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CN-122011451-A - High-heat-conductivity high-resilience heat-conductivity gasket and preparation method thereof

CN122011451ACN 122011451 ACN122011451 ACN 122011451ACN-122011451-A

Abstract

The application relates to a high-heat-conductivity high-resilience heat-conductivity gasket and a preparation method thereof, belonging to the technical field of electronic packaging and thermal management materials. The preparation method of the high-heat-conductivity and high-resilience heat-conductivity gasket comprises the steps of mixing raw materials comprising graphene micro-sheets to obtain printing colloid, wherein the particle size D50 of the graphene micro-sheets is 30-200 mu m, performing 3D direct-writing zigzag layer-by-layer printing by adopting the printing colloid, heating and curing to obtain a composite block, and cutting the composite block along the direction perpendicular to a printing plane to obtain the high-heat-conductivity and high-resilience heat-conductivity gasket. By introducing the graphene micro-sheets and combining a 3D direct-writing zigzag layer-by-layer printing process, the plane directions of the graphene micro-sheets are aligned along the thickness direction of the gasket, so that the longitudinal high heat conduction can be realized under the condition of less addition of the heat conduction filler, good rebound resilience can be simultaneously considered, and the severe assembly requirement can be met.

Inventors

  • CAO YONG
  • YANG SHANGQIANG
  • FANG XIAO
  • SUN AIXIANG
  • DONG JINLAN

Assignees

  • 深圳市鸿富诚新材料股份有限公司

Dates

Publication Date
20260512
Application Date
20260228

Claims (10)

  1. 1. The preparation method of the high-heat-conductivity high-resilience heat-conductivity gasket is characterized by comprising the following steps of: mixing raw materials comprising graphene micro-sheets to obtain printing colloid, wherein the particle size D50 of the graphene micro-sheets is 30-200 mu m; Printing the printing colloid layer by layer in a 3D direct-writing zigzag manner, and heating and curing to obtain a composite block; And cutting the composite block along the direction perpendicular to the printing plane to obtain the high-heat-conductivity high-resilience heat-conductivity gasket.
  2. 2. The preparation method of the graphene micro-sheets according to claim 1, wherein the preparation method comprises the steps of sequentially crushing, grinding and sieving a graphene film to obtain the graphene micro-sheets; optionally, the thermal conductivity of the graphene film is 1500W/mK-2000W/mK, and the thickness of the graphene film is 20-100 mu m.
  3. 3. The preparation method according to claim 1 or 2, wherein the mass ratio of the graphene micro-sheets in the raw material is 2wt% to 25wt%.
  4. 4. The method of manufacturing according to claim 1, wherein the raw material includes a thermally conductive filler including the graphene nanoplatelets and a thermally conductive powder including at least one of aluminum oxide, aluminum nitride, aluminum powder, zinc oxide, diamond, or boron nitride; Optionally, in the raw material, the mass ratio of the graphene micro-sheets is 2-25 wt%, and the mass ratio of the heat conducting powder is 30-90 wt%.
  5. 5. The method according to claim 4, wherein the alumina has a particle diameter D50 of 1 μm to 10. Mu.m, and the aluminum nitride has a particle diameter D50 of 1 μm to 20. Mu.m.
  6. 6. The preparation method according to claim 1, wherein the line spacing adopted by the 3D direct-writing zigzag layer-by-layer printing is 0 mm-0.5 mm, the height of each printing layer is 0.3 mm-5 mm, and the printing speed is 1 mm/s-15 mm/s.
  7. 7. The preparation method according to claim 1 or 6, wherein the temperature of the heating and curing is 100 ℃ to 150 ℃ for 2h to 5h; And/or, before heating and curing, vacuumizing to remove bubbles.
  8. 8. The preparation method according to claim 1, wherein the raw materials further comprise a liquid matrix and an auxiliary agent, the liquid matrix comprises vinyl silicone oil, and the auxiliary agent comprises hydrogen silicone oil, a catalyst and a surface modifier; Optionally, in the raw materials, the mass ratio of the vinyl silicone oil is 10-20 wt%, the mass ratio of the hydrogen-containing silicone oil is 0.1-1 wt%, the mass ratio of the catalyst is 0.1-0.7 wt%, and the mass ratio of the surface modifier is 0.1-0.3 wt%; Optionally, the surface modifying agent comprises a coupling agent.
  9. 9. The high-heat-conductivity and high-resilience heat-conductivity gasket is characterized by comprising graphene micro-sheets, wherein the plane directions of the graphene micro-sheets are arranged in an orientation mode in the thickness direction of the high-heat-conductivity and high-resilience heat-conductivity gasket, and the particle size D50 of the graphene micro-sheets is 30-200 mu m.
  10. 10. The high thermal conductivity and high rebound thermal conductivity gasket of claim 9, wherein the raw materials of the high thermal conductivity and high rebound thermal conductivity gasket comprise a thermal conductivity filler, the thermal conductivity filler comprises the graphene micro-sheets, and the mass ratio of the thermal conductivity filler in the raw materials is less than or equal to 86wt%; The high-heat-conductivity high-resilience heat-conductivity gasket has heat conductivity more than or equal to 4.6W/m.K, resilience more than or equal to 91% and 50% compression stress more than or equal to 28psi.

Description

High-heat-conductivity high-resilience heat-conductivity gasket and preparation method thereof Technical Field The application relates to the technical field of electronic packaging and thermal management materials, in particular to a high-heat-conductivity high-resilience heat-conductivity gasket and a preparation method thereof. Background Currently, silicon rubber is generally adopted as a matrix for the commercial heat-conducting gasket, and high-heat-conducting inorganic powder (such as aluminum oxide, aluminum nitride, boron nitride and the like) is filled. To improve the heat conducting property, the filler content is usually required to be increased to more than 95 wt%. Under the high filling condition, the continuous phase of the silicon rubber is seriously damaged, the rigidity of the material is obviously enhanced, the rebound resilience is drastically reduced (generally less than 70 percent), the assembly tolerance between a chip and a radiator is difficult to adapt, the interface debonding is easy to generate after long-term use, and the contact thermal resistance is increased. Therefore, there is a need to develop a new thermal pad fabrication process to effectively balance thermal conductivity and resiliency. Disclosure of Invention In order to solve the above problems, an object of the embodiments of the present application is to provide a high thermal conductivity and high rebound heat conductive gasket and a preparation method thereof, so as to solve the problem that the existing heat conductive gasket is difficult to balance high thermal conductivity and high rebound resilience. In a first aspect, the application provides a method for preparing a high-heat-conductivity high-resilience heat-conductivity gasket, which comprises the following steps: Mixing raw materials comprising graphene micro-sheets to obtain printing colloid, wherein the particle size D50 of the graphene micro-sheets is 30-200 mu m; Printing a 3D direct-writing zigzag layer by adopting printing colloid, and heating and curing to obtain a composite block; And cutting the composite block along the direction perpendicular to the printing plane to obtain the high-heat-conductivity high-resilience heat-conductivity gasket. According to the technical scheme, the graphene micro-sheets are adopted and 3D direct-writing zigzag layer-by-layer printing is carried out, the graphene micro-sheets can be induced to be arranged in the direction of a printing plane (namely, the X-Y direction) in an oriented mode under the action of extrusion shearing and flow field guiding, and then are cut in the direction perpendicular to the printing plane (namely, the Z direction), so that the plane direction of the graphene micro-sheets extends along the thickness direction (namely, the main direction of heat flow) of the heat conducting gasket, longitudinal high heat conduction can be achieved under the condition that the addition amount of the heat conducting filler is small, good rebound resilience can be achieved simultaneously, and severe assembly requirements can be met. Compared with the traditional lamination molding process, the method adopts graphene micro-sheets with the particle size D50 of 30-200 mu m to be combined with 3D direct writing layer-by-layer printing, the graphene micro-sheets are easier to uniformly disperse, the dispersion of the sheets can be further optimized under the shearing action of extrusion pressure in the printing process, and the continuous molding of the interlayer-free splicing interface is realized, so that the graphene micro-sheets are uniformly dispersed in the integral structure, thereby being beneficial to forming a continuous heat conduction network, improving the heat flow transfer efficiency and further improving the heat conduction performance of the heat conduction gasket. In addition, the preparation method has good process controllability and structural designability, and the 3D direct-writing zigzag printing path is adopted, so that the preparation method can be effectively applied to complex shape and customized thermal management requirements. In some embodiments, the preparation method of the graphene micro-sheets comprises the steps of sequentially crushing, grinding and sieving the graphene film to obtain the graphene micro-sheets. In the technical scheme, the graphene micron sheets are prepared by taking the high-heat-conductivity graphene film as a precursor, and the graphene micron sheets are crushed and ground, so that the graphene micron sheets are high in size controllability, good in dispersibility and good in structural integrity, and the high-heat-conductivity lattice structure of the graphene micron sheets can be effectively reserved, so that the thermal conductivity and rebound resilience of the thermal conductive gasket are further improved. Further, the thermal conductivity of the graphene film is 1500W/mK-2000W/mK, and the thickness is 20-100 μm. Further, the rotational speed ad