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CN-122011385-A - Flexible electronic device and preparation method thereof

CN122011385ACN 122011385 ACN122011385 ACN 122011385ACN-122011385-A

Abstract

Disclosed are a flexible electronic device, a polyimide precursor composition for the same, and a method of preparing the same. The polyimide precursor composition is coated on a substrate, heated, amidated to form a polyimide film, and thus a laminate of polyimide films is formed on the substrate, a conductive layer or a semiconductor layer is formed on the polyimide film, and the substrate and the polyimide film are peeled off by a mechanical external force. The polyimide film has the peeling strength reduced to less than or equal to 0.5N/in (reduced amplitude of 40% +) and no laser mechanical peeling, and has Rth less than or equal to 700nm,400nm light transmittance more than or equal to 80%,1% weight loss temperature more than or equal to 450 ℃ and linear thermal expansion coefficient less than or equal to 40ppm/K under the condition of polyimide film thickness of 10 mu m. The polyimide film has process compatibility, is resistant to high-temperature treatment (such as more than 410 ℃), and is suitable for roll-to-roll mass production.

Inventors

  • JIN GUANGNAN
  • JIN JIAKE

Assignees

  • 连云港邃铸科技有限公司

Dates

Publication Date
20260512
Application Date
20251231

Claims (10)

  1. 1. A polyimide precursor having a structure represented by structural formula (I): (I) Wherein X is a tetravalent organic group, Y is a divalent organic group, R1 and R2 are respectively and independently selected from one of H, alkyl and alkylsilyl, and n is the degree of polymerization.
  2. 2. The polyimide precursor according to claim 1, wherein X, Y each independently contains an aliphatic cyclic group, and wherein the molar ratio of the repeating units of the aliphatic cyclic structure is not more than 50% mol%.
  3. 3. The polyimide precursor according to claim 1, wherein X is selected from the group consisting of C5-C25, Y is selected from the group consisting of C1-C20, R1 and R2 are each independently selected from the group consisting of H, C-C6 alkyl and C3-C6 alkylmethylsilyl.
  4. 4. A polyimide precursor according to claim 3, wherein X is selected from 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 A combination of one or more of the following; Y is selected from -CH 2 -、-CH 2 -CH 2 -、-CH 2 -CH 2 -NH-CH 2 -CH 2 、-CH 2 -NH-CH 2 -CH 2 -NH-CH 2 - 、-CH 2 -CH 2 -NH-CH 2 -CH 2 -NH-CH 2 -CH 2 - 、-CH 2 -C(CH 3 ) 2 -C(CH 3 ) 2 -、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 A combination of one or more of the foregoing.
  5. 5. A polyimide precursor composition comprising the polyimide precursor according to claim 1, a phosphorus compound having a P (=O) (OR) structure wherein R is selected from H and alkyl, an imidazole-containing compound comprising A compound of structure.
  6. 6. The polyimide precursor composition according to claim 5, wherein the phosphorus compound is 、 、 、 、 、 、 Wherein R3, R4 and R5 are each independently selected from alkyl, the molecular weight of the phosphorus compound is equal to or less than 400, and the boiling point is equal to or more than 250 ℃.
  7. 7. The polyimide precursor composition according to claim 5, wherein the phosphorus compound is selected from the group consisting of: 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 A combination of one or more of the following; the compound containing an imidazole structure is selected from the group consisting of: 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 a combination of one or more of the foregoing.
  8. 8. The polyimide precursor composition according to claim 5, wherein the imidazole-containing compound is 0.05 to 1% of the polyimide precursor, the phosphorus compound is 0.001 to 5% of the polyimide precursor, or The molar ratio of the phosphorus compound to the compound containing the imidazole structure is 1:0.1-10.
  9. 9. A method of fabricating a flexible electronic device, comprising: applying the polyimide precursor composition of claim 5 to a substrate; Heating, amidating at least part or all of the polyimide precursor composition to form a polyimide film, thereby forming a laminate of polyimide films on the substrate; forming a conductive layer or a semiconductor layer on the polyimide film; The substrate and polyimide film are peeled off by mechanical external force.
  10. 10. The method of manufacturing a flexible electronic device as claimed in claim 9, wherein the heating is divided into two stages: The first stage is heating at 80-200deg.C for 10-30min; And in the second stage, heating is carried out for 5-20 min at 300-500 ℃.

Description

Flexible electronic device and preparation method thereof Technical Field The invention relates to the technical field of flexible electronic device manufacturing, in particular to a polyimide precursor composition with low peel strength, low optical phase difference and high thermal stability, and application of the polyimide precursor in flexible electronic devices such as flexible displays, touch panels, solar cell substrates and the like, and relates to a flexible display device. Background The flexible electronic technology is to manufacture electronic devices of organic or inorganic materials on a flexible substrate, and can keep electronic performance on a curved surface, and the flexible electronic technology possibly brings an electronic technology revolution, and is widely focused and rapidly developed worldwide. The journal of SCIENCE listed the evolution of electronics technology as one of the ten world technological achievements in 2000, in parallel with significant findings such as human genome sketch and biological cloning technology. The flexible electronic technology is an emerging field of industry, and the flexible electronic technology not only integrates the technologies of fields such as electronic circuits, electronic components, materials, flat panel displays, nano technologies and the like, but also spans the industries such as semiconductors, sealing, materials, chemical industry, printed circuit boards, display panels and the like, and can assist the transformation of the traditional industries such as plastics, printing, chemical industry, metal materials and the like. The application importance of the method in various fields of information, energy, medical treatment, manufacturing and the like is increasingly prominent, and the method is a leading-edge technology for the competitive development of multi-country and cross-country enterprises in the world. The united states, the european union, the united kingdom, japan and the like have continuously formulated a flexible electronic development strategy and invested a great deal of scientific research expenses, aiming at preempting the preoccupied machine in future flexible electronic research and industrial development. But the fabrication of flexible electronics faces material performance challenges. Polyimide is a high molecular polymer with an imide ring (-CO-NH-CO-) repeating unit on the main chain, and since the 60 th century, polyimide is widely applied to the fields of aerospace, microelectronics, nanotechnology, liquid crystal display and the like as a special engineering material, and is regarded as one of engineering plastics with the most potential in the 21 st century. With the continuous innovation of flexible display technology, the application of OLED screens in folding and curling is gradually popularized, and the OLED screens are expanded to display products with larger sizes such as televisions from mobile phone screens, so that great market potential is brought to PI films. In flexible display, polyimide films are mainly used for a plurality of key components such as display substrates, display package substrates, touch screen cover plates, and display screen cover plates. As foldable electronic devices develop in a thinner and more durable direction, they place near-stringent demands on the mechanical properties of the core flexible substrate material. The application of traditional polyimide in flexible electronic devices has the following defects: 1) Mechanical peeling damage problem the peeling strength of traditional polyimide/glass substrate is more than 0.8N/in, and more than 50% of samples are damaged in circuit during mechanical peeling. 2) The optical retardation causes color shift, and when the polyimide film thickness direction retardation (Rth) >800nm, the viewing angle deviation of the liquid crystal display is >15 °, resulting in color distortion. 3) The compatibility of the high-temperature process is insufficient, the existing polyimide is modified by using a phosphorus compound, but the general phosphorus compound (such as methylphosphonic acid with the boiling point of 197 ℃) is decomposed and failed at the temperature of more than 300 ℃, so that the requirements of high-temperature imidization and interface modification cannot be met at the same time. Disclosure of Invention The present invention provides a flexible electronic device, and a polyimide precursor composition for the same, and a method for preparing the same, to solve the problems set forth in the above technical background. In a first aspect, the present invention provides a polyimide precursor having a structure represented by structural formula (I): (I) Wherein X is a tetravalent organic group, Y is a divalent organic group, R1 and R2 are respectively and independently selected from one of H, alkyl and alkylsilyl, and n is the degree of polymerization. In a preferred embodiment X, Y may each independently be one of an alipha