CN-122011642-A - High-filling photosensitive ink and preparation method and application thereof

Abstract

The application discloses high-filling photosensitive ink and a preparation method and application thereof, and belongs to the technical field of high-temperature-resistant composite material preparation. The high-filling photosensitive ink comprises matrix resin, high-temperature-resistant filler, photoinitiator, solvent and auxiliary agent. The method can be used in the collaborative printing technology of the photo-curing technology and the ink direct-writing technology, and can produce high-performance high-temperature-resistant complex structural parts through direct-writing deposition, UV curing and comprehensive post-curing treatment. The high-filling photosensitive ink has large filling quantity and low cost, can improve the temperature resistance of the workpiece and reduce the expansion coefficient, and the synergistic technology has the advantages of direct writing high filling and photocuring high precision, so that the stable molding of the workpiece is ensured. The high-temperature-resistant composite material part prepared by the application can be used for aerospace, electronic packaging and other scenes needing high-temperature resistance and high-strength complex structures.

Inventors

• CHEN FANG
• LI XIAOJUN
• CHEN GUIYONG
• GAO CHUANYUN
• LU XINJIAN
• YANG DONG
• Lv qianlong
• YAN GUIHUANG
• ZHANG LONG
• HE TAIJUN

Assignees

• 成都飞机工业（集团）有限责任公司

Dates

Publication Date

20260512

Application Date

20260119

Claims (10)

1. 1. The high-filling photosensitive ink is characterized by comprising, by weight, 10-30 parts of matrix resin, 70-90 parts of high-temperature-resistant filler, 1-5 parts of photoinitiator and the balance of solvent and auxiliary agent.
2. 2. The highly filled photosensitive ink of claim 1, wherein the matrix resin comprises at least one of an acrylate, an epoxy, a methacrylate, and a silicone resin; the high-temperature-resistant filler comprises at least one of alumina, silica, boron nitride, zirconia and high-temperature ceramic microspheres; the photoinitiator comprises at least one of benzoin dimethyl ether, diphenyl ketone, peroxides, acyl phosphine oxides, thioxanthone and derivatives thereof.
3. 3. The highly filled photosensitive ink of claim 1, wherein the adjuvant comprises a dispersant comprising at least one of a polymeric dispersant, a nonionic surfactant, an ionic surfactant, and a specialty dispersant, and further adjuvants comprising at least one of a leveling agent, an antifoaming agent, a thickener, and an antioxidant.
4. 4. The highly filled photosensitive ink of claim 1, wherein said solvent comprises at least one of N-methyl pyrrolidone, gamma butyrolactone, ethyl acetate, and dimethylacetamide.
5. 5. A method of preparing a highly filled photosensitive ink according to any one of claims 1 to 4, comprising the steps of: Mixing the matrix resin with a photoinitiator to form a first mixed solution; mixing the high-temperature-resistant filler, the solvent and the auxiliary agent to form a second mixed solution; Adding the first mixed solution into the second mixed solution in batches, and stirring to obtain slurry; carrying out vacuum degassing treatment on the slurry to obtain the high-filling photosensitive ink; The viscosity of the slurry is 10-100 mPa.s at normal temperature under the condition that the shearing rate is 1s -1 ~100s -1 .
6. 6. The method for preparing highly filled photosensitive ink according to claim 5, wherein the stirring speed is 200rpm to 500rpm, and the stirring time is 2h to 5h.
7. 7. Use of a highly filled photosensitive ink according to any one of claims 1 to 4 for the preparation of a high temperature resistant composite.
8. 8. The use according to claim 7, wherein the preparation of the high temperature resistant composite material comprises the steps of: Extruding and printing the high-filling photosensitive ink, irradiating by using a UV light source, and curing to obtain a first-layer material; stacking layer by layer until printing of the whole three-dimensional structure is completed, and obtaining a prefabricated member; and (3) carrying out comprehensive curing treatment on the prefabricated part through a UV oven to obtain the product.
9. 9. The method according to claim 8, wherein the parameters of the extrusion printing comprise a needle diameter of 0.1 mm-1.0 mm, an extrusion pressure of 0.25-1.0 MPa, a printing speed of 5-20 mm/s and an exposure time of 5-50 s.
10. 10. The use of claim 8, further comprising improving the high temperature resistance and mechanical properties of the high temperature resistant composite material by heat treatment at a temperature of 80 ℃ to 150 ℃ for a time of 2h to 8h.

Description

High-filling photosensitive ink and preparation method and application thereof Technical Field The application belongs to the technical field of high-temperature-resistant composite material preparation, and particularly relates to high-filling photosensitive ink, and a preparation method and application thereof. Background In the fields of industrial production and high-end manufacturing, materials capable of maintaining stable performance under high-temperature environments are frequently used, for example, in the field of aerospace, light-weight high-strength aircraft structural parts are required to bear extreme temperatures for a long time and maintain structural integrity, in the field of mold manufacturing, high-temperature-resistant special-shaped molds are required to withstand continuous high temperature in a forming process without performance attenuation, in the field of electronic manufacturing, electronic component packaging materials are required to protect circuit boards from being corroded by external environments such as high temperature and humidity to ensure stable operation of components, and in addition, the fields such as medical instruments and special packages are also required to have definite high-temperature resistance and comprehensive performance. The high-temperature-resistant photosensitive resin has both the convenience of light curing and forming and the performance stability in a high-temperature environment, so that the high-temperature-resistant photosensitive resin becomes a key candidate material in the field, and the application requirement of the high-temperature-resistant photosensitive resin is in a continuous growing trend along with the technical progress and the industrial upgrading. At present, the high-temperature-resistant photosensitive resin generally adopts an epoxy resin and acrylic resin system, and the temperature resistance and mechanical property of the photo-curing resin are improved by adding inorganic filler. However, the introduction of the inorganic filler may significantly deteriorate the print formability of the photocurable resin. Therefore, a technology for achieving both high temperature resistance and print formability is demanded. Disclosure of Invention The application aims to provide high-filling photosensitive ink, a preparation method and application thereof, which can solve the problem of printing performance degradation after inorganic filler is added, and ensure the molding precision, high-temperature resistance and structural integrity of a composite material. The application provides high-filling photosensitive ink which comprises, by weight, 10-30 parts of matrix resin, 70-90 parts of high-temperature-resistant filler, 1-5 parts of photoinitiator and the balance of solvent and auxiliary agent. Further, the matrix resin comprises at least one of acrylic ester, epoxy resin, methyl acrylic ester and siloxane resin, the high-temperature-resistant filler comprises at least one of alumina, silicon dioxide, boron nitride, zirconia and high-temperature ceramic microspheres, the particle size of the filler is 5 nm-100 mu m, and the photoinitiator comprises at least one of benzoin dimethyl ether, diphenyl ketone, peroxides (including but not limited to benzoyl peroxide, methyl ethyl ketone peroxide and the like), acyl phosphine oxides, thioxanthone and derivatives thereof. Further, the auxiliary agents include a dispersant including at least one of a polymeric dispersant, a nonionic surfactant, an ionic surfactant, and a special dispersant (e.g., carboxylate, sulfonate, polyacrylate, polyurethane-type dispersant), and other auxiliary agents including at least one of a leveling agent, an antifoaming agent, a thickener, and an antioxidant. Further, the solvent includes at least one of N-methylpyrrolidone, γ -butyrolactone, ethyl acetate, and dimethylacetamide. The application also provides a preparation method of the high-filling photosensitive ink, which comprises the following steps: Mixing the matrix resin with a photoinitiator to form a first mixed solution; mixing the high-temperature-resistant filler, the solvent and the auxiliary agent to form a second mixed solution; Adding the first mixed solution into the second mixed solution in batches, and stirring to obtain slurry; carrying out vacuum degassing treatment on the slurry to obtain the high-filling photosensitive ink; The viscosity of the slurry is 10-100 mPa.s at normal temperature under the condition that the shearing rate is 1s -1~100s-1. Further, the stirring speed is 200-500 rpm, and the stirring time is 2-5 h. The application also provides application of the high-filling photosensitive ink in preparing a high-temperature-resistant composite material. The application field of the high-temperature-resistant high-performance composite material can be expanded, and the composite material can be applied to the fields of aerospace, automobile manufacturing and electronic packaging,