CN-122008639-A - Layered heterostructure aluminum-silicon alloy part and preparation method thereof

CN122008639ACN 122008639 ACN122008639 ACN 122008639ACN-122008639-A

Abstract

The invention discloses a layered heterostructure aluminum-silicon alloy part and a preparation method thereof, relating to the technical field of high-quality aluminum alloy plates, the hard region comprises an aluminum-silicon alloy matrix layer, the soft region comprises a pure aluminum reinforcing layer, and a metallurgical bonding interface is formed between the aluminum-silicon alloy matrix layer and the pure aluminum reinforcing layer. The invention obtains the high-strength high-plasticity aluminum-silicon alloy product with the soft and hard area alternate layered heterostructure by rheoforming the aluminum-silicon alloy semi-solid slurry and alternately laminating and rolling the aluminum-silicon alloy semi-solid slurry and the pure aluminum layer.

Inventors

XIONG WENTAO
HE MINHONG
HU ZHIHUA
DING YICHAO
CAO JIANFEI
WANG SHIHAO
XIAO LIPENG

Assignees

成都工业学院

Dates

Publication Date: 20260512
Application Date: 20260209

Claims (10)

1. The layered heterostructure aluminum-silicon alloy workpiece is characterized by comprising a layered heterostructure with alternating soft regions and hard regions, wherein the hard regions comprise aluminum-silicon alloy substrate layers, the soft regions comprise pure aluminum reinforcing layers, and a metallurgical bonding interface is formed between the aluminum-silicon alloy substrate layers and the pure aluminum reinforcing layers.
2. A layered heterostructure aluminum silicon alloy article as defined in claim 1, said layered heterostructure comprising two layers of said aluminum silicon alloy matrix sandwiching one of said pure aluminum reinforcement layers forming a sandwich-like structure, said pure aluminum reinforcement layer being disposed between the two layers of aluminum silicon alloy matrix.
3. The layered heterostructure aluminum silicon alloy article of claim 1, wherein the aluminum silicon alloy base layer is comprised of elements comprising, by mass: Si:5.50~7.50 wt.%; Mg:0.25~0.55 wt.%; Fe:0.05~0.10 wt.%; The total impurity amount is less than or equal to 0.10 wt percent, and the balance is Al.
4. A method for preparing a layered heterostructure aluminum silicon alloy article as defined in any one of claims 1 to 3, comprising the steps of: s1, smelting an aluminum-silicon alloy raw material and preparing semi-solid slurry; s2, rheoforming the semi-solid slurry into an aluminum-silicon alloy matrix layer; S3, alternately laminating and assembling pure aluminum reinforcing layers and the aluminum-silicon alloy matrix layers to form a layered composite blank; And S4, carrying out rolling compounding and annealing treatment on the layered composite blank to form a metallurgical bonding interface between the aluminum-silicon alloy substrate layer and the pure aluminum reinforcing layer, thereby obtaining the aluminum-silicon alloy product with the layered heterostructure.
5. The method of claim 4, wherein the rheoforming in S2 comprises squeeze casting or rheodie casting to obtain an aluminum-silicon alloy matrix layer with a U-shaped groove structure; s3, placing a pure aluminum reinforcing layer in the U-shaped groove to assemble and form the layered composite blank, wherein the pure aluminum reinforcing layer is in surface contact with the side wall and the bottom of the U-shaped groove.
6. The method of claim 4, wherein the rolling and compounding in S4 comprises sequentially performing high temperature rolling and cold rolling; the high-temperature rolling comprises the steps of carrying out short-time isothermal pretreatment and then carrying out multi-pass high-temperature rolling on a double-roller mill; The cold rolling comprises the steps of carrying out short-time solution treatment, and carrying out multi-pass cold rolling on a double-roller mill after air cooling to room temperature.
7. The method for preparing the layered heterostructure aluminum-silicon alloy workpiece according to claim 6, wherein the initial rolling temperature of the multi-pass high-temperature rolling is 350-400 ℃, the rolling passes are 3-5, the total rolling reduction is 40-50%, the temperature of the short-time isothermal pretreatment is 300-400 ℃, and the time is 15-45 minutes; the temperature of the short-time solution treatment is 300-450 ℃, and the heat preservation time is 30-45 minutes; The rolling passes of the multi-pass cold rolling are 3-5, and the total reduction is 60% -75%; The temperature of the annealing treatment is 300-375 ℃, and the heat preservation time is 60-75 minutes.
8. The method for preparing a layered heterostructure aluminum-silicon alloy article according to claim 4, wherein the preparing of the semi-solid slurry in S1 includes preparing an Al-Si alloy semi-solid slurry composed of a spherical primary α -Al solid phase and a Si-rich Mg residual liquid phase using a wave-type semi-solid slurry preparing apparatus.
9. The method for manufacturing a layered heterostructure aluminum-silicon alloy workpiece according to claim 4, wherein the pure aluminum reinforcing layer is 40-55 mm in length, 10-20 mm in width and 2-6 mm in thickness.
10. The method for preparing the layered heterostructure aluminum-silicon alloy workpiece according to claim 9, wherein the aluminum-silicon alloy substrate layer is a U-shaped workpiece, the length of the aluminum-silicon alloy substrate layer is 45-55 mm, the width of the aluminum-silicon alloy substrate layer is 15-25 mm, the thickness of the aluminum-silicon alloy substrate layer is 12-25 mm, the single-side wall thickness of the U-shaped section is 3-10 mm, and the gap between two wall thicknesses of the U-shaped section is 2-5 mm.

Description

Layered heterostructure aluminum-silicon alloy part and preparation method thereof Technical Field The invention relates to the technical field of high-quality aluminum alloy plates, in particular to a layered heterostructure aluminum-silicon alloy part and a preparation method thereof. Background Aluminum alloys are widely used for producing plates due to their high strength to weight ratio to achieve the purpose of light weight, which is advantageous for improving energy efficiency and reducing exhaust emissions. The Al-Si alloy is die-casting aluminum alloy with high strength and high weight, and is used as heat treatment reinforced alloy to improve the plasticity of the cast aluminum-silicon alloy mainly in the aspect of optimizing heat treatment process. However, the current research on heat treatment of Al-Si alloy mainly uses the traditional T6 treatment process, although the long-time heat treatment can eliminate the adverse effect of the inter-crystal eutectic Si phase and the brittle needle-shaped beta-Al 5 FeSi phase to a certain extent. But has no advantages in terms of effect, energy consumption and production efficiency, and the strength is often sacrificed to achieve small improvement of plasticity. The semi-solid processing technology is used as a novel metal forming method, and combines the advantages of the traditional forging method and the casting method. The semi-solid processing technique can produce a complex part with near net shape compared to the forging process, while the semi-solid processing technique can produce a structural member with excellent mechanical properties compared to the conventional casting method. In addition, the current demand for metallic materials has shifted to achieving high strength and high plasticity without losing other properties. Heterostructure metal materials are rapidly becoming an important research hotspot due to their superior mechanical and physical properties. Heterostructure (HS) materials are characterized by non-uniform regions with differences in mechanical or physical properties. In the large plastic deformation process, heterogeneous deformation induced strengthening stress (HDI) is generated due to interaction between the soft region and the hard region due to micro-scale and mechanical property differences of the soft/hard region, so that the geometric necessary dislocation density with higher density is excited, continuous heterogeneous deformation induced strengthening stress strengthening is generated, and the strength and plasticity are synergistically improved. The mechanical properties of the material are far superior to those of the traditional homogeneous material. However, conventional processes typically require long-flow thermo-mechanical processing to produce heterostructure alloys. Such lengthy procedures result in complex, inefficient and costly ingredient optimization and tissue regulation processes. By taking advantage of the rheocasting process, little research is done on preparing heterostructure aluminum-silicon alloy by combining a multi-pass stage rolling process with a short-time heat treatment process, so that heterostructure preparation technology with simple equipment structure, high efficiency of the preparation process, low cost and obvious industrial application prospect is urgently needed. Disclosure of Invention The embodiment of the invention provides a layered heterostructure aluminum-silicon alloy part and a preparation method thereof, wherein an aluminum-silicon alloy layer and a pure aluminum layer are alternately laminated to form a layered heterostructure with a metallurgical bonding interface, wherein the aluminum-silicon alloy layer is used as a hard region and a pure aluminum soft region to cooperatively generate a heterogeneous deformation induction strengthening effect so as to solve the technical problem that the strength and plasticity of the cast aluminum-silicon alloy are difficult to cooperatively promote. The invention is realized by the following technical scheme that in the first aspect, the embodiment of the invention provides a layered heterostructure aluminum-silicon alloy part, which comprises a layered heterostructure with alternating soft regions and hard regions, wherein the hard regions comprise aluminum-silicon alloy matrix layers, the soft regions comprise pure aluminum reinforcing layers, and a metallurgical bonding interface is formed between the aluminum-silicon alloy matrix layers and the pure aluminum reinforcing layers. As an alternative embodiment, the layered heterostructure includes two aluminum-silicon alloy substrate layers sandwiching one of the pure aluminum reinforcement layers to form a sandwich-like structure, and the pure aluminum reinforcement layer is located between the two aluminum-silicon alloy substrate layers. As an alternative embodiment, the aluminum-silicon alloy substrate layer is composed of elements containing the following mass percentages: Si:5.