Search

CN-122010407-A - Glass composition, glass fiber and glass filler

CN122010407ACN 122010407 ACN122010407 ACN 122010407ACN-122010407-A

Abstract

Provided are a glass composition, glass fiber and glass filler which have a low linear expansion coefficient, a low dielectric constant and a low dielectric loss tangent and are suitable for mass production. A glass composition wherein ,55≤SiO 2 ≤65,6＜B 2 O 3 ≤20,12≤Al 2 O 3 ≤20,0≤MgO≤10,0≤CaO≤4,0≤SrO≤4,3≤ZnO≤12,0≤（Li 2 O＋Na 2 O＋K 2 O）≤2,0.1≤TiO 2 ≤5,0≤ZrO 2 ≤5, is at least one member selected from the group consisting of a), b) and c) in mass%. a) ZrO 2 is more than or equal to 0.1 and is less than or equal to 5. b) 56≤SiO 2 ≤65 and 12≤Al 2 O 3 ≤19, and substantially no BaO and As 2 O 3 .c）56≤SiO 2 ≤65,12≤Al 2 O 3 ≤19 and 3< ZnO≤12, substantially no As 2 O 3 .

Inventors

  • FUJIWARA HIROYASU
  • FUKUCHI HIDETOSHI
  • FAN QINGSHAN

Assignees

  • 日本板硝子株式会社

Dates

Publication Date
20260512
Application Date
20260310
Priority Date
20250311

Claims (20)

  1. 1. A glass composition, wherein, expressed in mass%, 55≤SiO 2 ≤65, 6<B 2 O 3 ≤20, 12≤Al 2 O 3 ≤20, 0≤MgO≤10, 0≤CaO≤4, 0≤SrO≤4, 3≤ZnO≤12, 0≤(Li 2 O＋Na 2 O＋K 2 O)≤2, 0.1≤TiO 2 ≤5, 0.1≤ZrO 2 ≤5。
  2. 2. A glass composition, wherein, expressed in mass%, 56≤SiO 2 ≤65, 6<B 2 O 3 ≤20, 12≤Al 2 O 3 ≤19, 0≤MgO≤10, 0≤CaO≤4, 0≤SrO≤4, 3≤ZnO≤12, 0≤(Li 2 O＋Na 2 O＋K 2 O)≤2, 0.1≤TiO 2 ≤5, 0≤ZrO 2 ≤5, Substantially free of BaO and As 2 O 3 .
  3. 3. A glass composition, wherein, expressed in mass%, 56≤SiO 2 ≤65, 6<B 2 O 3 ≤20, 12≤Al 2 O 3 ≤19, 0≤MgO≤10, 0≤CaO≤4, 0≤SrO≤4, 3<ZnO≤12, 0≤(Li 2 O＋Na 2 O＋K 2 O)≤2, 0.1≤TiO 2 ≤5, 0≤ZrO 2 ≤5, Substantially free of As 2 O 3 .
  4. 4. The glass composition according to any one of claims 1 to 3, wherein the content of SiO 2 , expressed as mass%, is 56≤SiO 2 ≤64.
  5. 5. The glass composition according to any one of claims 1 to 3, wherein the content of B 2 O 3 , expressed as mass%, is 8<B 2 O 3 ≤15.
  6. 6. The glass composition according to any one of claims 1 to 3, wherein the content of Al 2 O 3 , expressed as mass%, is 14< Al 2 O 3 ≤19.
  7. 7. The glass composition according to any one of claims 1 to 3, wherein the content of P 2 O 5 , expressed as mass%, is 0≤P 2 O 5 ≤6.
  8. 8. The glass composition according to any one of claims 1 to 3, wherein the content of MgO, expressed in mass%, is 0≤MgO≤6.
  9. 9. The glass composition according to any one of claims 1 to 3, wherein the CaO content is 0.5≤CaO≤4 in mass%.
  10. 10. The glass composition according to any one of claims 1 to 3, wherein the content of SrO, expressed in mass%, is 0.1≤SrO≤3.
  11. 11. The glass composition of any of claims 1-3, wherein the glass composition is substantially free of BaO.
  12. 12. The glass composition according to any one of claims 1 to 3, wherein the content of ZnO is 3< ZnO <8 in mass%.
  13. 13. The glass composition according to any one of claims 1 to 3, wherein the content of (MgO+CaO+SrO) is 1≤MgO+CaO+SrO≤15 in mass%.
  14. 14. The glass composition according to any one of claims 1 to 3, wherein the content of (MgO+CaO+SrO+ZnO) is 4≤MgO+CaO+SrO+ZnO≤20 in mass%.
  15. 15. The glass composition according to any one of claims 1 to 3, wherein the content of (Li 2 O＋Na 2 O＋K 2 O) is 0≤Li 2 O＋Na 2 O＋K 2 O≤1 in mass%.
  16. 16. The glass composition according to any one of claims 1 to 3, wherein the content of (Li 2 O＋Na 2 O＋K 2 O) is 0.1≤Li 2 O＋Na 2 O＋K 2 O≤1 in mass%.
  17. 17. The glass composition according to any one of claims 1 to 3, wherein the content of (Na 2 O＋K 2 O) is 0≤Na 2 O＋K 2 O≤1 in mass%.
  18. 18. The glass composition according to any one of claims 1 to 3, wherein the content of (TiO 2 ＋ZrO 2 ) is 1≤TiO 2 ＋ZrO 2 ≤8 in mass%.
  19. 19. The glass composition according to any one of claims 1 to 3, wherein the content of (ZnO+TiO 2 ＋ZrO 2 ) is 6≤ZnO+TiO 2 ＋ZrO 2 ≤15 in mass%.
  20. 20. The glass composition according to any one of claims 1 to 3, wherein the content of T-Fe 2 O 3 , expressed as mass%, is 0≤T-Fe 2 O 3 ≤5, Wherein T-Fe 2 O 3 is the total iron oxide converted to Fe 2 O 3 .

Description

Glass composition, glass fiber and glass filler Technical Field The present invention relates to a glass composition, glass fibers and glass fillers, and articles such as molded articles containing glass fibers or glass fillers. Background In electronic devices, a resin composition is widely used for constituting an electric insulating member and a mechanism member. Examples of the electric insulating member are connector housings for SMT (surface mount technology), FPC (flexible printed circuits), board-to-board, CPU (central processing unit) sockets, memory cards, card edges, optical connectors, and the like, reactance coil holders for LCD (liquid CRYSTAL DISPLAY) backlight, coils, flat plates, transformers, magnetic heads, and the like, opening and closing devices for relay cases, relay base switches, reflow dip solder switches, tact switches, and the like, sensor housings, capacitor housings, potentiometer housings, trimming potentiometer housings. Examples of the mechanism members are a lens holder and a pickup base for an optical pickup, an insulator and a terminal for a micro motor, and a drum for a laser printer. The resin composition is also used as a film such as a base film for FPC or a base film for a copper-clad laminate. In addition, a printed circuit board (printed circuit board) included in the electronic device also includes a substrate made of the resin composition. A printed wiring board (PRINTED WIRING board) before mounting of electronic components also has a substrate composed of a resin composition. Hereinafter, in the present specification, both the printed circuit board and the printed wiring board are referred to as "printed board". The resin composition contains a thermoplastic resin and glass fibers, and if necessary, a hardener, a modifier, and the like. The printed board may contain an inorganic filler. As the inorganic filler, a glass filler can be used. In recent years, in order to meet the demands for miniaturization of electronic devices and for thinning for high functionality, dimensional stability has been demanded for resin compositions, and accordingly, low thermal expansion coefficients and high elastic moduli have been demanded for constituent materials thereof. Patent documents 1 to 2 disclose glass compositions having a low linear thermal expansion coefficient and a low dielectric loss tangent, and glass fibers comprising the glass compositions. Patent document 3 discloses a glass for a resin composite substrate, which is integrated with the optical characteristics of a transparent resin, but has a relatively low linear thermal expansion coefficient. The glass composition disclosed in the example of patent document 1 contains SiO 2、Al2O3, mgO, caO, etc., and contains titanium oxide (TiO 2) in an amount of 0.6% to 4.0% by mass, and the content of boron oxide (B 2O3) is limited to 5.0% or less. The glass composition disclosed in the example of patent document 2 contains SiO 2、B2O3、Al2O3, mgO, etc., and contains zinc oxide (ZnO) in an amount of 4.0% to 7.5% by mass. In the example of patent document 2, a glass composition containing titanium oxide (TiO 2) is not disclosed. The glass composition disclosed in the example of patent document 3 contains SiO 2、B2O3、Al2O3, caO, and the like, and contains titanium oxide (TiO 2) in an amount of 1.2% to 4.0% by mass. Prior art literature Patent literature Patent document 1 Japanese patent application laid-open No. 2011-105554 Patent document 2 International publication No. 2012/104999 Patent document 3 Japanese patent application laid-open No. 2012-51773 Disclosure of Invention Problems to be solved by the invention With the miniaturization and high-functional reduction of electronic devices, dimensional stability is required for resin compositions constituting electronic devices, and low linear thermal expansion coefficients are required for glass fibers and glass fillers as constituent materials thereof. In addition, a resin composition constituting an electronic device is required to have low dielectric loss, and glass fibers and glass fillers as constituent materials thereof are required to have low dielectric constants and low dielectric loss tangents. Accordingly, an object of the present invention is to provide a novel glass composition which has a low linear thermal expansion coefficient, a low dielectric constant and a low dielectric loss tangent and is also suitable for mass production. Means for solving the problems The invention provides a glass composition, wherein, expressed in mass percent, 55≤SiO2≤65, 6<B2O3≤20, 12≤Al2O3≤20, 0≤MgO≤10, 0≤CaO≤4, 0≤SrO≤4, 3≤ZnO≤12, 0≤(Li2O＋Na2O＋K2O)≤2, 0.1≤TiO2≤5, 0.1≤ZrO2≤5。 The present invention provides, from another aspect, a glass composition, wherein, expressed in mass%, 56≤SiO2≤65, 6<B2O3≤20, 12≤Al2O3≤19, 0≤MgO≤10, 0≤CaO≤4, 0≤SrO≤4, 3≤ZnO≤12, 0≤(Li2O＋Na2O＋K2O)≤2, 0.1≤TiO2≤5, 0≤ZrO2≤5, Substantially free of BaO and As 2O3. The present invention provides, from another aspect, a