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CN-122011299-A - Curable composition, heat storage material, and article

CN122011299ACN 122011299 ACN122011299 ACN 122011299ACN-122011299-A

Abstract

The invention relates to a hardening composition, a heat storage material and an article. The curable composition contains a compound represented by the following formula (1) and a polymerization initiator. In the formula (1), R 11 and R 12 each independently represent a hydrogen atom or a methyl group, and R 13 represents a divalent group having a polyoxyalkylene chain.

Inventors

  • FURUKAWA NAOYUKI
  • MORIMOTO TAKASHI
  • SANO ATSUKO
  • YOKOTA HIROSHI

Assignees

  • 株式会社力森诺科

Dates

Publication Date
20260512
Application Date
20200121
Priority Date
20190314

Claims (14)

  1. 1. A curable composition comprising a compound represented by the following formula (1) and a polymerization initiator; In the formula (1), R 11 and R 12 each independently represent a hydrogen atom or a methyl group, and R 13 represents a divalent group having a polyoxyalkylene chain.
  2. 2. The curable composition according to claim 1, which contains the compound represented by formula (1) having a weight average molecular weight of 2000 or more as the compound represented by formula (1).
  3. 3. The curable composition according to claim 1, wherein the compound represented by the formula (1) is a compound represented by the following formula (1-2); In the formula (1-2), R 11 and R 12 have the same meanings as R 11 and R 12 in the formula (1), R 14 represents an alkylene group, and m represents an integer of 2 or more.
  4. 4. The curable composition according to claim 3, wherein m is an integer such that the molecular weight of the compound represented by the formula (1-2) is 2000 or more.
  5. 5. The curable composition according to any one of claims 1 to 4, wherein the content of the compound represented by formula (1) is 10% by mass or more based on the total amount of the curable composition.
  6. 6. The curable composition according to any one of claims 1 to 5, further comprising a compound represented by the following formula (2); in the formula (2), R 21 represents a hydrogen atom or a methyl group, and R 22 represents a monovalent group having a polyoxyalkylene chain.
  7. 7. The curable composition according to any one of claims 1 to 6, further comprising a heat-accumulative component.
  8. 8. The curable composition according to claim 7, wherein the heat-accumulative component comprises a polyalkylene glycol.
  9. 9. The curable composition according to any one of claims 1 to 8, further comprising a compound represented by the following formula (3); In the formula (3), R 31 represents a hydrogen atom or a methyl group, and R 32 represents an alkyl group.
  10. 10. The curable composition according to any one of claims 1 to 9, further comprising a compound represented by the following formula (4); In the formula (4), R 41 represents a hydrogen atom or a methyl group, and R 42 represents a monovalent group having a reactive group.
  11. 11. The curable composition according to claim 10, further comprising a hardener reactive with the reactive group.
  12. 12. The curable composition according to any one of claims 1 to 11, which is used for forming a heat storage material.
  13. 13. A heat storage material comprising a cured product of the curable composition according to any one of claims 1 to 12.
  14. 14. An article includes a heat source, and A cured product of the curable composition according to any one of claims 1 to 12 provided in thermal contact with the heat source.

Description

Curable composition, heat storage material, and article The present invention is a divisional application of patent application filed in 21 st 01 month 2020, with the application number 202080019869.4 and the invention name of curable composition, heat storage material and article. Technical Field The present invention relates to a curable composition, a heat storage material, and an article. Background The heat storage material is a material from which stored energy can be taken out as heat as needed. The heat storage material can be used for air conditioning equipment, floor heating equipment, refrigerators, electronic parts such as integrated circuit (INTEGRATED CIRCUIT, IC) chips, automobile parts such as automobile interior and exterior materials, carbon tanks, heat preservation containers and the like. As a method of storing heat, latent heat storage using phase change of a substance is widely available in terms of the magnitude of heat. As the latent heat storage material, water-ice is widely known. Water-ice is a thermally large material, but the phase change temperature is limited to 0 ℃ at atmospheric pressure, and thus the range of application is limited. Therefore, paraffin (paraffin) is available as a latent heat storage material having a phase transition temperature of more than 0 ℃ and 100 ℃ or less. However, if the paraffin undergoes a phase change by heating, the paraffin becomes liquid and there is a risk of ignition or fire, and therefore, in order to use the paraffin as a heat storage material, it is necessary to store the paraffin in a closed container such as a bag or the like to prevent the paraffin from leaking from the heat storage material, and the application field is limited. Accordingly, as a method for improving a heat storage material containing paraffin wax, for example, patent document 1 discloses a method using a gelling agent. The gel produced by the above method can retain a gel-like molded body even after the phase change of paraffin. [ Prior Art literature ] [ Patent literature ] Patent document 1 Japanese patent laid-open No. 2000-109787 Disclosure of Invention [ Problem to be solved by the invention ] In one aspect, the present invention provides a curable composition capable of forming a heat storage material excellent in heat storage capacity. [ Means of solving the problems ] As a result of diligent studies, the inventors of the present invention have found that a cured product of a curable composition containing a specific compound having a polyoxyalkylene chain and two (meth) acryloyl groups is excellent in heat storage capacity, that is, the curable composition can form a heat storage material excellent in heat storage capacity, and have completed the present invention. In several aspects, the present invention provides the following [1] to [14]. [1] A curable composition comprising a compound represented by the following formula (1) and a polymerization initiator. In the formula (1), R 11 and R 12 each independently represent a hydrogen atom or a methyl group, and R 13 represents a divalent group having a polyoxyalkylene chain. ] [2] The curable composition according to [1], which contains the compound represented by the formula (1) having a weight average molecular weight of 2000 or more as the compound represented by the formula (1). [3] The curable composition according to [1], wherein the compound represented by the formula (1) is a compound represented by the following formula (1-2). [ In the formula (1-2), R 11 and R 12 have the same meanings as R 11 and R 12 in the formula (1), R 14 represents an alkylene group, and m represents an integer of 2 or more. ] [4] The curable composition according to [3], wherein m is an integer such that the molecular weight of the compound represented by the formula (1-2) is 2000 or more. [5] The curable composition according to any one of [1] to [4], wherein the content of the compound represented by the formula (1) is 10% by mass or more based on the total amount of the curable composition. [6] The curable composition according to any one of [1] to [5], further comprising a compound represented by the following formula (2). In the formula (2), R 21 represents a hydrogen atom or a methyl group, and R 22 represents a monovalent group having a polyoxyalkylene chain. ] [7] The curable composition according to any one of [1] to [6], which further contains a heat-accumulative component. [8] The curable composition according to [7], wherein the heat-accumulative component comprises a polyalkylene glycol. [9] The curable composition according to any one of [1] to [8], further comprising a compound represented by the following formula (3). In the formula (3), R 31 represents a hydrogen atom or a methyl group, and R 32 represents an alkyl group. ] [10] The curable composition according to any one of [1] to [9], further comprising a compound represented by the following formula (4). In the formula (4), R 41 represents a hydrogen ato