CN-122009635-A - SMT packaging tape with low material throwing rate and self-adaptive cover tape stripping force adjusting method thereof

Abstract

The invention relates to the technical field of SMT packaging tape, and discloses a self-adaptive adjustment method for the peeling force of a low-throwing SMT packaging tape and a cover tape thereof, which comprises a battery pack bottom shell and a shell, wherein the two ends of the top of the battery pack bottom shell are respectively provided with the shell through fasteners, a separation pressing plate is arranged at the inner upper end of the battery pack bottom shell, the top of separating the clamp plate is provided with high-voltage pencil, high-voltage controller is installed to the one end of high-voltage pencil, the bottom of separating the clamp plate is provided with separates the mounting bracket, be provided with a plurality of lithium cell on the separation mounting bracket, the fin has been hugged closely to one side of lithium cell. According to the invention, the separation pressing plate, the separation mounting frame, the cooling fins and the fastening bolts are arranged, and the mutual matching effect between the separation pressing plate, the separation mounting frame, the cooling fins and the fastening bolts is utilized, so that the battery pack can be divided into a plurality of independent modules, each module shell is attached with the aluminum cooling fins, and the cooling fins are connected through the fastening bolts to be independently disassembled for cleaning or replacement, thereby being convenient for maintenance and replacement.

Inventors

• HUANG YUYING

Assignees

• 苏州英特包装材料有限公司

Dates

Publication Date

20260512

Application Date

20260212

Claims (10)

1. 1. The SMT packaging tape with low material throwing rate is characterized by comprising a carrier tape main body, a cover tape layer, an intelligent stripping force adjusting layer arranged between the carrier tape main body and the cover tape layer, a stripping sensing unit and a data feedback module, wherein the intelligent stripping force adjusting layer is used for changing the adhesive strength between the cover tape and the carrier tape according to a control signal so as to realize self-adaptive adjustment of the stripping force of the cover tape.
2. 2. The SMT packaging tape with low throwing power of claim 1, wherein the intelligent stripping force adjusting layer comprises at least one of a thermal response adhesive layer, an electrically controlled adhesive layer or a microstructure adjusting layer.
3. 3. The SMT packaging tape with low throwing power according to claim 1, wherein the peeling sensor unit is arranged at the edge area of the carrier tape and is used for detecting the peeling force and the peeling angle of the cover tape.
4. 4. The SMT packaging tape with low material throwing rate according to claim 1, wherein the data feedback module is communicated with a chip mounter control system to realize closed-loop control.
5. 5. The self-adaptive adjustment method for the cover tape stripping force of the SMT packaging tape with low material throwing rate is suitable for the SMT packaging tape with low material throwing rate, and is characterized by comprising the following steps of: step one, collecting stripping force data; step two, collecting throwing rate data; step three, establishing a stripping force and throwing rate model; step four, calculating a target stripping force parameter; and fifthly, adjusting the adhesive strength of the intelligent stripping force adjusting layer.
6. 6. The method for adaptively adjusting the cover tape peel force of an SMT packaging tape with low material throwing rate according to claim 5, wherein the model is a PID control model, a fuzzy control model or a neural network model.
7. 7. The method of claim 5, wherein the adjusting means comprises a heat-sealing temperature, an electric control voltage or a microstructure contact area.
8. 8. The method for adaptively adjusting the cover tape peel force of an SMT packaging tape with low material throwing rate according to claim 1, wherein the carrier tape body is made of PS, PET or paper-based composite material.
9. 9. The method for adaptively adjusting the cover tape stripping force of the SMT packaging tape with low material throwing rate according to claim 1, wherein the cover tape layer is of a PET composite film structure.
10. 10. The method for adaptively adjusting the cover tape peel force of a SMT packaging tape having a low throw rate according to claim 5 wherein the peel force adjustment forms a closed loop feedback control system.

Description

SMT packaging tape with low material throwing rate and self-adaptive cover tape stripping force adjusting method thereof Technical Field The invention relates to the technical field of SMT packaging tape, in particular to an SMT packaging tape with low throwing rate and a self-adaptive cover tape stripping force adjusting method thereof. Background With the development of miniaturization, high density and high reliability of electronic products, surface mounting technology has become a mainstream production mode in the electronic manufacturing industry. In order to realize high-speed and high-precision mounting of electronic components on an automatic chip mounter, the electronic components are generally packaged, transported and fed in a tape packaging mode formed by a carrier tape and a cover tape. The conventional SMT packaging tape generally includes a carrier tape body provided with a plurality of pockets for accommodating electronic components and a cover tape covering the carrier tape body, and the cover tape is sealed with the carrier tape by heat sealing or gluing to prevent the components from being shifted or lost during transportation and storage. In the process of pasting, the pasting machine peels off the cover belt through the peeling mechanism, and the suction nozzle sucks the electronic component from the trough and pastes. However, the cover tape peel force in the prior art is typically a fixed value and is primarily determined by the cover tape material, the type of adhesive layer, the heat seal temperature, pressure, and time, among other process parameters. Once the tape is packaged, the peel force characteristic is basically fixed, and cannot be dynamically adjusted according to the running state, environmental change or element characteristic of the chip mounter. The design of this fixed peel force has a number of disadvantages in practical applications. Firstly, when the stripping force is too large, a large instant impact force is generated in the stripping process of the cover tape, so that elements in the trough are easy to jump and even be thrown out of the trough, and a so-called 'throwing' phenomenon is formed. The throwing not only can cause element waste, but also can cause the shutdown alarm of the chip mounter, and seriously affects the production beat and the equipment utilization rate. Secondly, when the peeling force is too small, the sealing performance of the cover tape is insufficient, the components are easy to displace, turn over or overlap in the transportation and vibration processes, the suction failure or the mounting error is caused during the mounting, and the production yield is reduced. In addition, there are significant differences in the peel force requirements of electronic components of different sizes, weights and packaging forms. For example, micro-miniature passive devices (e.g., 0402, 0201) are extremely sensitive to peel force variations, while larger packaged integrated circuits require higher seal strength to prevent displacement during transportation. The prior art generally adapts to different components by changing different types of carrier tapes and cover tapes or adjusting packaging process parameters, but this approach has poor flexibility and is difficult to achieve fine control. On the other hand, environmental temperature and humidity changes can also affect the performance of the cover tape adhesive layer, resulting in the fluctuation of the peel force with environmental conditions. Particularly, after the patch is stored in a high-temperature and high-humidity environment or for a long time, the peel force of the cover tape can drift, so that the stability of the patch process is affected. The prior art lacks means to compensate in real time for environmental changes. In addition, along with the development of intelligent manufacturing and industrial Internet, the SMT production line is gradually upgraded to an intelligent and digital direction, but the conventional tape packaging system basically belongs to a passive structure, lacks sensing and feedback capabilities, cannot be cooperatively controlled with a chip mounter control system, and is difficult to realize closed-loop optimization control of the production process. Therefore, there is an urgent need for an intelligent SMT packaging tape structure and a self-adaptive adjustment method for the peeling force thereof, which can dynamically adjust the peeling force of the cover tape, reduce the material throwing rate, and adapt to different elements and environmental conditions, so as to improve the stability, reliability and production efficiency of the pasting process. Disclosure of Invention The invention aims to provide an SMT packaging tape with low throwing rate and a cover tape stripping force self-adaptive adjusting method thereof, so as to solve the problems in the background technology. In order to achieve the above purpose, the present invention provides the following t