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CN-122010559-A - Method and medium for manufacturing electronic component

CN122010559ACN 122010559 ACN122010559 ACN 122010559ACN-122010559-A

Abstract

The invention provides a technology for preventing quality degradation of an electronic component caused by chemical reaction of grinding scraps in sintering in the electronic component containing a ceramic material. The method for manufacturing an electronic component includes a step of preparing an unfired or low-temperature-fired electronic component body made of a ceramic material, a step of barrel-polishing the electronic component body, and a step of firing the barrel-polished electronic component body, wherein barrel-polishing is performed using a medium made of only a material sublimated at a temperature lower than that of the firing step, and the firing step includes sintering the electronic component body and burning out grinding dust generated by barrel-polishing.

Inventors

  • HIRANO MASAO

Assignees

  • 新东工业株式会社

Dates

Publication Date
20260512
Application Date
20251110
Priority Date
20241112

Claims (7)

  1. 1. A method for manufacturing an electronic component includes the steps of: A step of preparing an unfired or low-temperature-fired electronic component body made of a ceramic material; A step of barrel polishing the electronic component body, and Firing the electronic component main body polished by the roller; The barrel polishing is performed using a medium composed of only a material sublimated at a temperature lower than that of the firing step, The firing step includes sintering the electronic component body and causing the polishing dust generated during the barrel polishing to disappear.
  2. 2. The method for manufacturing an electronic component according to claim 1, wherein the temperature in the firing step is 800 ℃ or higher.
  3. 3. The manufacturing method of an electronic component according to claim 1 or 2, wherein the medium is formed of an organic substance or diamond.
  4. 4. The method for manufacturing an electronic component according to any one of claims 1 to 3, wherein the medium has a size of 6mm or less.
  5. 5. The method for manufacturing an electronic component according to any one of claims 1 to 4, wherein the electronic component manufactured from the electronic component body has a size of 4mm or less.
  6. 6. The method for manufacturing an electronic component according to any one of claims 1 to 5, wherein the electronic component manufactured from the electronic component body is a laminated ceramic capacitor.
  7. 7. A medium used in the method for manufacturing an electronic component according to any one of claims 1 to 6.

Description

Method and medium for manufacturing electronic component Technical Field The present disclosure relates to a method of manufacturing an electronic component and a medium. Background Patent document 1 discloses a method for manufacturing a laminated ceramic capacitor. In this manufacturing method, the laminate having the ceramic layer is polished by a roll polishing apparatus. The grinding media is formed of silica or alumina or both. A conductive paste film for external electrodes is formed on the polished laminate, and the laminate on which the conductive paste film is formed is baked. Prior art literature Patent literature Patent document 1 Japanese patent laid-open publication No. 2003-324007 Disclosure of Invention As in the manufacturing method described in patent document 1, an electronic component including a ceramic material is polished before firing. However, there is a risk that the abrasive dust containing the metal element reacts chemically at the time of firing. The polishing dust having undergone the chemical reaction risks affecting the quality of the electronic component. The present disclosure provides a technique capable of avoiding degradation of quality of an electronic component by chemical reaction of polishing dust at the time of sintering in the electronic component including a ceramic material. A method of manufacturing an electronic component according to one aspect of the present disclosure includes the following steps. (1) A step of preparing an unfired or low-temperature-fired electronic component body made of a ceramic material; (2) A step of barrel polishing the electronic component main body; (3) Firing the electronic component main body after the roller polishing; The barrel polishing is performed using a medium composed of only a material sublimated at a temperature lower than that of a firing step including sintering an electronic component and causing polishing dust generated by barrel polishing to disappear. A medium according to another aspect of the present disclosure is used in the method for manufacturing an electronic component. According to the present disclosure, in an electronic component including a ceramic material, deterioration of quality of the electronic component due to chemical reaction of polishing dust at the time of sintering can be avoided. Drawings Fig. 1 is a flowchart showing a method for manufacturing an electronic component according to an embodiment. Fig. 2 (a) is a cross-sectional view of an exemplary electronic component body, and fig. 2 (B) is a cross-sectional view of an exemplary electronic component. Fig. 3 (a) is a schematic diagram of an exemplary drum polishing apparatus, and fig. 3 (B) is a schematic diagram of an example of a cross section of a drum tank. Detailed Description Embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description thereof is omitted. The dimensional proportions of the drawings are not necessarily identical to the dimensional proportions illustrated. The terms "upper", "lower", "left" and "right" are used for convenience based on the illustrated state. Fig. 1 is a flowchart showing a method for manufacturing an electronic component according to an embodiment. The electronic component is an essential component of an electronic circuit, and includes a resistor, a capacitor, a transistor, and the like. Hereinafter, a case where the electronic component is a laminated ceramic capacitor (MLCC: multilayer Ceramic Capacitor) will be described as an example. The material of the ceramic is barium zirconate or calcium zirconate, and the material of the electrode is nickel having conductivity. The multilayer ceramic capacitor has a size of, for example, 4mm or less. As shown in fig. 1, in the manufacturing method, a green sheet is first manufactured (step S10). In step S10, a paste obtained by mixing a raw material powder of a ceramic dielectric and a binder is prepared. Next, the paste was spread in the form of a sheet on a carrier film composed of a resin, to obtain a green sheet. Next, as step S12, internal electrodes are provided on the green sheet. In step S12, a metal such as nickel is screen-printed on the green sheet. Next, as step S14, cutting and lamination are performed. First, a green sheet provided with internal electrodes is cut to a predetermined size. Then, the electrode patterns of the cut pieces are aligned and laminated. Next, as step S16, pressing is performed. In step S16, the laminated sheet group is integrated by pressure bonding in the thickness direction. Next, as step S18, cutting is performed. In step S18, the press-bonded sheet assembly is cut to the size of the laminated ceramic capacitor. Through the preparation steps of steps S10 to S18 (step S20), a plurality of electronic component bodies are obtained from the press