Search

CN-122011675-A - High-temperature-resistant epoxy resin packaging material and preparation method thereof

CN122011675ACN 122011675 ACN122011675 ACN 122011675ACN-122011675-A

Abstract

The invention belongs to the technical field of packaging materials, and particularly relates to a high-temperature-resistant epoxy resin packaging material and a preparation method thereof. The high-temperature-resistant epoxy resin packaging material comprises, by mass, 7-10 parts of epoxy resin, 3-6 parts of triglycidyl para-aminophenol, 3-8 parts of a curing agent, 1-2 parts of a curing accelerator, 80-90 parts of a filler and 1-3 parts of a coupling agent. The high-temperature-resistant epoxy resin packaging material prepared by the invention has excellent high-temperature resistance, high tensile strength and strong adhesion performance of the copper-attached substrate.

Inventors

  • LIU KANGZHONG
  • WANG SHIYU
  • LV YONG
  • CUI CAOXIANG
  • ZHANG CHUNYANG
  • GUO BAIJUN
  • ZHANG FUXUAN

Assignees

  • 国鲸合创(青岛)科技有限公司

Dates

Publication Date
20260512
Application Date
20260116

Claims (10)

  1. 1. The high-temperature-resistant epoxy resin packaging material is characterized by comprising, by mass, 7-10 parts of epoxy resin, 3-6 parts of triglycidyl para-aminophenol, 3-8 parts of a curing agent, 1-2 parts of a curing accelerator, 80-90 parts of a filler and 1-3 parts of a coupling agent.
  2. 2. The high temperature resistant epoxy resin encapsulating material according to claim 1, wherein the epoxy resin comprises 2- (3, 4-epoxycyclohexyl) -5, 5-spiro (3, 4-epoxycyclohexyl) -1, 3-dioxane homopolymer, 3, 4-epoxycyclohexyl methyl 3',4' -epoxycyclohexyl methyl 3, 4-epoxycyclohexyl methyl bis ((3, 4-epoxycyclohexyl) methyl) adipate in a mass ratio of (1.3-1.5) (0.9-1.1) (0.2-0.4).
  3. 3. The high temperature resistant epoxy resin encapsulating material of claim 1 wherein the 2- (3, 4-epoxycyclohexyl) -5, 5-spiro (3, 4-epoxycyclohexyl) -1, 3-dioxane homopolymer is model TTA-34.
  4. 4. The high temperature resistant epoxy resin encapsulating material according to claim 1, wherein the 3, 4-epoxycyclohexylcarboxylic acid-3 ',4' -epoxycyclohexylmethyl ester has an epoxy equivalent of 125-135g/mol and a viscosity of 220-300 mPa-s at 25 ℃.
  5. 5. The high temperature resistant epoxy resin encapsulating material according to claim 1, wherein the bis ((3, 4-epoxycyclohexyl) methyl) adipate has an epoxy equivalent of 190-210g/mol and a viscosity of 500-650 mPa-s at 25 ℃.
  6. 6. The high temperature resistant epoxy resin encapsulating material according to claim 1, wherein the curing agent is at least one selected from the group consisting of m-phenylenediamine, diaminodiphenylmethane, pyromellitic dianhydride, and methylhexahydrophthalic anhydride.
  7. 7. The high temperature resistant epoxy resin encapsulating material according to claim 1, wherein the curing accelerator is at least one selected from the group consisting of tris (dimethylaminomethyl) phenol, 2- (dimethylaminomethyl) phenol.
  8. 8. The high temperature resistant epoxy resin encapsulating material according to claim 1, wherein the coupling agent is selected from at least one of silane coupling agents KH550, KH560, KH 580.
  9. 9. The high temperature resistant epoxy encapsulating material of claim 1 wherein the filler is fused silica flour.
  10. 10. A method for preparing the high-temperature-resistant epoxy resin packaging material according to any one of claims 1-9, which is characterized by comprising the steps of mixing aliphatic epoxy resin and triglycidyl para-aminophenol, stirring until the mixture is uniform, continuously adding a curing agent and a curing accelerator to enable the curing agent and the curing accelerator to be fully dissolved, finally adding a filler and a coupling agent, stirring uniformly, vacuumizing, adding into a screw machine, mixing and extruding to obtain the high-temperature-resistant epoxy resin packaging material.

Description

High-temperature-resistant epoxy resin packaging material and preparation method thereof Technical Field The invention belongs to the technical field of packaging materials, and particularly relates to a high-temperature-resistant epoxy resin packaging material and a preparation method thereof. Background In the field of new energy automobiles, with the rapid development of electromotive technology, power semiconductor devices (such as IGBTs and SiC modules) are used as core components of motor drive systems, and the working environments thereof are becoming increasingly severe. The devices not only need to bear high voltage and high current in the operation process, but also face complex working conditions such as high temperature, severe temperature circulation, long-term vibration and the like in the engine compartment. Especially under the conditions of vehicle acceleration, braking or high-temperature weather, the working temperature of the power chip can be rapidly increased to be more than 180 ℃, and the local hot spot is even more than 200 ℃. The traditional epoxy resin packaging material exposes significant defects in the application scene, and is easy to generate thermal aging reaction under the continuous high temperature and thermal cycle action, so that the material is embrittled and cracked, the protection function of a chip is lost, and the long-term reliability of a device is seriously affected. At the same time, the tensile strength of the material is not high, and the crack formation and the expansion risk caused by mechanical impact or vibration are difficult to resist. More importantly, the adhesive force between the traditional epoxy resin and a copper substrate (DBC substrate commonly used for a power module) is poor, interfacial delamination is easy to occur, the integrity of a packaging structure is damaged, and the adhesive force becomes one of main causes of device failure. In the prior art, in order to improve the high temperature resistance of the epoxy resin packaging material, a method is generally adopted to improve the glass transition temperature (Tg) of the material by using the multifunctional epoxy resin, but a significant negative effect is often caused by the decrease of the tensile strength of the material. Therefore, in the packaging of the power module of the new energy automobile, a new epoxy packaging material with excellent high temperature resistance and high tensile strength is urgently needed to ensure long-term stable operation and high reliability of the electronic device under extreme working conditions. Disclosure of Invention The invention aims to provide a high-temperature-resistant epoxy resin packaging material and a preparation method thereof. In order to achieve the above object, the present invention provides the following technical solutions: The high temperature resistant epoxy resin packaging material comprises, by mass, 7-10 parts of epoxy resin, 3-6 parts of triglycidyl para-aminophenol, 3-8 parts of a curing agent, 1-2 parts of a curing accelerator, 80-90 parts of a filler and 1-3 parts of a coupling agent. Preferably, the mass ratio of 2- (3, 4-epoxycyclohexyl) -5, 5-spiro (3, 4-epoxycyclohexyl) -1, 3-dioxane homopolymer, 3, 4-epoxycyclohexylcarboxylic acid-3 ',4' -epoxycyclohexylmethyl ester and bis ((3, 4-epoxycyclohexyl) methyl) adipate is (1.3-1.5): (0.9-1.1): (0.2-0.4). Preferably, the 2- (3, 4-epoxycyclohexyl) -5, 5-spiro (3, 4-epoxycyclohexyl) -1, 3-dioxane homopolymer is derived from Jiangsu Taier New Material technologies Co., ltd., model TTA-34. Preferably, the 3, 4-epoxycyclohexylmethyl formate has an epoxy equivalent of 125-135g/mol, a viscosity of 220-300 mPa.s at 25 ℃, and a product model of T-2103P, which is from Hongchao chemical Co., ltd. Preferably, the bis ((3, 4-epoxycyclohexyl) methyl) adipate has an epoxy equivalent of 190-210g/mol, a viscosity of 500-650 mPa.s at 25 ℃ and a product model TTA26, available from Jiangsu Taier New Material technologies Co., ltd. According to the invention, three epoxy resins are compounded, so that the glass transition temperature of the high-temperature-resistant epoxy resin packaging material is improved, and the adhesive force of the copper-attached substrate is improved. The analysis shows that the 2- (3, 4-epoxycyclohexyl) -5, 5-spiro (3, 4-epoxycyclohexyl) -1, 3-dioxane homopolymer can provide a rigid framework, and the rigid framework is compounded with the other two components to realize three-dimensional cross-linked network reinforcement, so that the glass transition temperature of the packaging material is improved. Meanwhile, the interface stress can be released by adding a proper amount of flexible aliphatic chain bridging epoxy groups, and the adhesive force can be improved. Preferably, the triglycidyl para-aminophenol is available from Jiangsu Taier New Material technologies Co., ltd., model TTA500. According to the invention, the triglycidyl para-aminophenol and the epoxy res