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CN-122011474-A - High-stability antistatic polyimide adhesive tape and preparation method thereof

CN122011474ACN 122011474 ACN122011474 ACN 122011474ACN-122011474-A

Abstract

The invention discloses a high-stability antistatic polyimide adhesive tape and a preparation method thereof, and belongs to the technical field of polyimide adhesive tapes. The preparation method comprises the steps of cleaning a polyimide film, coating an ionic liquid solution with specific concentration on the surface of the polyimide film, drying to form an ionic liquid interface layer, then coating antistatic slurry, primarily drying, carrying out interface fusion leveling treatment on a wet coating, namely carrying out even pressure through a silica gel even pressure roller under a certain pressure and a roller speed, and finally carrying out sectional high-temperature curing to obtain a finished product. Wherein the ionic liquid is 1-hexyl-3-methylimidazole tetrafluoroborate. According to the invention, through the synergistic effect of ionic liquid molecular anchoring and interface fusion leveling process, the interface binding force and stability between the antistatic coating and the polyimide substrate are greatly enhanced, the problems of easy stripping and deterioration of antistatic performance of the traditional coating are effectively solved, and the prepared adhesive tape has lasting and stable antistatic performance.

Inventors

  • LIAN QUN
  • ZHONG WENWU

Assignees

  • 深圳科宏健科技有限公司

Dates

Publication Date
20260512
Application Date
20260128

Claims (10)

  1. 1. The preparation method of the high-stability antistatic polyimide adhesive tape is characterized by comprising the following steps of: s1, coating a solution containing ionic liquid on the surface of a cleaned polyimide film, and then drying at 35-45 ℃ to form an ionic liquid interface layer on the surface of the polyimide film; S2, coating antistatic slurry on the ionic liquid interface layer, and performing preliminary drying after coating to obtain a wet coating with a preliminary shaped surface; S3, carrying out interface fusion leveling treatment on the wet coating after the first-stage drying, wherein the interface fusion leveling treatment is that the wet coating passes through a silica gel leveling roller, the leveling pressure is 0.05-0.15MPa, and the roller speed is 2-4m/min; S4, carrying out high-temperature curing on the coating subjected to the interface fusion leveling treatment to obtain the high-stability antistatic polyimide adhesive tape.
  2. 2. The method for preparing the high-stability antistatic polyimide adhesive tape according to claim 1, wherein in the step S1, the ionic liquid is 1-hexyl-3-methylimidazole tetrafluoroborate, and the solution containing the ionic liquid is an absolute ethanol solution containing 1-hexyl-3-methylimidazole tetrafluoroborate, and the concentration is 5-15wt%.
  3. 3. The method for preparing the high-stability antistatic polyimide adhesive tape according to claim 1, wherein in the step S1, the dry film thickness of the ionic liquid interface layer formed after drying is 0.2-0.6 μm.
  4. 4. The method for preparing a high-stability antistatic polyimide tape according to claim 1, wherein in the step S2, the coating thickness of the antistatic paste is 8-10 μm, the preliminary drying temperature is 60-80 ℃ and the time is 150-180S.
  5. 5. The method for preparing the high-stability antistatic polyimide adhesive tape according to claim 1, wherein in the step S4, the high-temperature curing is segmented curing, and specifically comprises the steps of curing for 4-5 minutes at 80-100 ℃ in the first stage and curing for 5-6 minutes at 150-160 ℃ in the second stage.
  6. 6. The method for preparing the high-stability antistatic polyimide adhesive tape according to claim 1, wherein in the step S2, the solid content of the antistatic slurry is 20-22wt%, and the antistatic slurry comprises, by weight, 3-8 parts of conductive filler, 0.3-0.8 part of dispersing agent, 1-3 parts of binding resin, 40-70 parts of mixed solvent and 0.05-0.2 part of curing catalyst.
  7. 7. The preparation method of the high-stability antistatic polyimide adhesive tape is characterized in that the conductive filler is a compound of graphene and ATO nano powder, the mass ratio of the graphene to the ATO nano powder is 1:3, the mixed solvent is a compound of deionized water and absolute ethyl alcohol, the mass ratio of the deionized water to the absolute ethyl alcohol is 2:1, the dispersing agent is BYK-110, the bonding resin is an aqueous polyurethane dispersion with the solid content of 30wt%, and the curing catalyst is dibutyl tin dilaurate.
  8. 8. The preparation method of the high-stability antistatic polyimide adhesive tape according to claim 7, wherein the number of layers of the graphene is less than or equal to 5, the sheet diameter is 1-5 mu m, and the particle size of the ATO nano powder is 20-50nm.
  9. 9. The method for preparing the high-stability antistatic polyimide adhesive tape according to claim 1, wherein the cleaning treatment is that absolute ethyl alcohol is adopted to spray and wipe the surface of the polyimide film, and then the polyimide film is dried for 40-60 seconds at 40-50 ℃.
  10. 10. A high-stability antistatic polyimide tape, characterized by being produced by the production method according to any one of claims 1 to 9.

Description

High-stability antistatic polyimide adhesive tape and preparation method thereof Technical Field The invention belongs to the technical field of polyimide adhesive tapes, and relates to a high-stability antistatic polyimide adhesive tape and a preparation method thereof. Background Polyimide is a high-performance aromatic heterocyclic polymer, and the special structure of a molecular main chain enables the polyimide to have excellent thermal stability, mechanical strength, dielectric property and chemical corrosion resistance, and has irreplaceable functions in the fields of electronics, aerospace, microelectronic packaging and high-end manufacturing. Polyimide adhesive tape which is formed by using a polyimide film as a base material and coating an adhesive on the surface inherits the core advantages of the base material, has the characteristics of high and low temperature resistance, acid and alkali resistance, solvent resistance, H-level electrical insulation, radiation protection and the like, and is widely applied to scenes such as wave soldering shielding of an electronic circuit board, gold finger protection, high-grade electrical appliance insulation, motor insulation, positive and negative electrode lug fixation of a lithium battery and the like. With the rapid development of industries such as semiconductors and flexible displays, the requirements on static electricity protection in the production process are becoming severe, so that the lasting and stable static electricity prevention capability of the polyimide adhesive tape becomes one of core indexes suitable for high-end manufacturing. At present, the technical paths for realizing the antistatic function of the polyimide adhesive tape in the industry mainly comprise a surface coating method, a filler compounding method and a structural design method. The surface coating method is a basic scheme with wider application due to simple process and controllable cost, and the core principle is that an antistatic coating is coated on the surface of a PI film to realize static dissipation, but the method has obvious technical defects and restricts the stability of products. The key point is that the interfacial bonding force between the coating and the polyimide substrate is insufficient. Under the stress of high temperature (such as reflow soldering), mechanical friction (such as mounting and stripping) or damp and hot environment and the like faced by practical application, the interface is easy to damage, and the coating is peeled off or microcrack is generated, so that the antistatic performance is quickly declined and cannot be kept stable for a long time. Disclosure of Invention The invention aims to provide a high-stability antistatic polyimide adhesive tape and a preparation method thereof, which are used for solving the technical problems that the interface binding force between a traditional coating and a polyimide substrate is insufficient and the antistatic performance is easy to decline. By constructing the ionic liquid interface layer and assisting the interface fusion leveling process, the bonding strength and stability of the coating and the base material are obviously enhanced, so that the adhesive tape can still keep lasting and reliable antistatic performance under complex working conditions. The aim of the invention can be achieved by the following technical scheme: in a first aspect, the invention provides a preparation method of a high-stability antistatic polyimide adhesive tape, which comprises the following steps: s1, coating a solution containing ionic liquid on the surface of a cleaned polyimide film, and then drying at 35-45 ℃ to form an ionic liquid interface layer on the surface of the polyimide film; S2, coating antistatic slurry on the ionic liquid interface layer, and performing preliminary drying after coating to obtain a wet coating with a preliminary shaped surface; and S3, carrying out interface fusion leveling treatment on the wet coating after the first-stage drying, wherein the interface fusion leveling treatment is to make the wet coating pass through a silica gel leveling roller, the leveling pressure is 0.05-0.15MPa, and the roller speed is 2-4m/min. S4, carrying out high-temperature curing on the coating subjected to the interface fusion leveling treatment to obtain the high-stability antistatic polyimide adhesive tape. Preferably, in step S1, the ionic liquid is 1-hexyl-3-methylimidazole tetrafluoroborate, and the solution containing the ionic liquid is an absolute ethanol solution containing 1-hexyl-3-methylimidazole tetrafluoroborate, and the concentration is 5-15wt%. Preferably, in step S1, the dry film thickness of the ionic liquid interface layer formed after drying is 0.2-0.6 μm. Preferably, in step S2, the thickness of the antistatic slurry is 8-10 μm, and the temperature of the preliminary drying is 60-80 ℃ for 150-180S. Preferably, in the step S4, the high-temperature curing is segmented curing, an