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CN-122008696-A - Liquid ejecting head, head module, and liquid ejecting apparatus

CN122008696ACN 122008696 ACN122008696 ACN 122008696ACN-122008696-A

Abstract

The invention provides a liquid ejecting head, a head module and a liquid ejecting apparatus capable of well inhibiting the reduction of liquid ejecting performance. The liquid ejecting head (1) is provided with a MEMS part (10) as a substrate part, which is provided with at least a nozzle for ejecting liquid, a flow passage communicating with the nozzle, and a piezoelectric element, and a frame member (5) which is bonded to the MEMS part (10) by an adhesive. The frame member (5) and the MEMS part (10) have a bonding region bonded by an adhesive and a non-bonding region not bonded by the adhesive. The joint region is provided at least around the upper part (20 a) of the common supply flow path main flow and the upper part (20 b) of the common recovery flow path main flow, which are communication parts of the frame members (5), and at the end parts of the frame members (5). All the non-joined regions (9 b) are not filled with the member and become hollow portions having predetermined voids.

Inventors

  • Watari kaisuke

Assignees

  • 株式会社理光

Dates

Publication Date
20260512
Application Date
20250909
Priority Date
20241112

Claims (13)

  1. 1. A liquid ejection head, characterized by comprising: a substrate part having at least a nozzle for ejecting liquid, a flow path communicating with the nozzle, and a piezoelectric element, and A frame member having a communication portion communicating with the flow passage and bonded to the substrate member by an adhesive, The frame member and the substrate member have a joint region joined by the adhesive and a non-joint region not joined by the adhesive therebetween, The joint regions are provided at least around the communication portion of the frame member and at the end portions of the frame member, and all the non-joint regions are hollow portions not buried by the members.
  2. 2. The liquid ejecting head as recited in claim 1, wherein: the joint region is only the periphery of the communication portion of the frame member and the end portion of the frame member in the longitudinal direction.
  3. 3. The liquid ejecting head as recited in claim 2, wherein: The joint region around the communicating portion and the joint region at the end in the longitudinal direction are discontinuous.
  4. 4. The liquid ejecting head as recited in claim 1, wherein: The joint region of the end portion is provided at an end portion of the frame member in the longitudinal direction, and overlaps with an end portion side of the piezoelectric element arrangement region in the longitudinal direction in which the piezoelectric element is arranged, in a cross section perpendicular to the short side direction of the liquid ejecting head.
  5. 5. The liquid ejecting head as recited in claim 1, wherein: The communicating portions are provided on both sides in the short side direction of the frame member, The joint region of the end portions is provided at the end portions in the longitudinal direction of the frame member, The frame member and the substrate member have a joint region and one or more non-joint regions on a central side in the longitudinal direction between the frame member and the substrate member, and the joint region connects a joint region around a communication portion provided on one side in the short-side direction and a joint region around a communication portion provided on the other side in the short-side direction.
  6. 6. The liquid ejecting head as recited in claim 1, wherein: a groove is provided in a portion of the frame member corresponding to the non-joined region.
  7. 7. The liquid ejecting head as recited in claim 1, wherein: An opening is provided in a portion of the frame member corresponding to the non-joined region.
  8. 8. The liquid ejecting head as recited in claim 1, wherein: the linear expansion coefficient of the base plate part is smaller than the linear expansion coefficient of the frame member.
  9. 9. The liquid ejecting head as recited in claim 1, wherein: the substrate part is formed of a member made mainly of silicon.
  10. 10. The liquid ejecting head as recited in claim 1, wherein: The adhesive is a thermosetting resin, and the coefficient of linear expansion of the adhesive is greater than the coefficient of linear expansion of the substrate part.
  11. 11. The liquid ejecting head as recited in claim 1, wherein: the Young's modulus of the adhesive after curing is more than 2 Gpa.
  12. 12. A head module including a liquid ejecting head, characterized in that: As the liquid ejecting head, a plurality of the liquid ejecting heads described in claim 1 are used.
  13. 13. A device for ejecting a liquid, comprising: the liquid ejection head of claim 1 or the head module of claim 12, and A holding portion that holds the liquid ejection head or the head module.

Description

Liquid ejecting head, head module, and liquid ejecting apparatus Technical Field The present invention relates to a liquid ejecting head, a head module, and a device for ejecting liquid. Background Conventionally, there is known a liquid ejecting head including a substrate member having at least a nozzle for ejecting liquid, a flow path communicating with the nozzle, and a piezoelectric element, and a frame member having a communicating portion communicating with the flow path and joined to the substrate member by an adhesive. In patent document 1, the liquid ejecting head includes a joint region in which a head housing is joined by an adhesive and a non-joint region in which the head housing is not joined by the adhesive, between a head main body as a substrate member and the head housing as a frame member. In addition, the potting agent filled in the opening portion provided in the head case and protecting the driving IC or the like that drives the piezoelectric element flows into a part of the non-joint region between the head main body and the head case, and the head case is also joined to the head main body by the potting agent flowing into the non-joint region. However, there is a possibility that the liquid ejection performance is lowered. [ Patent document 1 ] Japanese patent No. 4735819 Disclosure of Invention In order to solve the above problems, the present invention provides a liquid ejecting head comprising a substrate member having at least a nozzle for ejecting a liquid, a flow path communicating with the nozzle, and a piezoelectric element, and a frame member having a communicating portion communicating with the flow path and bonded to the substrate member by an adhesive, wherein the frame member and the substrate member have a bonding region bonded by the adhesive and a non-bonding region not bonded by the adhesive, the bonding region is provided at least around the communicating portion of the frame member and at an end portion of the frame member, and all the non-bonding regions are hollow portions not buried by the member. According to the present invention, the decrease in the liquid ejecting performance can be well suppressed. Drawings Fig. 1 is an external perspective view illustrating a liquid ejecting head according to an embodiment. Fig. 2 is a diagram illustrating the engagement of the MEMS component and the frame member in the present embodiment. Fig. 3 (a) is a perspective view of a conventional bonding region, (b) is a sectional view of A-A of (a), and (c) is a stress distribution diagram of a nozzle forming region of a conventional MEMS component. Fig. 4 (a) and (b) are diagrams illustrating the joining of the frame member and the MEMS component according to the present embodiment. Fig. 5 (a) is a perspective view of the bonding region according to the present embodiment, (B) is a B-B sectional view of (a), and (c) is a stress distribution diagram of the nozzle forming region of the MEMS component according to the present embodiment. Fig. 6 is a view illustrating an example in which a non-joined region is divided into a plurality of joined regions. Fig. 7 is a view showing an example in which the joint region at the longitudinal end is discontinuous with the joint region around the common supply flow path main flow and the common recovery flow path main flow. Fig. 8 (a) and (b) are diagrams illustrating an example in which a groove is formed in a portion corresponding to a non-joined region of a frame member. Fig. 9 (a) and (b) are diagrams illustrating an example of opening at a portion corresponding to the non-joined region 9b of the frame member 5. Fig. 10 is an exploded perspective view illustrating a head module according to the present embodiment. Fig. 11 is an exploded perspective view of the head module according to the present embodiment, as seen from the nozzle surface side. Fig. 12 is a schematic explanatory diagram of the printing apparatus according to the embodiment. Fig. 13 is a top view illustrating an example of a head unit of the printing apparatus. Fig. 14 is a top plan view illustrating a main part of an example of the printing apparatus. Fig. 15 is a side view illustrating a main part of an example of the printing apparatus. Fig. 16 is a top view illustrating a main portion of an example of the liquid ejecting unit. Fig. 17 is a front view illustrating an example of the liquid ejecting unit. Detailed Description An embodiment of the present invention applied to a liquid ejecting head provided in a device for ejecting liquid will be described below. Fig. 1 is an external perspective view illustrating a liquid ejecting head according to an embodiment. The liquid ejecting head 1 of the present embodiment includes a MEMS (Micro Electro MECHANICAL SYSTEMS: micro Electro mechanical system) component 10 as a substrate component, a frame member 5, and a substrate (flexible wiring substrate) 101 on which a driving circuit 102 is mounted. The MEMS component 10 inclu