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CN-122009818-A - Intelligent transfer device for AI chip and transfer method thereof

CN122009818ACN 122009818 ACN122009818 ACN 122009818ACN-122009818-A

Abstract

The invention provides an intelligent transfer device for an AI chip and a transfer method thereof, which are characterized by comprising a transfer table, wherein the left side and the right side of the transfer table are respectively connected with a stand column through bolts, the tops of the two stand columns are welded and connected with a top plate, a plurality of ion fans are arranged in the middle of the top plate, the side wall of each stand column is provided with a chute, the top of each chute is provided with a telescopic cylinder, the telescopic end of each telescopic cylinder is fixedly connected with a sliding plate, the side wall of each sliding plate is in sliding connection with a beam guide rail through a sliding component, and the device is connected with the parts such as the telescopic cylinders, a linear motor, a negative pressure generator, a visual positioning camera and the like through an external control system, so that automatic taking, positioning, transferring and discharging of the chip are realized, manual intervention is not needed, and errors and inefficiency problems caused by manual operation are effectively reduced.

Inventors

  • LIN TIANJIE

Assignees

  • 佛山市云枢互联科技有限公司

Dates

Publication Date
20260512
Application Date
20260317

Claims (7)

  1. 1. The utility model provides an intelligent transfer device for AI chip, its characterized in that includes the transfer platform, transfer platform left and right sides has the stand through bolted connection respectively, two stand top welded connection has the roof, the roof middle part sets up a plurality of ion fans, every the spout has all been seted up to the stand lateral wall, flexible cylinder is installed at the spout top, flexible end fixedly connected with slide of flexible cylinder, slide lateral wall passes through sliding component and crossbeam guide rail sliding connection, crossbeam guide rail sliding connection has linear electric motor B, be connected with negative pressure adsorption device on the linear electric motor B, be located the slide bottom fixedly connected with vision location camera of transfer platform one side, fixedly provided with workstation on the transfer platform roof.
  2. 2. The intelligent transfer device for AI chips as defined in claim 1, wherein a partition plate is disposed in the middle of the working table to partition the working table into two working areas, and the air outlet of the ion blower faces the working table of the transfer table.
  3. 3. The intelligent transportation device for the AI chip as set forth in claim 1, wherein the sliding assembly comprises a guide rail and a linear motor A, wherein the guide rail is fixedly connected to the side wall of the sliding plate, one side of the linear motor is slidably connected to the guide rail, and the other side of the linear motor A is fixedly connected to the cross beam.
  4. 4. The intelligent transfer device for the AI chip as set forth in claim 1, wherein a hanging rod is arranged beside the ion fan, a grating ruler is arranged at the rear side of the cross beam, and the grating ruler is arranged in parallel with the cross beam guide rail.
  5. 5. The intelligent transfer device for the AI chip as set forth in claim 1, wherein the negative pressure adsorption mechanism comprises an air pipe, a Bernoulli non-contact sucker and a negative pressure generator, the negative pressure generator is mounted on the transfer table and is connected with the Bernoulli non-contact sucker through the air pipe, an air inlet is formed in the center of the negative pressure generator, and an annular air groove is formed in the periphery of the negative pressure generator.
  6. 6. The intelligent transfer device for AI chips as defined in claim 1, wherein the transfer table is a rectangular table body horizontally arranged, and the material of the transfer table is antistatic aluminum alloy.
  7. 7. The intelligent transportation device for AI chips according to any one of claims 1-6, wherein the method for transporting AI chips using the device comprises the following steps: the method comprises the steps of S1, checking the states of all parts of a chip transferring device to ensure that all the parts work normally, orderly placing an AI chip to be transferred in a material taking area on one side of a workbench to ensure that the AI chip is not damaged and attached electrostatically, and cleaning dust and impurities on the surfaces of the material taking area, the material discharging area and the Bernoulli non-contact sucker to avoid influencing the transferring precision and the quality of the AI chip; S2, starting a plurality of ion fans on the top plate, and enabling the ion fans to continuously blow ion wind to the material taking area, the material discharging area, the Bernoulli non-contact sucking disc and the chip transferring path; s3, starting a visual positioning camera, performing high-definition shooting on an AI chip in a material taking area by the visual positioning camera, transmitting a shot AI chip image signal to a control system, analyzing an image by the control system through a visual algorithm, accurately identifying the position offset, the rotation angle and the placement posture of the AI chip, generating a positioning adjustment instruction, and transmitting the positioning adjustment instruction to a telescopic cylinder, a linear motor A and a linear motor B; Simultaneously, a linear motor A horizontally slides along a guide rail on the side wall of the slide plate to drive a beam guide rail to move to the position right above the material taking area, a linear motor B slides along the beam guide rail and cooperates with a displacement signal detected by a grating ruler in real time, and the control system finely adjusts the position of the linear motor B to ensure that the Bernoulli non-contact sucking disc is accurately aligned with the center position of the AI chip to be transported; s5, starting a negative pressure generator on the transfer table, wherein the negative pressure generator provides stable high-speed air flow for the Bernoulli non-contact sucker through an anti-static air pipe, the air flow is sprayed out along the tangential line of an annular air groove of the Bernoulli non-contact sucker, a uniform local low-pressure area is formed between the sucker and the AI chip, the AI chip is adsorbed by means of an air film suspension effect, and a preset air film gap is kept in the adsorption process; S6, after the adsorption is finished, the telescopic cylinder drives the sliding plate to vertically rise to a preset transfer height, so that collision between the AI chip and other parts of the device in the transfer process is avoided, then the linear motor A and the linear motor B act cooperatively to drive the Bernoulli non-contact sucker and the adsorbed AI chip to horizontally move along a preset transfer path, the Bernoulli non-contact sucker and the adsorbed AI chip are transferred to the position right above a discharging area of a workbench, the adsorption stability is maintained in the transfer process, and a grating ruler continuously detects the displacement of the linear motor B and feeds back the displacement to a control system to ensure that the transfer path is accurate and free of offset; S7, the vision positioning camera shoots the discharging area for the second time, the image signals of the position of the discharging area are transmitted to the control system, the control system performs the second positioning calibration, and after confirming that the discharging position is accurate, the telescopic cylinder drives the sliding plate to vertically descend to enable the AI chip to be close to the preset placing position of the discharging area; s8, after single transfer is completed, the telescopic cylinder, the linear motor A and the linear motor B act cooperatively to drive the Bernoulli non-contact sucker to reset to a preset position above the material taking area; And (2) repeating the steps S2-S7 to realize continuous and automatic transfer of the AI chips, closing all parts of the device after the transfer is completed, cleaning the material taking area, the material discharging area and the Bernoulli non-contact sucker, arranging the air pipes and the circuits, and hanging the air pipes and the circuits on a hanging rod to complete the transfer operation.

Description

Intelligent transfer device for AI chip and transfer method thereof Technical Field The invention relates to the technical field of chip transfer, in particular to an intelligent transfer device for an AI chip and a transfer method thereof. Background The AI chip is used as a core component of the artificial intelligent device, has the characteristics of high integration level, fine pins, weak antistatic capability and low mechanical strength, and the requirements of a transfer link in the production process on precision, antistatic and clamping protection are far higher than those of a common chip. The patent number CN210527846U discloses a chip transfer machine, which comprises a frame, a workbench, a pressing device, a suction nozzle device, a first feeding device and a second feeding device, wherein the first feeding device is spaced from the second feeding device, the output end of the first feeding device is connected with a test board, the output end of the second feeding device is connected with a tray, the first feeding device drives the test board to intermittently move and feed, the pressing device is positioned above the first feeding device and comprises a pressing plate, a buffer structure and a driver, the buffer structure is arranged below the pressing plate and connected with the output end of the driver, the suction nozzle device is selectively positioned above the first feeding device or the second feeding device and comprises at least two suction nozzles, a driving mechanism and a traversing mechanism, the suction nozzles are arranged at the output end of the driving mechanism, and the driving mechanism is arranged at the output end of the traversing mechanism. Therefore, the chip transfer machine has the advantages of effectively improving the working efficiency and reducing the damage of the test seat. However, the patent has the defects that firstly, the patent does not have an antistatic device in the chip transferring process, partial static electricity is generated in the process of frequently adsorbing and transferring chips, and then the chips are damaged, secondly, the transfer device only realizes transverse transfer and cannot perform vertical and space front-back displacement, so that inaccurate positioning can occur when the chips are transferred and positioned, the situation of inaccurate clamping of the chips occurs, and the chips are damaged due to more serious positioning inaccuracy. Disclosure of Invention According to the technical problems, the invention provides the intelligent transfer device for the AI chip and the transfer method thereof, which can eliminate static electricity of the AI chip and improve the transfer quality of the chip. The invention provides an intelligent transfer device for an AI chip and a transfer method thereof, which are characterized by comprising a transfer table, wherein the left side and the right side of the transfer table are respectively connected with a stand column through bolts, the tops of the two stand columns are welded and connected with a top plate, the middle part of the top plate is provided with a plurality of ion fans, the side wall of each stand column is provided with a chute, the top of each chute is provided with a telescopic cylinder, the telescopic end of each telescopic cylinder is fixedly connected with a sliding plate, the side wall of each sliding plate is in sliding connection with a cross beam guide rail through a sliding component, the cross beam guide rail is in sliding connection with a linear motor B, the linear motor B can transversely slide along the length direction of the cross beam guide rail, and the flexibility and the accuracy of chip transfer are improved. The linear motor B is connected with a negative pressure adsorption mechanism, the bottom of the sliding plate on one side of the transfer table is fixedly connected with a visual positioning camera, a high-definition industrial lens is selected as a lens of the visual positioning camera, an external light supplementing assembly (not shown) is matched with the lens, the position and the posture of a chip on the surface of the work table can be clearly photographed, and the top wall of the transfer table is fixedly provided with the work table. A partition board is arranged in the middle of the workbench to divide the workbench into two working areas, the air outlet of the ion fan faces to the workbench direction of the transfer table, the electrostatic charge control device is used for continuously blowing ion wind to the chip transferring area, neutralizing electrostatic charges on the surfaces of the chip, the workbench and the adsorption mechanism, and avoiding the risk of electrostatic breakdown of the chip from the source. The sliding assembly comprises a guide rail and a linear motor A, the guide rail is fixedly connected to the side wall of the sliding plate, one side of the linear motor A is in sliding connection with the guide rail, the