the microchip piezoelectric yarn reinforced resin matrix composite material according to claim 1, wherein the step of connecting the target piezoelectric yarn with a microchip to obtain a microchip fiber comprises the steps of: Connecting the target piezoelectric yarn with a microchip by laser welding or ultrasonic welding to obtain the microchip fiber; The temperature of the laser welding or the ultrasonic welding is 80-120 ℃, the welding pressure is 0.1-0.5 MPa, and the welding duration is 10-30 s.
7. The method for preparing the microchip piezoelectric yarn reinforced resin matrix composite material according to claim 6, wherein the microchip is a wireless radio frequency microchip, the identification distance of the wireless radio frequency microchip is greater than or equal to 5m, and the working frequency is 860-960 MHz.
8. The method for preparing the microchip piezoelectric yarn reinforced resin matrix composite material according to claim 1, wherein the resin of the resin matrix is epoxy resin or phenolic resin; the weaving density of the three-dimensional weaving process is 30-50 pieces/10 cm, and the weaving thickness is 2-10 mm; the tensile strength of the microchip piezoelectric yarn reinforced resin matrix composite is greater than or equal to 300MPa, the bending strength is greater than or equal to 250MPa, the sensing sensitivity is greater than or equal to 0.5mV/MPa, and the wireless transmission distance is greater than or equal to 5m.
9. The microchip piezoelectric yarn reinforced resin matrix composite material is characterized by comprising a resin matrix and microchip fibers uniformly distributed in the resin matrix; The microchip fiber comprises a target piezoelectric yarn and a microchip which are connected with each other, wherein the target piezoelectric yarn comprises an initial piezoelectric yarn and a polypropylene coating layer coated on the surface of the initial piezoelectric yarn, the initial piezoelectric yarn comprises a piezoelectric core-spun yarn and a silver-plated aramid fiber weaving layer coated on the surface of the piezoelectric core-spun yarn, and the piezoelectric core-spun yarn comprises a silver-plated aramid fiber core layer and a piezoelectric polymer fiber net coated on the surface of the silver-plated aramid fiber core layer.
10. The microchip piezoelectric yarn reinforced resin matrix composite material according to claim 9, wherein the raw material of the piezoelectric polymer fiber web is polyvinylidene fluoride and/or polyvinylidene fluoride trifluoroethylene copolymer; the diameter of the silver-plated aramid fiber core layer is the same as that of silver-plated aramid fiber in the silver-plated aramid fiber weaving layer, and the diameter is 50-200 mu m; the thickness of the polypropylene coating layer is 10-50 mu m; The microchip is a wireless radio frequency microchip; The resin of the resin matrix is epoxy resin or phenolic resin.

Description

Preparation method and material of microchip piezoelectric yarn reinforced resin matrix composite material Technical Field The application relates to the technical field of composite material preparation, in particular to a preparation method and a material of a microchip piezoelectric yarn reinforced resin matrix composite material. Background The resin-based composite material is a common structural material in the field of modern engineering due to the advantages of high specific strength, corrosion resistance, strong structural designability and the like, but the current resin-based composite material can only meet the structural bearing requirement of a foundation and cannot adapt to the integrated requirement of the modern engineering on the wireless transmission of structural health real-time monitoring and monitoring signals. The existing intelligent resin-based composite material is mainly provided with sensing functions by adopting a mode of splicing an external sensor and a resin-based structural material, and has the problems of poor compatibility between the sensor and a resin matrix, low reliability of a connecting interface, power supply of the sensor by an external power supply, short signal recognition distance, insufficient wireless communication stability and the like, and is difficult to realize integrated integration of bearing, sensing and communication, so that long-term stable application of the sensor under complex working conditions is limited. The piezoelectric material has the inherent characteristics of mutual conversion of mechanical energy and electric energy, but the existing piezoelectric yarn has the defects of poor structural stability, insufficient mechanical strength and the like, so that the piezoelectric yarn is difficult to consider the bearing performance, sensing performance and communication performance in the resin matrix composite material, and real-time on-line monitoring and wireless signal transmission on the structural health of the composite material cannot be realized. Therefore, how to solve the above technical problems and prepare a composite material capable of integrating bearing, sensing and communication is a technical problem to be solved at present. Disclosure of Invention The application provides a preparation method and a material of a microchip piezoelectric yarn reinforced resin matrix composite material, which can prepare the microchip piezoelectric yarn reinforced resin matrix composite material integrating bearing, sensing and communication, and the composite material has the characteristics of high strength, no external power supply, long-distance identification and wireless communication. In order to achieve the above object, the present application provides the following technical solutions: In a first aspect, an embodiment of the present application provides a method for preparing a microchip piezoelectric yarn reinforced resin matrix composite, the method comprising: Preparing a piezoelectric polymer fiber net on the surface of a silver-plated aramid fiber core layer by taking a piezoelectric polymer as a spinning raw material to obtain a piezoelectric core-spun yarn; Coating silver-plated aramid fiber on the surface of the piezoelectric core-spun yarn in a braiding manner to obtain initial piezoelectric yarn; Uniformly coating the surface of the initial piezoelectric yarn after melting polypropylene to obtain a target piezoelectric yarn; Connecting the target piezoelectric yarn with a microchip to obtain microchip fibers; integrating the microchip fiber and the resin matrix through a three-dimensional weaving process to obtain the microchip piezoelectric yarn reinforced resin matrix composite material. In some embodiments of the present application, a piezoelectric polymer fiber web is prepared on the surface of a silver-plated aramid core layer to obtain a piezoelectric core spun yarn, comprising: preparing a piezoelectric polymer fiber net on the surface of the silver-plated aramid fiber core layer by an electrostatic spinning parallel electrode method to obtain piezoelectric core spun yarns; The electrostatic spinning parallel electrode method is used for enabling spinning solution to form jet flow through applying a high-voltage electric field, and the jet flow is deposited on the surface of the silver-plated aramid core layer between the receiving electrodes; the piezoelectric polymer is polyvinylidene fluoride and/or polyvinylidene fluoride trifluoroethylene copolymer. In some embodiments of the application, the spinning voltage of the electrostatic spinning parallel electrode method is 15-25 kV, the spinning distance is 8-15 cm, the spinning speed is 0.5-2 mL/h, the distance between receiving electrodes is 5-10 cm, the ambient temperature is 20-30 ℃, and the ambient humidity is 30% -50%. In some embodiments of the present application, a silver-plated aramid yarn is woven and coated on the surface of a piezoelectric core-spun yarn