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CN-122011280-A - Resin with self-repairing function for packaging carrier plate and preparation method and application thereof

CN122011280ACN 122011280 ACN122011280 ACN 122011280ACN-122011280-A

Abstract

The application provides a resin with a self-repairing function for a packaging carrier plate, and a preparation method and application thereof. The application synthesizes a compound containing both benzocyclobutene structure and allyl structure, and a bismaleimide monomer containing boric acid ester bond. Further, the two monomers are prepolymerized and blended with an olefin monomer containing a benzocyclobutene structure to prepare the resin for the encapsulation carrier plate. In the application, due to the introduction of a large amount of benzocyclobutene structures, the cross-linking density and the conformational change can be greatly improved after the benzocyclobutene is thermally cured, and the thermal expansion coefficient of the material can be greatly reduced. Meanwhile, the prepared resin can be dynamically exchanged at high temperature due to the fact that the prepared resin contains borate bonds, a self-repairing function is given to the material, and good heat resistance is given to the material due to the high-rigidity structure of benzocyclobutene and bismaleimide. Therefore, the resin has the characteristics of low expansion and high heat resistance due to the self-repairing function, and is an ideal semiconductor packaging material.

Inventors

  • LI YUAN
  • WANG XIANGHUA
  • JI SHAOMIN
  • HUO YANPING
  • MU YINGXIAO

Assignees

  • 广东工业大学

Dates

Publication Date
20260512
Application Date
20260414

Claims (10)

  1. 1. The resin with the self-repairing function for the packaging carrier plate is characterized by comprising, by weight, 75-216 parts of a compound containing a benzocyclobutene structure and an allyl structure, 100-200 parts of a bismaleimide monomer containing a boric acid ester bond and 70-200 parts of an olefin monomer containing the benzocyclobutene structure.
  2. 2. The resin for packaging carrier boards with self-repairing function according to claim 1, wherein the compound containing benzocyclobutene structure and allyl structure is prepared from 53-134 parts by weight of hydroxyl-containing allyl compound, 53-183 parts by weight of halogenated benzocyclobutene, 61-207 parts by weight of acid-binding agent and 300-800 parts by weight of solvent.
  3. 3. The resin for packaging carrier boards with self-repairing function according to claim 2, wherein the hydroxyl-containing allyl compound is one or a mixture of more than two of the following structural formula compounds: 、 、 、 、 、 、 、 、 、 、 。
  4. 4. The resin for a package carrier with a self-repairing function according to claim 2, wherein the halogenated benzocyclobutene structure is Or (b) Wherein X is a chlorine atom or a bromine atom, and the substitution position is one or two of the 2,3,4 and 5 positions on the benzene ring.
  5. 5. The resin for a package carrier with a self-repairing function according to claim 2, wherein the acid binding agent is one or a mixture of two of potassium carbonate and triethylamine.
  6. 6. The resin for packaging carrier boards with self-repairing function according to claim 2, wherein the solvent is one or a mixture of more than two of acetone, butanone and tetrahydrofuran.
  7. 7. The resin for packaging carrier boards with self-repairing function according to claim 1, wherein the monomer structure of bismaleimide containing borate ester bonds is: 。
  8. 8. the resin for packaging carrier boards with self-repairing function according to claim 1, wherein the benzocyclobutene structure-containing olefin monomer is one or a mixture of more than two of the following structural formula compounds: 、 、 、 、 。
  9. 9. The method for preparing the resin for the package carrier plate with the self-repairing function according to claim 1, which is characterized by comprising the following steps of sequentially adding a compound containing a benzocyclobutene structure and an allyl structure and a bismaleimide monomer containing a borate bond into a three-necked flask, heating to 150 ℃, reacting for 1.5 hours, then cooling to 125 ℃, adding an olefin monomer containing the benzocyclobutene structure, continuously carrying out mechanical stirring reaction for 0.5 hour, and then taking out a prepolymer and crushing by using a crusher to obtain the resin for the package carrier plate with the self-repairing function.
  10. 10. The self-repairing composite material is characterized in that the preparation raw material is the resin for the packaging carrier plate with the self-repairing function as claimed in claim 1.

Description

Resin with self-repairing function for packaging carrier plate and preparation method and application thereof Technical Field The application relates to the technical field of semiconductors, in particular to a resin with a self-repairing function for a packaging carrier plate, and a preparation method and application thereof. Background With the development of the semiconductor field towards the direction of high integration and high computation, the number of layers of the packaging carrier plate is increased, the circuit is finer and more complex, and the circuit between different layers is conducted by virtue of the through blind holes, so that the number of the through blind holes in the packaging carrier plate is tens of thousands or even hundreds of thousands. And then, the packaging loading plate has the characteristics of high glass transition temperature and high modulus, so that the resin used for the insulating layer is relatively brittle, and microcracks are easy to occur in the drilling process, so that the reliability risks such as local short circuit or ion migration are caused. As such, drilling produces microcracks that severely affect the processing yield of the package carrier. How to avoid the generation of microcracks or realize the efficient repair of microcracks and manufacture high-quality through blind holes becomes a key technology for the urgent breakthrough in the field of semiconductor package carrier plates. In addition, with the development of high-performance chips, the number of connection points between the high-performance chips and the package carrier plate is exponentially increased, particularly, the development of advanced packages such as FCBGA (FCBGA) is performed, and in order to ensure that the chips and the package carrier plate realize high-precision packages and meet extremely high reliability requirements, the thermal expansion performance of the package carrier plate and the chips must have higher matching degree. Due to the fact that the chip hardly undergoes thermal expansion, the package carrier material must also have a very low coefficient of thermal expansion. BT resin prepared based on bismaleimide monomer has good heat resistance and heat resistance, and is widely applied to manufacturing packaging carrier plate materials. However, it is highly brittle and is prone to microcracking during large scale drilling, leading to product failure. And because of its too high coefficient of thermal expansion, it is difficult to meet advanced packaging requirements for high performance chips. Therefore, the development of the high-performance resin can avoid the generation of microcracks in the drilling process or has the microcrack repairing function, has lower thermal expansion coefficient and higher heat resistance, and has very important strategic significance for the semiconductor packaging field in China. Disclosure of Invention In order to overcome at least one of the problems in the prior art, the primary object of the present application is to provide a resin for packaging carrier boards with a self-repairing function, a preparation method and an application thereof, and a self-repairing composite material prepared based on the resin. The application designs and synthesizes a compound containing a benzocyclobutene structure, an allyl structure and a bismaleimide monomer containing a boric acid ester bond, and the two compounds and the olefin monomer containing the benzocyclobutene structure are prepolymerized through an Ene (an Ene reaction, an English: alder-Ene reaction or an Ene reaction) chain extension reaction to obtain the resin with a self-repairing function for the packaging carrier plate. The self-repairing function of microcrack is given to the resin by introducing a large amount of boric acid ester bonds, and the thermal curing of the resin can be further carried out by the presence of a large amount of benzocyclobutene structures, so that the crosslinking density of the material is greatly improved, and the thermal expansion coefficient is cooperatively reduced by utilizing the conformational change of a cured product. Therefore, the resin is applied to manufacturing the packaging loading plate, can repair microcracks generated in the drilling process, and can meet the high-precision and high-reliability packaging requirements of high-performance chips due to the low thermal expansion coefficient. In order to achieve the above object, the present application adopts the following technical scheme: the resin with the self-repairing function for the packaging carrier plate comprises, by weight, 75-216 parts of a compound containing a benzocyclobutene structure and an allyl structure, 100-200 parts of a bismaleimide monomer containing a boric acid ester bond, and 70-200 parts of an olefin monomer containing the benzocyclobutene structure. The compound containing the benzocyclobutene structure and the allyl structure is prepared from 53-134 parts