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CN-122011683-A - Formula of low-warpage epoxy plastic packaging material and high-density packaging application method

CN122011683ACN 122011683 ACN122011683 ACN 122011683ACN-122011683-A

Abstract

The invention discloses a formula of a low-warpage epoxy plastic package material and a high-density packaging application method, and belongs to the technical field of electronic packaging materials. The plastic package material comprises epoxy resin, a curing agent, an accelerator, spherical fused quartz powder, spherical aluminum nitride, a dual-function nano interface nail, a silane coupling agent, a colorant and a release agent. The double-function nano-interface nail is of an asymmetric long rod structure with epoxy groups at one end and acetyl acetonyl groups at the other end, is prepared through area selective modification, and is prepared by firstly synthesizing SiO 2 long rod-shaped particles, and then grafting epoxy groups on the nail body and acetyl acetonyl groups on the nail head. When in use, the dual-function nano interface nail and the filler are pretreated to form a quartz powder-aluminum nitride hybrid skeleton, and then are mixed with resin and solidified. According to the invention, by utilizing the selective anchoring effect of the interface nails, two fillers are bridged into a cooperative framework, so that the curing shrinkage, the thermal expansion coefficient and the warping degree are obviously reduced, and the problem of warping of a high-filling system caused by interface mismatch of heterogeneous fillers is solved.

Inventors

  • Fan Qingbing
  • ZHOU DIANXIANG
  • BAI YEJIE

Assignees

  • 青神美矽科技有限公司

Dates

Publication Date
20260512
Application Date
20260331

Claims (7)

  1. 1. The low-warpage epoxy plastic packaging material is characterized by comprising the following raw materials in parts by weight: 12-18 parts of epoxy resin, 8-12 parts of curing agent, 0.3-0.5 part of accelerator, 40-50 parts of spherical fused quartz powder, 15-20 parts of spherical aluminum nitride, 1.5-3.0 parts of dual-function nano interface nail, 0.5-1.0 part of silane coupling agent, 0.3-0.5 part of colorant and 0.5-1.0 part of release agent; The epoxy resin is a mixed resin of naphthol epoxy resin and phenolic epoxy resin according to the mass ratio of 1:1, the curing agent is methyl hexahydrophthalic anhydride, the accelerator is imidazole latent accelerator, the average particle size of spherical fused quartz powder is 5-15 mu m, the average particle size of spherical aluminum nitride is 1-5 mu m, the silane coupling agent is gamma-glycidyl ether oxypropyl trimethoxy silane, the colorant is carbon black, and the release agent is zinc stearate; The double-function nano interface nail is of an asymmetric long rod structure with epoxy groups at one end and acetyl acetonyl groups at the other end.
  2. 2. The low-warpage epoxy molding compound of claim 1, wherein the synthesis method of the dual-function nano-interface nail comprises the following steps: (1) The nanometer interface nail synthesis comprises adding polyvinylpyrrolidone and sodium citrate into a reaction kettle, dissolving with amyl alcohol, adding deionized water and 28-30% ammonia water, stirring for 15min to form water-in-oil emulsion, adding ethyl orthosilicate under stirring at 800-1000rpm, and reacting at room temperature for 12 hr to complete nail growth; Adding 3-aminopropyl triethoxysilane, stirring for 30min, adding tetraethoxysilane again, reacting at room temperature for 24 hr to complete the growth of nail head, centrifuging the reaction solution at 8000rpm for 10min, alternately washing with ethanol and deionized water, and vacuum drying to obtain nanometer interface nail; (2) Dispersing nano interface nails in anhydrous toluene, adding gamma-glycidol ether oxypropyl trimethoxy silane, reacting for 8 hours under the protection of 80 ℃ nitrogen, centrifuging and washing with toluene to obtain nail body epoxy group modified products; And (3) redispersing the nail body epoxy modified product in anhydrous toluene, adding acetylacetone, N' -dicyclohexylcarbodiimide and triethylamine, reacting for 12 hours at room temperature, centrifuging, washing with toluene and ethanol in sequence, and drying in vacuum to obtain the double-function nano-interface nail.
  3. 3. The low-warpage epoxy molding compound according to claim 2, wherein in the step (1), the number average molecular weight Mw of polyvinylpyrrolidone is about 40000g/mol, and the molar ratio of polyvinylpyrrolidone, citric acid, ethyl orthosilicate, 3-aminopropyl triethoxysilane and ethyl orthosilicate added again is 1:20-25:595-600:80-90:298-300.
  4. 4. The low-warpage epoxy molding compound according to claim 2, wherein in the step (2), the mass ratio of the nano interface nail to the gamma-glycidyl ether oxypropyl trimethoxysilane is 5-6:2, and the mass ratio of the nail body epoxy modified product to the acetylacetone to the N, N' -dicyclohexylcarbodiimide to the triethylamine is 27-28:4-5:1.5:1.
  5. 5. The high-density packaging application method of the low-warpage epoxy plastic packaging material is characterized by comprising the following steps of: S1, preprocessing heterogeneous fillers, namely adding spherical fused quartz powder and spherical aluminum nitride into a high-speed mixer, diluting a silane coupling agent with acetone, spraying and adding the diluted mixture, mixing for 10-15min at 100-110 ℃ and 1500-1600rpm, dispersing a dual-function nano interface nail into ethanol to form a suspension, spraying and adding the suspension into the high-speed mixer, continuously mixing for 30-35min at 100-110 ℃ and 1200-1250rpm, and vacuum drying to obtain a composite filler; S2, preparing matrix resin, namely preheating epoxy resin and a curing agent for 30min at 60 ℃, adding an accelerator, a colorant and a release agent, and uniformly stirring to obtain a matrix resin mixture; s3, melting and mixing, namely, the front roller temperature of a double-roller open mill is 80-90 ℃, the rear roller temperature is 70-80 ℃, the roller spacing is 0.5-1.0mm, the front roller rotating speed is 25rpm, the rear roller rotating speed is 20rpm, a matrix resin mixture is firstly added to wrap the rollers, composite filler is added in a separated mode, and mixing is carried out for 15-20min until the materials are uniform and have no white spots, so that mixed materials are obtained; S4, granulating and storing, namely cooling and crushing the mixed materials, sieving the crushed materials with a 80-mesh sieve, and refrigerating and sealing the crushed materials at 4 ℃; S5, curing, molding and post-curing, namely curing for 90-120min at 150-160 ℃ and 10-15MPa by adopting a flat vulcanizing machine, and then curing for 2h at 175 ℃ to obtain the high-density packaging cured piece.
  6. 6. The high-density packaging application method according to claim 5, wherein in the step S1, the ethanol suspension of the dual-function nano-interface nail is subjected to ultrasonic dispersion for 5min and then sprayed, and the temperature and the rotating speed of a high-speed mixer are kept stable in the spraying process, so that the dual-function nano-interface nail is ensured to be uniformly coated on the surface of the heterogeneous filler; In the step S5, the mold for curing and forming needs to be preheated to 150 ℃ in advance, a release agent is sprayed on the inner wall of the mold before the mold is closed, the temperature is programmed in the post-curing process, the temperature rising rate is 2 ℃ per minute, and the package piece is prevented from generating internal stress due to rapid temperature rising.
  7. 7. The method according to claim 5, wherein in S3, the mass of the composite filler added in each batch is not more than 1/5 of the total mass of the composite filler, and the next feeding is performed after the materials are completely mixed after each feeding, and the mixing endpoint judgment standard is that the materials are uniformly black, smooth and free of particle feeling on the surface, and free of filler agglomeration.

Description

Formula of low-warpage epoxy plastic packaging material and high-density packaging application method Technical Field The invention relates to the technical field of electronic packaging materials, in particular to a formula of a low-warpage epoxy plastic packaging material and a high-density packaging application method. Background Epoxy molding compound is a key material for packaging integrated circuits and is used for protecting chips from the external environment. With the development of electronic devices toward high density and miniaturization, the warpage problem of the package body caused by mismatch of thermal expansion Coefficients (CTE) of materials is increasingly prominent, so that the difficulty of subsequent processing is increased, and failures such as chip cracking and the like are easily caused. To reduce CTE, epoxy resins are typically highly filled with inorganic fillers such as silica. However, the single filler is difficult to combine the heat conduction and low expansion requirements, the quartz powder and aluminum nitride are compounded to form research hot spots, but the surface properties of the quartz powder and the aluminum nitride are large in difference, so that the interface compatibility is poor and the dispersion is uneven. In the prior art, silane coupling agents are mostly adopted for surface treatment, but the conventional coupling agents are difficult to anchor two heterogeneous fillers at the same time, a cooperative framework cannot be constructed, and the warping problem caused by interface stress concentration is not solved effectively. Therefore, the development of the novel epoxy plastic package material capable of enhancing the interface compatibility of heterogeneous fillers and inhibiting the warpage has important application value. Disclosure of Invention The invention aims to solve the defects in the prior art, and provides a formula of a low-warpage epoxy plastic package material and a high-density packaging application method. In order to achieve the above purpose, the present invention adopts the following technical scheme: the invention firstly provides a low-warpage epoxy plastic package material, which comprises the following raw materials in parts by weight: 12-18 parts of epoxy resin, 8-12 parts of curing agent, 0.3-0.5 part of accelerator, 40-50 parts of spherical fused quartz powder, 15-20 parts of spherical aluminum nitride, 1.5-3.0 parts of dual-function nano interface nail, 0.5-1.0 part of silane coupling agent, 0.3-0.5 part of colorant and 0.5-1.0 part of release agent; The epoxy resin is a mixed resin of naphthol epoxy resin and phenolic epoxy resin according to the mass ratio of 1:1, the curing agent is methyl hexahydrophthalic anhydride, the accelerator is imidazole latent accelerator, the average particle size of spherical fused quartz powder is 5-15 mu m, the average particle size of spherical aluminum nitride is 1-5 mu m, the silane coupling agent is gamma-glycidyl ether oxypropyl trimethoxy silane, the colorant is carbon black, and the release agent is zinc stearate; The double-function nano interface nail is of an asymmetric long rod structure with epoxy groups at one end and acetyl acetonyl groups at the other end. The naphthol epoxy contains rigid naphthalene ring, has low hygroscopicity and high strength, and the phenolic epoxy has high crosslinking density and good heat resistance. The two components are compounded, so that the rigidity at high temperature can be ensured, and the stress caused by excessively rigid and brittle single structure can be avoided. Quartz powder (low expansion) mainly suppresses thermal expansion, and aluminum nitride (high thermal conductivity) mainly conducts heat. The particle size distribution of the aluminum nitride powder and the silica powder (quartz 5-15 μm > aluminum nitride 1-5 μm) forms graded filling, and small-particle aluminum nitride fills gaps of large-particle quartz powder, so that the stacking density is improved, and the shrinkage main body of the resin is reduced. The dual-function nano interface nail is used as a heterogeneous bridging agent to solve the problem of weak interface caused by different surface properties of quartz (silicon-philic) and aluminum nitride (aluminum-philic). Preferably, the synthesis method of the dual-function nano-interface nail comprises the following steps: (1) The nanometer interface nail synthesis comprises adding polyvinylpyrrolidone and sodium citrate into a reaction kettle, dissolving with amyl alcohol, adding deionized water and 28-30% ammonia water, stirring for 15min to form water-in-oil emulsion, adding ethyl orthosilicate under stirring at 800-1000rpm, and reacting at room temperature for 12 hr to complete nail growth; Under the catalysis of ammonia water, tetraethyl orthosilicate (TEOS) undergoes hydrolytic polycondensation in a 'water drop' template of the water-in-oil emulsion: ; Polyvinylpyrrolidone (PVP) is adsorbed on the particle surface a