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CN-122008685-A - Turntable, printing machine and working method thereof

CN122008685ACN 122008685 ACN122008685 ACN 122008685ACN-122008685-A

Abstract

The invention belongs to the technical field of screen printing equipment, and particularly relates to a turntable, a printing machine and a working method thereof. The rotary table is applied to screen printing of square whole silicon wafers, and comprises a rotary table body, at least two groups of stations are arranged in the circumferential direction of the rotary table body, each group of stations comprises a printing table surface and a transition table surface, the printing table surface is a glass table surface and is internally provided with first air flow air passages, the air passages of the first air flow air passages are densely distributed and are used for adsorbing and fixing the square whole silicon wafers in a printing process, the transition table surface is a plastic table surface and is internally provided with second air flow air passages, the air passages of the second air flow air passages are uniformly and sparsely distributed and are used for limiting and fixing the square whole silicon wafers in a silicon wafer rotating and transmitting process, and the air flow pressure of the first air flow air passages is larger than that of the second air flow air passages.

Inventors

  • ZUO GUOJUN
  • HU YONGTAO
  • Wang Liujia
  • ZHANG YAYUN

Assignees

  • 常州捷佳创智能装备有限公司

Dates

Publication Date
20260512
Application Date
20260401

Claims (10)

  1. 1. A turntable for screen printing of square whole silicon wafers, comprising: the rotary table comprises a rotary table body (1), wherein at least two groups of stations are arranged in the circumferential direction of the rotary table body (1); each group of stations comprises a printing table top (2) and a transition table top (3), the printing table top (2) is a glass table top and is internally provided with first air flow air passages (4), and the air passages of the first air flow air passages (4) are densely distributed and are used for adsorbing and fixing square whole silicon wafers (6) in the printing process; The transition table top (3) is a plastic table top and is internally provided with a second air flow air passage (5), and the air passages of the second air flow air passage (5) are uniformly and sparsely distributed and are used for limiting and fixing square whole silicon wafers (6) in the rotation transmission process of the silicon wafers (6); The air flow pressure of the first air flow channel (4) is larger than the air flow pressure of the second air flow channel (5).
  2. 2. Turntable as claimed in claim 1, characterized in that, The glass material of printing mesa (2) is borosilicate glass, first air current air flue (4) are including main air flue (41) and a plurality of branch air flue (42) of mutual intercommunication, the air-out end of branch air flue (42) evenly arranges on the loading surface of printing mesa (2), and the air-out end of branch air flue (42) covers the whole loading area of square whole piece silicon chip (6).
  3. 3. Turntable as claimed in claim 1, characterized in that, The plastic material of transition mesa (3) is antistatic rigid plastic, second air current air flue (5) are including a plurality of independent little air flue (50), the air-out end of little air flue (50) distributes in transition mesa (3) loading surface edge position for carry out negative pressure absorption to square whole piece silicon chip (6) edge.
  4. 4. Turntable as claimed in claim 1, characterized in that, The middle part of carousel body (1) is provided with rotary drive subassembly (10) for drive carousel body (1) is rotatory around the center pin and realizes circuit and the air route intercommunication of each station.
  5. 5. Printing machine comprising two independent printing hosts (7), a transport system (8) and a turntable according to any one of claims 1 to 4, The two printing hosts (7) are sequentially arranged along the transmission direction of the silicon wafers (6), the transmission system (8) comprises a feeding module (81), a discharging module (82) and a discharging module (83), and the feeding module (81) is used for synchronously transmitting two square whole silicon wafers (6) to a station of the turntable; the discharging module (82) is used for transferring the silicon wafer (6) conveyed by the turntable to a subsequent printing host machine (7); The blanking module (83) is used for synchronously blanking the square whole silicon wafers (6) subjected to double-wafer printing; Each printing host (7) comprises a printing module (71) and an independent lifting driving mechanism (72), wherein the lifting driving mechanism (72) is connected with the printing module (71) and is used for driving the printing module (71) to independently lift and adapt to the printing height of the square whole silicon wafer (6).
  6. 6. The printing press of claim 5, wherein the printing press is configured to, The printing modules (71) of the two printing hosts (7) comprise scrapers and ink return knives, the printing stations of the two printing hosts (7) are mutually independent, each printing host (7) only performs printing operation on a single square whole silicon wafer (6), and the printing direction is perpendicular to the main grid direction of the square whole silicon wafer (6).
  7. 7. The printing press of claim 5, wherein the printing press is configured to, The rotary table comprises a rotary table body (1) and is characterized in that four groups of stations are circumferentially arranged on the rotary table body (1) of the rotary table, a printing table surface (2) and a transition table surface (3) of each group of stations are of an integrated structure, the four groups of stations are uniformly distributed around a central shaft of the rotary table body (1), and the rotating angle of the rotary table is matched with the positions of printing stations of two printing hosts (7).
  8. 8. The printing press of claim 5, wherein the printing press is configured to, The printing host (7) is provided with a visual alignment module, the visual alignment module comprises a plate feeding camera and a plate discharging camera, the plate feeding camera is used for shooting and positioning the position of the silicon wafer (6) and transmitting data to the printing module (71), and the plate discharging camera is used for detecting the printing quality of the silicon wafer (6).
  9. 9. The printing press of claim 5, wherein the printing press is configured to, The feeding module (81) and the discharging module (82) are both provided with double-piece synchronous transmission tracks, the width of each transmission track is matched with the size of the square whole silicon wafer (6), and the transmission tracks are provided with clapping positioning assemblies for centering and positioning the silicon wafer (6).
  10. 10. A method of operating a printing press according to any one of claims 5 to 9, comprising the steps of: S1, double-piece feeding, wherein a feeding module (81) synchronously transmits two square whole pieces of silicon wafers (6) to the same group of stations of a rotary table, one piece of silicon wafers (6) is arranged on a printing table top (2), the other piece of silicon wafers (6) is arranged on a transition table top (3), and the printing table top (2) and the transition table top (3) of the rotary table respectively fix the silicon wafers (6) through a first air flow air passage (4) and a second air flow air passage (5); S2, a first piece of printing is carried out, wherein the rotary table rotates to a printing station of a first printing host machine (7), a lifting driving mechanism (72) of the first printing host machine (7) drives a printing module (71) to descend to a preset height, a scraper and an ink returning knife of the printing module (71) cooperate to act, screen printing is carried out on a first square whole piece of silicon wafer (6) on a printing table top (2), and a second piece of silicon wafer (6) on a transition table top (3) is in a standby state and does not carry out printing; S3, discharging the two silicon wafers, namely after printing of the first silicon wafer (6) is completed, rotating the turntable to the position of a discharging module (82), synchronously transferring the two silicon wafers (6) to the feeding end of a second printing host machine (7) by the discharging module (82), exchanging the positions of the two silicon wafers (6), arranging the second silicon wafer (6) on the original transition table top (3) on the printing table top (2) of the corresponding turntable of the second printing host machine (7), and arranging the first silicon wafer (6) on the original printing table top (2) on the transition table top (3) of the corresponding turntable; S4, second piece printing, namely driving a printing module (71) to descend to a preset height by a lifting driving mechanism (72) of a second printing host (7), enabling a scraper and an ink returning knife of the printing module (71) to act in a matched mode, performing screen printing on a second square whole piece of silicon wafer (6) on a printing table top (2), enabling a first piece of silicon wafer (6) on a transition table top (3) to be in a standby state, and not performing printing; S5, blanking the two silicon wafers, namely after the second silicon wafer (6) is printed, rotating the rotary table to the position of the blanking module (83), and synchronously blanking the two square whole silicon wafers (6) which are printed by the blanking module (83) to finish one-time double-wafer printing operation.

Description

Turntable, printing machine and working method thereof Technical Field The invention belongs to the technical field of screen printing equipment, and particularly relates to a turntable, a printing machine and a working method thereof. Background Screen printing is a key process in the manufacture of photovoltaic cells for precisely printing electrode grid lines on the surface of a silicon wafer. In order to improve the production efficiency, a double-station synchronous printing technology has been developed, which aims to print two silicon wafers on the same equipment at the same time. In the prior art, as disclosed in CN118700687A, a synchronous and homodromous double-half accurate screen printer is disclosed, a single machine is adopted to integrate a structure of a double-scraper module, printing of two rectangular half battery pieces is completed at different stations of the same rotary table, the piece feeding direction is adapted to the length direction of a rectangular silicon wafer, and the printing requirement of the printing direction vertical to a main grid is realized after 90-degree rotation. The technical scheme has the following defects that firstly, the printing station structure is complex and compact due to the highly integrated double-scraper module, when a single scraper module needs to be maintained, replaced or cleaned, the operation space is narrow, the stability of another module is possibly influenced, even the whole machine is required to be stopped, and the maintainability and the usability of equipment are reduced. Secondly, the method aims at a rectangular half-wafer silicon wafer which needs to be rotated for alignment, alignment errors can be introduced in the rotation process, and the process flow is designed for the half-wafer, so that the method is not suitable for an efficient printing scene of a square whole-wafer silicon wafer which does not need to be rotated. In addition, the load-bearing table (turntable) of existing printers typically employs a uniform air-flow adsorption design that provides the same adsorption force during both printing and non-printing phases. Although the silicon wafer can be ensured to be stable, in a non-printing transition station, excessive adsorption force is not necessary, so that compressed air is wasted and energy consumption is increased. Therefore, a dual-station screen printing solution for square whole silicon wafers, which has more reasonable structural design, is convenient to maintain and clean and can reduce energy consumption is needed. It should be noted that the above information disclosed in this background section is only for understanding the background of the inventive concept and therefore the above description is not to be construed as constituting information of the related art. Disclosure of Invention Embodiments of the present disclosure provide at least a turntable, a printing press, and a method of operating the same. In a first aspect, an embodiment of the present disclosure provides a turntable applied to screen printing of square whole silicon wafers, including: The rotary table comprises a rotary table body, wherein at least two groups of stations are arranged in the circumferential direction of the rotary table body; each group of stations comprises a printing table top and a transition table top, the printing table top is a glass table top and is internally provided with first air flow air passages, and the air passages of the first air flow air passages are densely distributed and are used for adsorbing and fixing square whole silicon wafers in the printing process; the transition table top is a plastic table top and is internally provided with a second air flow air passage, and the air passages of the second air flow air passage are uniformly and sparsely distributed and are used for limiting and fixing square whole silicon wafers in the process of rotating and transmitting the silicon wafers; the air flow pressure of the first air flow channel is greater than the air flow pressure of the second air flow channel. In an optional implementation manner, the glass material of the printing table is borosilicate glass, the first airflow channel comprises a main air channel and a plurality of branch air channels which are mutually communicated, the air outlet ends of the branch air channels are uniformly distributed on the bearing surface of the printing table, and the air outlet ends of the branch air channels cover the whole bearing area of the square whole silicon wafer. In an optional embodiment, the plastic material of the transition table top is antistatic hard plastic, the second airflow air passage comprises a plurality of independent micro air passages, and the air outlet ends of the micro air passages are distributed at the edge position of the bearing surface of the transition table top and are used for carrying out negative pressure adsorption on the edge of the square whole silicon wafer. In an altern