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CN-122008680-A - Vacuum hot-press bonding device and method thereof

CN122008680ACN 122008680 ACN122008680 ACN 122008680ACN-122008680-A

Abstract

The invention relates to the field of precision manufacturing equipment and automatic control, in particular to a vacuum hot-pressing bonding device and a method thereof; comprises a base component, a pressing heating part, a servo driving part, a transmission force measuring part, a floating leveling part and an industrial personal computer; the system combines servo drive and force feedback to precisely control the pressing process, and has the core that the floating leveling part utilizes a universal ball head and a high temperature resistant disc spring to adaptively incline at the moment of contacting a glass substrate to absorb impact energy, and meanwhile, a transmission push rod penetrates through a vacuum cavity in a bellows dynamic sealing mode.

Inventors

  • ZHOU QINCHAO
  • FAN JINHUI
  • SHU WENPING
  • CHEN XIGE
  • WU SHUEN

Assignees

  • 科尔迅智能科技(深圳)有限公司

Dates

Publication Date
20260512
Application Date
20260410

Claims (10)

  1. 1. Vacuum thermocompression bonding device, its characterized in that includes: A base member including a base (101) and a vacuum chamber (102) fixed to the top thereof; The pressing heating part is arranged in the cavity (102) and comprises a lower heating table (201) fixed on the bottom surface of the cavity and an upper pressing head (202) arranged above the lower heating table, the top surface of the lower heating table (201) is used for placing a glass substrate (601), and the bottom surface of the upper pressing head (202) is parallel and opposite to the top surface of the lower heating table (201); A servo driving part which is arranged outside the top of the cavity (102) and comprises a motor bracket (301) and an alternating current servo motor (302) fixed on the motor bracket; The transmission force measuring part is connected with the motor (302) and the upper pressing head (202) and comprises a transmission push rod (401) and a strain gauge type force measuring meter (402), the motor (302) is in driving connection with the push rod (401), the push rod (401) penetrates through the cavity (102) and the bottom end of the push rod is connected with the force receiving end of the force measuring meter (402); The floating leveling part is matched and arranged between the output end of the dynamometer (402) and the upper pressing head (202), and comprises an upper connecting seat (501), a lower connecting plate (502), a universal ball head (503) and a high-temperature-resistant disc spring (504), wherein the universal ball head (503) is clamped between the upper connecting seat (501) and the lower connecting plate (502), and two ends of the high-temperature-resistant disc spring (504) respectively prop against the bottom surface of the connecting seat (501) and the top surface of the connecting plate (502); The industrial personal computer is connected with the control pressing heating part, the servo driving part, the transmission force measuring part and the floating leveling part.
  2. 2. Vacuum thermocompression bonding apparatus according to claim 1, wherein the transmission force measuring portion further comprises a ball screw (403), an output shaft of the ac servo motor (302) is connected to a screw shaft (404) of the ball screw (403), a nut flange (405) of the ball screw (403) is screwed to the transmission push rod (401), wherein the transmission push rod (401) is driven to move in a vertical direction when the ac servo motor (302) is operated.
  3. 3. Vacuum thermocompression bonding apparatus according to claim 2, wherein the output shaft of the ac servo motor (302) is directly connected to the screw shaft (404) of the ball screw (403) through a quincuncial elastic coupling (406).
  4. 4. The vacuum thermocompression bonding device according to claim 1, wherein a bellows movable seal ring (103) is provided at the top of the vacuum chamber (102), and the transmission push rod (401) vertically penetrates through the bellows movable seal ring (103) downward to extend into the vacuum chamber (102).
  5. 5. The vacuum thermocompression bonding device according to claim 1, wherein a hemispherical groove (505) is formed in the bottom surface center of the upper connecting seat (501), a lower hemispherical groove (506) is formed in the top surface center of the lower connecting plate (502), and the universal ball head (503) is arranged between the hemispherical groove (505) and the lower hemispherical groove (506) in a matching manner to form a spherical rotating pair.
  6. 6. The vacuum thermocompression bonding device according to claim 5, wherein the floating leveling portion further comprises four guide posts (507) uniformly distributed on the periphery of the universal ball head (503), the top ends of the guide posts (507) are fixed on the upper connecting seat (501), the bottom ends of the guide posts (507) penetrate through clearance holes of the lower connecting plate (502), and each guide post (507) is sleeved with the high temperature resistant disc spring (504).
  7. 7. The vacuum thermocompression bonding apparatus of claim 1, wherein the servo driving portion further comprises an incremental photoelectric encoder (303), the incremental photoelectric encoder (303) is connected to the ac servo motor (302) to obtain rotor position information and transmit to the industrial personal computer.
  8. 8. A control method applied to the vacuum thermocompression bonding apparatus according to any one of claims 1 to 7, characterized by comprising: S1, controlling a servo driving part to work, and driving an upper pressing head (202) to move downwards by a transmission push rod (401) and approach to a glass substrate (601) placed on a lower heating table (201); s2, controlling an industrial personal computer to continuously read force value data of a strain gauge type dynamometer (402) and calculate a force value change rate, and controlling an alternating current servo motor (302) to keep the current speed to be reduced when the force value change rate is smaller than or equal to a preset contact threshold value; s3, absorbing impact energy by using a floating leveling part and tilting until a force value output by the strain gauge type dynamometer (402) reaches a preset leveling confirmation threshold value, and controlling the alternating current servo motor (302) to stop rotating so as to finish passive leveling; s4, controlling the temperature of the lower heating table (201) to rise, reading the current contact force in real time, and obtaining force value deviation by the difference between the target bonding force and the current contact force; s5, multiplying the force value deviation by a virtual compliance coefficient representing a displacement compensation quantity corresponding to the unit force value deviation to calculate a downward-pressing displacement quantity, and controlling the alternating-current servo motor (302) to perform inching compensation so as to finish constant force application; s6, controlling the lower heating table (201) to stop heating, dividing a time axis of a cooling process into a plurality of sections, and calculating a descending gradient of the force value in each section; S7, multiplying the descending gradient by a pre-calibrated thermal stress release coefficient to obtain a safe contact force lower limit, and controlling the alternating current servo motor (302) to reversely retract, so that the real-time contact force dynamically approaches and is not lower than the safe contact force lower limit to attenuate, and thus thermal stress unloading is completed; And S8, controlling the alternating current servo motor (302) to rapidly reverse to lift the upper pressing head (202) when the temperature is reduced to a preset safe room temperature interval and the real-time contact force is attenuated to be within the zero point error allowable range, and circulating the steps S1 to S8.
  9. 9. The method according to claim 8, wherein the driving push rod (401) is arranged in a telescopic driving manner in the vertical direction of the vacuum cavity (102), and the step S1 is preceded by S0, controlling a manipulator to place two aligned glass substrates (601) on the top surface of the lower heating table (201), and controlling a vacuum pump to start so as to pump the interior of the vacuum cavity (102) to a target vacuum degree.
  10. 10. The control method according to claim 8, wherein in the step S5, when the force value deviation is a positive value, the industrial personal computer is controlled to convert the push-down displacement amount into a target pulse number, and the AC servo motor (302) is driven to slightly push down; And when the absolute value of the force value deviation falls into a preset error dead zone range, controlling the industrial personal computer to keep the current position of the alternating current servo motor (302) unchanged.

Description

Vacuum hot-press bonding device and method thereof Technical Field The invention relates to the field of precision manufacturing equipment and automatic control, in particular to a vacuum hot-press bonding device and a method thereof. Background In the current semiconductor device packaging and micro-electromechanical system manufacturing environment, vacuum hot-pressing bonding of a glass substrate is a necessary process for realizing chip air tightness protection and wafer level packaging, in the process, the substrate needs to be heated and softened in a vacuum clean cavity and bear continuous and uniform downward pressure to finish high-quality bonding, the vacuum hot-pressing bonding of the glass substrate is carried out, the conventional equipment generally depends on cables, pulleys and mechanical weights to provide continuous downward pressure, although the scheme has certain laminating capability under a conventional constant force application scene, particles are generated due to friction in the long-term operation of the structure, cleanliness in the vacuum cavity is seriously damaged, the flexible force transmission relation changes along with the elongation of a cable, the force transmission path lacks positioning precision and force value feedback meeting the requirement of a preset tolerance, the thickness change of the glass substrate is difficult to be stably adapted, meanwhile, when the glass substrate has thickness tolerance or wedge error, the rigid pressure head is in initial stage of contacting the substrate, partial stress concentration is caused, and the cracking risk of brittle material lamination is obviously increased. Therefore, how to eliminate the particle pollution generated by mechanical transmission and apply a measurable, adjustable continuous pressing force with passive posture buffer tolerance to the glass substrate in a vacuum environment becomes a technical problem to be solved. Disclosure of Invention In order to solve the technical problems, the invention provides a vacuum hot-press bonding device and a method thereof, and specifically, the technical scheme of the invention is as follows: in one aspect, the present invention provides a vacuum thermocompression bonding apparatus comprising: A base member including a base and a vacuum chamber fixed to the top thereof; the pressing heating part is arranged in the cavity and comprises a lower heating table fixed on the bottom surface of the cavity and an upper pressing head arranged above the lower heating table, the top surface of the lower heating table is used for placing glass substrates, and the bottom surface of the upper pressing head is parallel and opposite to the top surface of the lower heating table; the servo driving part is arranged at the outer side of the top of the cavity and comprises a motor bracket and an alternating current servo motor fixed on the motor bracket; the transmission force measuring part is connected with the motor and the upper pressing head and comprises a transmission push rod and a strain gauge type force measuring meter, the motor is in driving connection with the push rod, the push rod penetrates through the cavity, and the bottom end of the push rod is connected with the force receiving end of the force measuring meter; The floating leveling part is matched and arranged between the output end of the dynamometer and the upper pressing head and comprises an upper connecting seat, a lower connecting plate, a universal ball head and a high-temperature-resistant disc spring, wherein the universal ball head is clamped between the upper connecting seat and the lower connecting plate, and two ends of the high-temperature-resistant disc spring respectively prop against the bottom surface of the connecting seat and the top surface of the connecting plate; The industrial personal computer is connected with the control pressing heating part, the servo driving part, the transmission force measuring part and the floating leveling part. Further, the transmission force measuring part further comprises a ball screw, an output shaft of the alternating current servo motor is connected with a screw shaft of the ball screw, a nut flange of the ball screw is connected with the transmission push rod through threads, and when the alternating current servo motor works, the transmission push rod is driven to move in the vertical direction. Further, an output shaft of the alternating current servo motor is directly connected with a screw shaft of the ball screw through a quincuncial elastic coupling. Further, a bellows movable sealing ring is arranged at the top of the vacuum cavity, and the transmission push rod vertically penetrates through the bellows movable sealing ring downwards to extend into the vacuum cavity. Further, the bottom surface center of last connecting seat processing has the hemisphere recess, the top surface center processing of lower connecting plate has the hemisphere recess down, wher