CN-122009810-A - Carrier material transferring device for chip

Abstract

The invention relates to a carrier transfer device for chips, which comprises a first conveying component, a second conveying component, a first transfer component, a third conveying component and a fourth conveying component, wherein the first conveying component comprises a first movable carrying mechanism, the second conveying component comprises a second movable carrying mechanism, the first transfer component comprises a first movable clamping mechanism and an adsorption mechanism, the clamping end of the first clamping mechanism can extend into the carrying position of the first carrying mechanism, the adsorption end of the adsorption mechanism can extend into the carrying positions of the first carrying mechanism and the second carrying mechanism, the third conveying component comprises a second movable clamping mechanism, the clamping end of the third clamping mechanism can pass through the carrying position of the third carrying mechanism and extend into the clamping position of the second clamping mechanism, and the second transfer component comprises a material moving end of a material moving part which can extend into the carrying position of the third carrying mechanism and the carrying position of the second carrying mechanism. The carrier material transferring device for the chips can improve the material transferring efficiency of the chips and the assembly quality of the chips and the carriers.

Inventors

• LI SHENGHE
• DAI JUN
• LUO YINBING

Assignees

• 罗博特科智能科技股份有限公司

Dates

Publication Date

20260512

Application Date

20260228

Claims (10)

1. 1. The utility model provides a carrier transfer device for chip which characterized in that includes: the first conveying assembly comprises a movable first loading mechanism; the second conveying assembly comprises a movable second loading mechanism, and a conveying path of the second conveying assembly is parallel to that of the first conveying assembly; the first transfer assembly comprises a movable first clamping mechanism and an adsorption mechanism, wherein the clamping end of the first clamping mechanism can extend into the material carrying position of the first material carrying mechanism, and the adsorption end of the adsorption mechanism can extend into the material carrying positions of the first material carrying mechanism and the second material carrying mechanism; A third transport assembly including a second movable clamping mechanism; the fourth conveying assembly comprises a movable third clamping mechanism and a third loading mechanism, and the clamping end of the third clamping mechanism can pass through the loading position of the third loading mechanism and can extend into the clamping position of the second clamping mechanism; The second transfer assembly comprises a movable material moving part, and a material moving end of the material moving part can extend into a material carrying position of the third material carrying mechanism and a material carrying position of the second material carrying mechanism.
2. 2. The carrier material transferring device for chips of claim 1, wherein the first material transferring mechanism comprises a first movable seat, a first driving piece and a second driving piece, a protruding block is arranged at the edge of the first movable seat, a first material transferring space is surrounded by the protruding block, the first driving piece and the second driving piece are connected with the first movable seat, the output end of the first driving piece is connected with a first top block, the output end of the second driving piece is connected with a second top block, the moving path of the first top block is perpendicular to the moving path of the second top block, and the first top block and the second top block can be positioned in the first material transferring space.
3. 3. The carrier material transferring device for chips of claim 1, wherein the second material transferring mechanism comprises a second movable seat, a third driving piece and a fourth driving piece, a clamping block and a first baffle are arranged on the second movable seat, a second material transferring space is formed between the clamping block and the first baffle, the third driving piece and the fourth driving piece are connected with the second movable seat, the output end of the third driving piece is connected with a third top block, the output end of the fourth driving piece is connected with a fourth top block, the moving path of the third top block is perpendicular to the moving path of the fourth top block, and the third top block and the fourth top block can be located in the second material transferring space.
4. 4. The carrier transferring device for chips of claim 1, wherein the first clamping mechanism comprises a first driving module, a fifth driving member and first clamping jaws, the output end of the first driving module is connected with the fifth driving member, the two first clamping jaws are connected with the output end of the fifth driving member, and second baffles are arranged on opposite sides of the first clamping jaws.
5. 5. The carrier transfer apparatus for chips of claim 4, wherein the suction mechanism comprises a sixth driving member, a seventh driving member, and a connection plate, the sixth driving member is connected to the output end of the first driving module, the seventh driving member is connected to the output end of the sixth driving member, the connection plate is connected to the output end of the seventh driving member, the seventh driving member is capable of driving the connection plate to rotate, and the connection plate is connected to the first suction cup and the positioning column.
6. 6. The carrier transferring device for chips of claim 1, wherein the third conveying assembly further comprises a second driving module, the second clamping mechanism is connected with the output end of the second driving module, the second clamping mechanism comprises an eighth driving piece, a third baffle plate and a second clamping jaw, the second clamping jaw is connected with the output end of the eighth driving piece, and a clamping space is formed between the second clamping jaw and the third baffle plate.
7. 7. The carrier turning device for chips of claim 1, wherein the fourth conveying assembly further comprises a third movable seat, the third clamping mechanism comprises a ninth driving piece and a third driving module, the third driving module is connected with the third movable seat, the ninth driving piece is slidably connected with the third movable seat, the output end of the third driving module is connected with the ninth driving piece, and the output end of the ninth driving piece is connected with a third clamping jaw.
8. 8. The carrier material transferring device for chips of claim 7, wherein the third material transferring mechanism comprises a guide plate, a tenth driving member and an eleventh driving member, the guide plate is connected to the end of the third movable seat, the tenth driving member and the eleventh driving member are both connected with the third movable seat, the end of the tenth driving member is connected with a pressing plate, a material pressing space is formed between the pressing plate and the guide plate, a guide groove is formed in the guide plate, the output end of the eleventh driving member is connected with a fifth top block, and the end of the fifth top block can be located in the guide groove.
9. 9. The carrier transfer apparatus of claim 1, further comprising a first feeding assembly, wherein the first feeding assembly comprises a first feeding mechanism and a fourth clamping mechanism, and wherein a clamping end of the fourth clamping mechanism can be located in a feeding path of the first feeding mechanism and a loading position of the first loading mechanism.
10. 10. The carrier transferring device for chips of claim 1, further comprising a second feeding assembly, wherein the second feeding assembly comprises a twelfth driving member, a connecting frame and a second feeding mechanism, an output end of the twelfth driving member is connected with the connecting frame, the connecting frame can rotate, the second feeding mechanism is connected with the connecting frame, and a clamping end of the second clamping mechanism can be located in a feeding path of the second feeding mechanism.

Description

Carrier material transferring device for chip Technical Field The invention relates to the technical field of material transferring devices, in particular to a carrier material transferring device for chips. Background The chip is usually carried by using a key-type carrier after the production is completed, and the key-type carrier can be inserted into the material cage, so that the chip is convenient to transport and move. In order to facilitate the use and assembly of the chip, the chip needs to be moved into the fish bone carrier before the chip is used and assembled. Because the volume of the chip is smaller, the chip is transferred by using tools such as tweezers manually at present, but the transfer efficiency of the transfer mode is lower, and the long-time work of the manual work can lead to the assembly of part of chips and carriers not to be in place. Disclosure of Invention Therefore, the technical problem to be solved by the invention is to provide the carrier material transferring device for the chip, which can improve the material transferring efficiency of the chip and improve the assembly quality of the chip and the carrier. The invention provides a carrier transfer device for chips, which comprises a first conveying component, a second conveying component, a first transfer component, a second transfer component and a third conveying component, wherein the first conveying component comprises a movable first carrier mechanism, the second conveying component comprises a movable second carrier mechanism, a conveying path of the second conveying component is parallel to that of the first conveying component, the first transfer component comprises a movable first clamping mechanism and an adsorption mechanism, a clamping end of the first clamping mechanism can extend into a carrier position of the first carrier mechanism, an adsorption end of the adsorption mechanism can extend into carrier positions of the first carrier mechanism and the second carrier mechanism, the third conveying component comprises a movable second clamping mechanism, the fourth conveying component comprises a movable third clamping mechanism and a third carrier mechanism, a clamping end of the third clamping mechanism can pass through a carrier position of the third carrier mechanism and extend into a clamping position of the second clamping mechanism, and the second transfer component comprises a movable third carrier end of the carrier and a carrier position of the carrier. In an embodiment of the invention, the first loading mechanism comprises a first movable seat, a first driving piece and a second driving piece, wherein a bump is arranged at the edge of the first movable seat, a first loading space is surrounded by the bump, the first driving piece and the second driving piece are both connected with the first movable seat, the output end of the first driving piece is connected with a first top block, the output end of the second driving piece is connected with a second top block, the moving path of the first top block is perpendicular to the moving path of the second top block, and the first top block and the second top block can be both positioned in the first loading space. In an embodiment of the invention, the second loading mechanism comprises a second movable seat, a third driving piece and a fourth driving piece, a clamping block and a first baffle are arranged on the second movable seat, a second loading space is formed between the clamping block and the first baffle, the third driving piece and the fourth driving piece are both connected with the second movable seat, the output end of the third driving piece is connected with a third top block, the output end of the fourth driving piece is connected with a fourth top block, the moving path of the third top block is perpendicular to the moving path of the fourth top block, and the third top block and the fourth top block can be located in the second loading space. In one embodiment of the present invention, the first clamping mechanism includes a first driving module, a fifth driving member and a first clamping jaw, an output end of the first driving module is connected with the fifth driving member, two first clamping jaws are connected with an output end of the fifth driving member, and second baffles are disposed on opposite sides of the first clamping jaws. In one embodiment of the present invention, the adsorption mechanism includes a sixth driving member, a seventh driving member, and a connection plate, where the sixth driving member is connected to the output end of the first driving module, the seventh driving member is connected to the output end of the sixth driving member, the connection plate is connected to the output end of the seventh driving member, the seventh driving member is capable of driving the connection plate to rotate, and the connection plate is connected to the first suction cup and the positioning column. In one embodiment of th