Search

CN-122010464-A - Vertical-arrangement graphene heat conducting film with high heat conduction and low interface thermal resistance and preparation method thereof

CN122010464ACN 122010464 ACN122010464 ACN 122010464ACN-122010464-A

Abstract

The invention belongs to the technical field of thermal control, and particularly relates to a vertically arranged graphene heat conducting film with high heat conduction and low interface thermal resistance and a preparation method thereof. The preparation method comprises the steps of firstly preparing a high-surface internal heat conduction graphene foam film, performing oxygen plasma treatment, bonding the high-surface internal heat conduction graphene foam film layer by layer into a laminated block body by using TPU hot melt adhesive, and cutting along the vertical direction of the laminated surface to obtain a finished product. According to the invention, graphene sheets are vertically arranged, the heat conductivity direction is consistent with a heat dissipation path, the graphene sheets have high out-of-plane heat conductivity coefficient and low interface thermal resistance, and the graphene sheets are good in product flexibility and are suitable for thermal management requirements of high-power devices, AI chips and the like.

Inventors

  • TAO TENG
  • DENG YUAN
  • HUA XIAOSHE
  • ZHOU HONG
  • FANG NA

Assignees

  • 浙江三元电子科技有限公司

Dates

Publication Date
20260512
Application Date
20260415

Claims (9)

  1. 1. The preparation method of the vertically arranged graphene heat conducting film with high heat conduction and low interface thermal resistance is characterized by comprising the following steps: (I) Preparation of high-in-plane heat conduction graphene foam film (I-1) carrying out blade coating and drying on graphene oxide slurry to form a film, so as to obtain a graphene oxide film; (I-2) performing preliminary reduction foaming on the graphene oxide film to obtain a foam graphene film; (I-3) continuously reducing the foam graphene film at a high temperature to obtain a high-in-plane heat conduction graphene foam film; (II) preparation of high-heat-conductivity graphene film laminated block (II-1) performing oxygen plasma treatment on the high-in-plane heat conduction graphene foam film to obtain a plasma treatment graphene foam film; (II-2) bonding the plasma treated graphene foam film layer by layer using a high elastic glue to form a high thermal conductivity graphene film laminate block; (III) preparation of high-heat-conductivity low-interface-thermal-resistance vertically-arranged graphene heat conducting film And cutting the graphene film laminated block body with high heat conduction into thin slices along the direction perpendicular to the laminated surface of the graphene film laminated block body, so as to obtain the vertically arranged graphene heat conduction film with high heat conduction and low interface thermal resistance.
  2. 2. The method for preparing the vertically aligned graphene thermal conductive film with high thermal conductivity and low thermal interface resistance according to claim 1, wherein in the step (I-1): the concentration of the graphene oxide slurry is 1-2wt%; and/or the thickness of the film formed by blade coating and drying is 5000-6000 mu m.
  3. 3. The method for preparing the vertically arranged graphene heat conducting film with high heat conductivity and low interface thermal resistance according to claim 1, wherein in the step (I-2), the preliminary reduction foaming mode is that the graphene oxide film is soaked in a reducing agent, taken out, naturally dried and then heated at 150-250 ℃.
  4. 4. The method for preparing the vertically aligned graphene thermal conductive film with high thermal conductivity and low interfacial thermal resistance according to claim 3, wherein the reducing agent is a hydrazine hydrate solution with the concentration of 1-2 wt%.
  5. 5. The method for preparing the vertically arranged graphene heat conducting film with high heat conductivity and low interface thermal resistance according to claim 1, wherein in the step (I-3), the continuous reduction treatment at high temperature is carried out by carbonizing at 1700-1800 ℃ for 3-4h and then at 3000-3200 ℃ for 1-2h.
  6. 6. The method for preparing the vertically arranged graphene heat conducting film with high heat conductivity and low interface thermal resistance according to claim 1, wherein in the step (II-1), the oxygen plasma treatment mode is that the energy is 80-100W, the oxygen flow is 50-60sccm, and the time is 3-5min.
  7. 7. The method for preparing a vertically aligned graphene thermal conductive film with high thermal conductivity and low thermal interface resistance according to claim 1, wherein in step (II-2): The high-elasticity adhesive is TPU hot melt adhesive; And/or the bonding mode is that the TPU hot melt adhesive is flatly paved between two layers of the plasma treatment graphene foam films, and the plasma treatment graphene foam films are bonded after being treated for 30-40s at 170-180 ℃.
  8. 8. The method for preparing a vertically aligned graphene thermal conductive film with high thermal conductivity and low thermal interface resistance according to claim 1, wherein in step (III): the cutting speed is 2-3mm/min; And/or the thickness of the sheet is 0.2-2mm.
  9. 9. The vertically aligned graphene thermal conductive film with high thermal conductivity and low thermal interface resistance obtained by the preparation method of any one of claims 1 to 8.

Description

Vertical-arrangement graphene heat conducting film with high heat conduction and low interface thermal resistance and preparation method thereof Technical Field The invention belongs to the technical field of thermal control, and particularly relates to a vertically arranged graphene heat conducting film with high heat conduction and low interface thermal resistance and a preparation method thereof. Background With the miniaturization and high-density integration of electronic equipment and the development of high-power devices, AI chips and data centers, higher and higher requirements are being put on heat conducting materials. The lack of heat dissipation capability has become a key technical bottleneck limiting its performance and reliability. The interface material is used for being filled between the radiator and the heat source so as to remove air and reduce contact thermal resistance. Conventional heat conductive silicone grease, phase change materials, heat conductive gaskets, etc. have the problem of low heat conductivity (typically < 5W/(m·k)). Graphene is considered an ideal thermally conductive material because of its extremely high intrinsic thermal conductivity coefficient (about 5300W/(m·k)). However, because graphene sheets are self-assembled by a solution method to obtain a graphene film, graphene sheets thereof are generally arranged in a horizontal orientation (parallel to the film plane). Heat is conducted efficiently in the in-plane direction, but when passing through the film thickness direction (i.e., the main path of heat dissipation of the device), it is necessary to span a large number of inter-laminar interfaces, resulting in a significant decrease in the thermal conductivity in the vertical direction and a higher thermal interface resistance with the contact surface. In the prior art, although an attempt is made to improve vertical heat conduction by constructing a three-dimensional structure, the process is often complex or the oriented arrangement of graphite sheets is difficult to realize, so that the heat conduction performance is limited, and the interface thermal resistance is still not ideal. The graphene foam film prepared by the patent CN103625085A is added with polymer fibers, and graphitization treatment is carried out at the later stage, but the non-grapheme carbon contained in the final product seriously reduces the heat conductivity of the graphene foam, the patent CN117486206A discloses a high-vertical heat conduction graphene frame, a composite material and a preparation method thereof, the graphene oxide film is bonded by using graphene oxide solution and then subjected to high-temperature graphitization treatment after being cut, the performance stability of the final product is difficult to ensure due to longer process, the patent CN113147115A discloses a heat conduction gasket and the preparation method thereof, and the graphene micro-plate, carbon fibers, boron nitride and other heat conduction fillers are added in the preparation process for improving the heat conductivity of glue solution for bonding the heat conduction film, and the addition of the heat conduction fillers can improve the heat conductivity of an adhesive to a certain extent, but also increases the thickness of the adhesive and influences the out-of-plane heat conductivity and heat resistance of the final product. Therefore, the technical scheme of the invention is provided based on the above. Disclosure of Invention In order to solve the problems in the prior art, the invention provides the interface heat conducting film with the vertically arranged graphene structure and the preparation method thereof, and the heat conducting film has high heat conductivity coefficient in the thickness direction and low interface thermal resistance, so that better selection is provided for the thermal management of various electronic products, particularly high-power devices. The scheme of the invention is to provide a preparation method of a vertically arranged graphene heat conducting film with high heat conduction and low interface thermal resistance, which comprises the following steps: (I) Preparation of high-in-plane heat conduction graphene foam film (I-1) carrying out blade coating and drying on graphene oxide slurry to form a film, so as to obtain a graphene oxide film; (I-2) performing preliminary reduction foaming on the graphene oxide film to obtain a foam graphene film; (I-3) continuously reducing the foam graphene film at a high temperature to obtain a high-in-plane heat conduction graphene foam film; (II) preparation of high-heat-conductivity graphene film laminated block (II-1) performing oxygen plasma treatment on the high-in-plane heat conduction graphene foam film to obtain a plasma treatment graphene foam film; (II-2) bonding the plasma treated graphene foam film layer by layer using a high elastic glue to form a high thermal conductivity graphene film laminate block; (III) preparation