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CN-122010874-A - Flexible display device and dual-curing type photosensitive material

CN122010874ACN 122010874 ACN122010874 ACN 122010874ACN-122010874-A

Abstract

The application discloses a flexible display device, and a photosensitive material or compound suitable for patterning an insulating film or a protective film in flexible display manufacturing, wherein the compound is shown in a structural formula (I): (I) The photosensitive material has the advantages of low curing temperature, high elastic recovery rate and high light transmittance, overcomes the technical contradiction of the traditional insulating film material, and solves the color development problem of diazonaphthoquinone.

Inventors

  • JIN GUANGNAN
  • JIN JIAKE

Assignees

  • 连云港邃铸科技有限公司

Dates

Publication Date
20260512
Application Date
20251226

Claims (11)

  1. 1. A compound, characterized in that the compound is represented by structural formula (I): (I) wherein R1, R2, R3, R4 and Y are respectively and independently selected from bivalent organic groups; wherein R5, R6, R7 and R8 are respectively and independently selected from H or monovalent organic groups, Wherein X is selected from divalent organic groups containing epoxy groups.
  2. 2. The compound of claim 1, wherein R1, R2, R3, R4 are each independently selected from one or more of C1-C6 alkylene, heteroatom-containing C1-C6 alkylene, C3-C12 non-aromatic cyclic structure, heteroatom-containing C3-C12 non-aromatic cyclic structure, C5-C18 aromatic cyclic structure, heteroatom-containing C5-C18 aromatic cyclic structure; R5, R6, R7, R8 are each independently selected from one or more of H, a halogen atom, a C1-C6 alkyl group, a heteroatom-containing C1-C6 alkyl group, a C3-C12 non-aromatic cyclic structure, a heteroatom-containing C3-C12 non-aromatic cyclic structure, a C5-C18 aromatic cyclic structure, a heteroatom-containing C5-C18 aromatic cyclic structure; Y is selected from one or more of C1-C10 alkylene, C1-C10 alkylene containing hetero atoms, divalent organic groups containing aromatic rings with hetero atoms, divalent organic groups containing non-aromatic rings, and divalent organic groups containing non-aromatic rings with hetero atoms.
  3. 3. The compound according to claim 2, wherein R1, R2, R3 and R4 are each independently selected from H and halogen atoms 、-CH 2 -、-CH 2 -CH 2 -、-CH 2 -CH 2 -CH 2 -、-CH(CH 3 )-CH 2 -、-CH(CH 3 )-CH(CH 3 )-、-CH 2 -C(CH 3 ) 2 -CH 2 -、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 A combination of one or more of the following; r5, R6, R7 and R8 are respectively and independently selected from H、-CH 3 、-CH 2 -CH 3 、-CH(CH 3 )-CH 3 、-C(CH 3 ) 2 -CH 3 、-C(CH 3 ) 3 、-CH 2 -CH 2 -CH 3 、-CH 2 -CH(CH 3 )-CH 3 、-CH 2 -C(CH 3 ) 2 -CH 3 、-CH 2 -C(CH 3 ) 3 、 、 、 、 、 、 、 、 、 、 、 、 、 、 A combination of one or more of the following; Y is selected from ：-CH 2 -、-CH 2 -CH 2 -、-CH 2 -CH 2 -CH 2 -、-CH(CH 3 )-CH 2 -、-CH 2 -CH 2 -CH 2 -CH 2 -、-CH(CH 3 )-CH(CH 3 )-、-CH 2 -C(CH 3 ) 2 -CH 2 -、-CH 2 -CH 2 -CH 2 -CH 2 -CH 2 -、-CH 2 -CH 2 -CH 2 -CH 2 -CH 2 -CH 2 -、 、 、 、 、 、 、 、 、 、 、 A combination of one or more of the foregoing.
  4. 4. The compound of claim 1, wherein X comprises one or more of said epoxy groups.
  5. 5. The compound of claim 1, wherein X is-a (-B-T) n , wherein T is the epoxy group, B is selected from one or more of a single bond, -O-, -S-, -CO-, -c=n-, -COO-, -NH-, -CO-NH-, C1-C5 alkylene, a is an aromatic ring-containing organic group, and N is the number of epoxy groups.
  6. 6. The compound of claim 5, wherein X is selected from the group consisting of 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 A combination of one or more of the foregoing.
  7. 7. A photosensitive resin composition comprising the compound according to claim 1, a photoinitiator, and an epoxy curing agent.
  8. 8. The photosensitive resin composition according to claim 7, wherein the photoinitiator is 0.01 to 10% by weight of the compound, and the epoxy curing agent is 0.1 to 10% by weight of the compound.
  9. 9. The photosensitive resin composition as defined in claim 7, wherein said photosensitive resin composition further comprises a photosensitive agent, said photosensitive agent being 1 to 50% by weight of said compound, and/or The photosensitive resin composition further comprises a crosslinking agent which at least comprises a compound containing a thiol-olefin click reaction group, wherein the crosslinking agent accounts for 0.1-20% of the weight of the compound, and/or The photosensitive resin composition further comprises a filler, wherein the particle size of the filler is 1-200nm, and the filler accounts for 0.01-10% of the weight of the compound.
  10. 10. A method for producing the photosensitive resin composition according to claim 9, comprising: Dissolving the compound in a solvent; Adding an epoxy curing agent, a photoinitiator or a combination of one or more of a photosensitizer and a crosslinking agent; and adding a filler, and performing ultrasonic dispersion to obtain the photosensitive resin composition.
  11. 11. A flexible display device comprising a film prepared from the photosensitive resin composition of claim 7.

Description

Flexible display device and dual-curing type photosensitive material Technical Field The present invention relates to a photosensitive material, and more particularly, to a photosensitive material suitable for patterning an insulating film or a protective film in the manufacture of a flexible display. Background The flexible display is made of soft materials, and the flexible display device is deformable and bendable, so that compared with a traditional screen, the flexible screen has obvious advantages, is lighter and thinner in size, is lower than an original device in power consumption, is beneficial to improving the cruising ability of equipment, and is also higher than the traditional screen in durability degree based on the characteristics of being bendable and good in flexibility, so that the probability of accidental damage of the equipment is reduced. The flexible display device of Nokia provides a reference for the product design of a flexible screen, and then the development of the flexible display device enters a fast lane, wherein in 2013, three stars push out a flexible organic light-emitting diode (OLED) screen YOUM to replace a glass screen, LG DISPLAY is used for mass production of a flexible OLED panel of a smart phone for the first time, 2014 flexible science and technology releases a color flexible display screen with the thickness of 0.01 millimeter, the curl radius reaches 1 millimeter, japan Innova high-tech semiconductor energy laboratory displays a 5.9 inch flexible foldable OLED display screen, 2018, 6 months, flexible science and technology releases a global first flexible screen large-scale modulus production line, and in 2020 releases a third generation cicada wing full flexible screen, and in 2021, the invention patent of a folding device and a mobile terminal for flexible screen is published by BIAsia, relates to the optimization of a hinge structure of a rotating shaft, and a metal-free mask technology developed by Venuo enables pixel density to exceed 1700, and is applied to folding screen phones and wearable devices. Flexible displays require the formation of flexible insulating films on substrates such as PET/COP. The insulating film used at present comprises low-temperature (less than or equal to 80 ℃) curing resin and high-elasticity resin, wherein the adhesive force of the low-temperature curing resin on the flexible substrate is excellent (5B), but the elastic recovery rate is only 55-80% and cannot meet the repeated bending requirement, and the high-elasticity resin can reach more than or equal to 80% but needs to be cured at 230 ℃, so that the heat-sensitive substrate is easily damaged due to the higher curing temperature. In addition, the resin used for the conventional insulating film develops color by using diazonaphthoquinone, and also causes insufficient light transmittance. Disclosure of Invention The invention provides a flexible display device and a photosensitive material suitable for forming an insulating film or a protective film pattern in flexible display manufacturing, which have the advantages of low curing temperature, high elastic recovery rate and high light transmittance, and overcome the technical contradiction of the traditional insulating film material. In a first aspect, the present application provides a compound of formula (I): (I) wherein R1, R2, R3, R4 and Y are respectively and independently selected from bivalent organic groups; wherein R5, R6, R7 and R8 are respectively and independently selected from H or monovalent organic groups, Wherein X is selected from divalent organic groups containing epoxy groups. In a preferred embodiment, R1, R2, R3, R4 may be independently selected from one or more of C1-C6 (e.g., C1, C2, C3, C4, C5, C6) alkylene, heteroatom-containing C1-C6 (e.g., C1, C2, C3, C4, C5, C6) alkylene, C3-C12 (e.g., C4, C5, C6, C7, C8, C9, C10, C11) non-aromatic cyclic structure, heteroatom-containing C3-C12 (e.g., C4, C5, C6, C7, C8, C9, C10, C11) aromatic cyclic structure, C5-C18 (e.g., C6, C7, C8, C9, C10, C12, C14, C15) aromatic cyclic structure, heteroatom-containing C5-C18 (e.g., C6, C7, C8, C9, C10, C14, C15). In a preferred embodiment, R5, R6, R7, R8 are each independently selected from H, halogen atoms (e.g., cl or F or Br), alkyl groups of C1-C6 (e.g., C1, C2, C3, C4, C5, C6), heteroatom-containing C1-C6 (e.g., C1, C2, C3, C4, C5, C6) alkyl groups, non-aromatic cyclic structures of C3-C12 (e.g., C4, C5, C6, C7, C8, C9, C10, C11), heteroatom-containing C3-C12 (e.g., C4, C5, C6, C7, C8, C9, C10, C11), aromatic cyclic structures of C5-C18 (e.g., C6, C7, C8, C9, C10, C12, C14, C15), aromatic cyclic structures of C5-C18 (e.g., C6, C7, C8, C9, C12, C14, C15), or combinations thereof. In a preferred embodiment, Y is selected from one or more combinations of C1-C10 (e.g., C2, C3, C4, C5, C6, C7, C8, C9) alkylene, heteroatom-containing C1-C10 (e.g., C2, C3, C4, C5, C6, C7, C8, C9) alkylene, aromatic ring-containing divalent org