CN-122008643-A - Glass-based carrier plate and preparation method thereof

CN122008643ACN 122008643 ACN122008643 ACN 122008643ACN-122008643-A

Abstract

The application discloses a glass-based carrier plate and a preparation method thereof, wherein the glass-based carrier plate comprises a glass substrate, and the dielectric layer is positioned on at least one side of the glass substrate, and the insulating layer is positioned on one side of the dielectric layer away from the glass substrate. The medium layer comprises glass fiber cloth, wherein the glass fiber cloth comprises a plurality of warp yarns and a plurality of weft yarns, and the warp yarns and the weft yarns have different linear densities and/or different tensions. The difference between the warp yarn and the weft yarn is formed on the line density and/or the tension, so that the microscopic morphology of the interface between the glass substrate and the insulating layer is optimized, the peeling strength is improved, and the phenomenon of interface delamination between the glass substrate and the insulating layer is prevented. In addition, the dielectric layer is used as a flexible stress buffer structure, so that the transition of the thermal expansion coefficient between the glass substrate and the insulating layer can be effectively passivated, and the warping and cracking risks caused by thermal stress are remarkably reduced.

Inventors

HU KE
XIAO YUELEI
XU SHUANG
ZHAO ZUNHUI
FAN BOLIN
LI YUE
QIU JUNMING
XIAO HONGXI
CHEN XI

Assignees

北京京东方传感技术有限公司
京东方科技集团股份有限公司
北京京东方技术开发有限公司

Dates

Publication Date: 20260512
Application Date: 20260326

Claims (10)

1. A glass-based carrier plate, comprising: A glass substrate; The dielectric layer is positioned on at least one side of the glass substrate; the insulating layer is positioned on one side of the dielectric layer away from the glass substrate; The medium layer comprises glass fiber cloth, wherein the glass fiber cloth comprises a plurality of warp yarns and a plurality of weft yarns, and the warp yarns and the weft yarns have different linear densities and/or tensions.
2. The glass-based carrier plate of claim 1, wherein the warp yarn has a linear density greater than the weft yarn and the warp yarn has a tension greater than the weft yarn.
3. The glass-based carrier sheet of claim 2, wherein the warp yarns and the weft yarns are alternately interwoven in sequence in a same plane, wherein a plurality of the warp yarns are arranged in a first direction and a plurality of the weft yarns are arranged in a second direction, wherein the first direction and the second direction are in planes of the warp yarns and the weft yarns and are interdigitated.
4. The glass-based carrier sheet of claim 2, wherein a plurality of the warp yarns are sequentially arranged in a first direction to form a warp yarn layer, and a plurality of the weft yarns are sequentially arranged in a second direction to form a weft yarn layer, wherein the warp yarn layer and the weft yarn layer are stacked in a thickness direction, the weft yarn layer is positioned on a side facing the insulating layer, and the first direction and the second direction intersect each other.
5. The glass-based carrier sheet of claim 3 or 4, wherein the dielectric layer further comprises a resin matrix, the mass percent of the resin matrix in the dielectric layer being 30% -70%.
6. The glass-based carrier plate of claim 5, wherein the dielectric layer further comprises a filler comprising silicon dioxide and/or boron nitride.
7. The glass-based carrier sheet of claim 6, wherein the warp yarns and the weft yarns comprise E-glass fibers, NE-glass fibers, or S-glass fibers.
8. A method of preparing a glass-based carrier plate, comprising: preparing a glass fiber cloth, wherein the glass fiber cloth comprises a plurality of warp yarns and a plurality of weft yarns, and the warp yarns and the weft yarns have different linear densities and/or tensions; impregnating the glass fiber cloth into a resin matrix, and drying and semi-curing to form a prepreg; And sequentially overlapping the glass substrate, the prepreg and the insulating layer, and pressing in a vacuum environment to completely cure the resin matrix.
9. The method for preparing glass fiber cloth according to claim 8, comprising the following steps: Arranging a plurality of warp yarns along a first direction and a plurality of weft yarns along a second direction, so that the warp yarns and the weft yarns are alternately interweaved in turn in the same plane to form the glass fiber cloth with interweaving points, or Sequentially arranging a plurality of warp yarns along a first direction, and temporarily fixing the warp yarns by using a thermally decomposable glue line to form a warp yarn layer; sequentially arranging a plurality of weft yarns along a second direction, and temporarily fixing the weft yarns by using a thermally decomposable glue line to form a weft yarn layer; and overlapping the warp yarn layer and the weft yarn layer along the thickness direction, so that the weft yarn layer is positioned on one side facing the insulating layer, and forming the glass fiber cloth without interweaving points.
10. The method of manufacturing according to claim 8, further comprising, after impregnating the glass fiber cloth in a resin matrix and baking to semi-cure, forming a prepreg: and forming an array-arranged micro-groove structure on one side of the prepreg facing the insulating layer.

Description

Glass-based carrier plate and preparation method thereof Technical Field The application relates to the technical field of semiconductor packaging, in particular to a glass-based carrier plate and a preparation method thereof. Background Advanced packaging technology is developing towards heterogeneous integration, ultra-high I/O density and ultra-large size, and increasingly stringent requirements are being placed on the performance of package carriers. The traditional organic substrate has the problems of higher thermal expansion coefficient and limited in-plane dimensional stability, and serious warping is easy to cause when large-chip packaging is processed. In contrast, the glass substrate has extremely low and adjustable thermal expansion coefficient, is highly matched with a silicon chip, has high rigidity and excellent dimensional stability, and provides necessary mechanical support for oversized packaging. Meanwhile, the surface flatness of the glass substrate is excellent, fine processing of micron and even submicron lines is facilitated, and the glass substrate has good high-frequency electrical performance. However, the glass surface is smooth and chemically inert, the bonding strength between the glass and organic polymer materials such as ABF is insufficient, and interfacial delamination is easy to occur in wet heat assessment and thermal cycle test. In addition, the difference of thermal expansion coefficients of the glass substrate and the organic materials such as ABF exceeds an order of magnitude, and during the high thermal load packaging process such as reflow soldering, the generated high thermal mechanical stress is concentrated at an interface, so that the glass substrate is easily broken or defects occur in the ABF layer, and the risk of 'board explosion' exists. Disclosure of Invention The embodiment of the application provides a glass-based carrier plate and a preparation method thereof, which are used for solving the problems of interface layering, glass substrate cracking and plate explosion risk caused by insufficient bonding strength and mismatch of thermal expansion coefficients between a glass substrate and an organic polymer material. In a first aspect of an embodiment of the present application, there is provided a glass-based carrier plate, including: A glass substrate; The dielectric layer is positioned on at least one side of the glass substrate; the insulating layer is positioned on one side of the dielectric layer away from the glass substrate; The medium layer comprises glass fiber cloth, wherein the glass fiber cloth comprises a plurality of warp yarns and a plurality of weft yarns, and the warp yarns and the weft yarns have different linear densities and/or tensions. In some embodiments, the linear density of the warp yarns is greater than the linear density of the weft yarns, and the tension of the warp yarns is greater than the tension of the weft yarns. In some embodiments, the warp yarns and the weft yarns are alternately interwoven in turn in the same plane, wherein a plurality of the warp yarns are arranged in a first direction and a plurality of the weft yarns are arranged in a second direction, and the first direction and the second direction are located in the plane of the warp yarns and the weft yarns and are intersected with each other. In some embodiments, a plurality of warp yarns are sequentially arranged along a first direction to form a warp yarn layer, a plurality of weft yarns are sequentially arranged along a second direction to form a weft yarn layer, wherein the warp yarn layer and the weft yarn layer are stacked along a thickness direction, the weft yarn layer is positioned on one side facing the insulating layer, and the first direction and the second direction are mutually intersected. In some embodiments, the dielectric layer further comprises a resin matrix, wherein the mass percentage of the resin matrix in the dielectric layer is 30% -70%. In some embodiments, the dielectric layer further includes a filler comprising silicon dioxide and/or boron nitride. In some embodiments, the warp yarns and the weft yarns comprise E-glass fibers, NE-glass fibers, or S-glass fibers. In a second aspect of the embodiment of the present application, a method for preparing a glass-based carrier plate is provided, including: preparing a glass fiber cloth, wherein the glass fiber cloth comprises a plurality of warp yarns and a plurality of weft yarns, and the warp yarns and the weft yarns have different linear densities and/or tensions; impregnating the glass fiber cloth into a resin matrix, and drying and semi-curing to form a prepreg; And sequentially overlapping the glass substrate, the prepreg and the insulating layer, and pressing in a vacuum environment to completely cure the resin matrix. In some embodiments, the preparing a fiberglass cloth specifically includes: Arranging a plurality of warp yarns along a first direction and a plurality of weft yarns