CN-122011751-A - Polyamide alloy material and preparation method and application thereof

Abstract

The invention belongs to the field of high polymer materials, and particularly relates to a polyamide alloy material, a preparation method and application thereof, and in particular discloses a polyamide alloy material which comprises, by weight, 50-95 parts of polyamide, 8-30 parts of carboxylate-sulfonate-acrylate terpolymer, 2-15 parts of compatilizer and 0.3-3 parts of stabilizer. The polyamide alloy material provided by the invention has better rebound effect and good shape retention capacity in the continuous reciprocating stress process, and can be used for preparing automobile parts.

Inventors

• HUANG MU
• DING CHAO
• LI CHENG
• GE WEI
• SHEN CHENGUANG
• LI XIANGQIAN

Assignees

• 江苏金发科技新材料有限公司
• 上海金发科技发展有限公司

Dates

Publication Date

20260512

Application Date

20260129

Claims (10)

1. 1. The polyamide alloy material is characterized by comprising the following components in parts by weight: 50-95 parts of polyamide; 8-30 parts of carboxylate-sulfonate-acrylate terpolymer; 2-15 parts of compatilizer; 0.3-3 parts of stabilizer.
2. 2. A polyamide alloy material according to claim 1, wherein the polyamide is selected from at least one of PA6, PA11, PA12, PA46, PA56, PA66, PA610, PA612, PA6T, PA9T, PA10T, PA1010, PA1012, preferably at least one of PA6, PA6T, PA10T, PA612, PA11, PA 12.
3. 3. The polyamide alloy material according to claim 1, wherein the repeating unit structure of the carboxylate-sulfonate-acrylate terpolymer is (acrylate) m (2-acrylic acid-2-methylpropanesulfonate) n (hydroxypropyl acrylate) k , and wherein the molar ratio of m to n to k is (40-80): (10-30): (5-20).
4. 4. A polyamide alloy material according to claim 3, wherein the carboxylate-sulfonate-acrylate terpolymer has a melt flow rate of 2-25g/10min, and the detection criteria is ISO 1133:2005, and the detection conditions are 190 ℃,5kg.
5. 5. A polyamide alloy according to claim 1, wherein said compatibilizer is selected from the group consisting of maleic anhydride grafted polyolefin, preferably at least one of maleic anhydride grafted polypropylene, maleic anhydride grafted ethylene propylene diene monomer or maleic anhydride grafted ethylene-alpha-olefin copolymer.
6. 6. A polyamide alloy material according to claim 1, wherein said stabilizer is selected from thiocyanate stabilizers.
7. 7. The polyamide alloy material according to claim 1, further comprising 0.01 to 40 parts by weight of a filler selected from at least one of calcium carbonate, talc, wollastonite, kaolin, mica, glass beads, glass fibers, and carbon fibers.
8. 8. The polyamide alloy material according to claim 1, further comprising 0.01 to 5 parts by weight of an auxiliary agent.
9. 9. A method for producing a polyamide alloy material according to any one of claims 1 to 8, characterized in that all the components are uniformly mixed in proportion and subjected to melt blending extrusion granulation.
10. 10. An automotive part comprising the polyamide alloy material according to any one of claims 1 to 8.

Description

Polyamide alloy material and preparation method and application thereof Technical Field The invention belongs to the field of high polymer materials, and particularly relates to a polyamide alloy material, and a preparation method and application thereof. Background Polyamide is a thermoplastic engineering plastic with a main chain containing repeated amide groups (-NHCO-) and has excellent mechanical strength, wear resistance, chemical resistance, self-lubricating property and good processing and forming properties, so that the polyamide is widely applied to various fields of automobile parts (such as engine hoods, fan blades and fuel system parts), electronics and electrics (such as connectors and circuit breakers), mechanical equipment (such as gears, bearings and guide rails), daily consumer products (such as sports equipment, shoe materials and packaging films) and the like. While polyamide materials have the above-mentioned advantages, their limitations in certain specific application scenarios are increasingly pronounced, mainly due to insufficient resilience, which is a critical factor limiting their application in high-end flexible parts. Rebound resilience refers to the ability of a material to recover its original shape and size after deformation (e.g., compression, bending, or impact). The molecular chain structure of polyamide is relatively rigid, and intermolecular forces (hydrogen bonding) are strong, resulting in macroscopic manifestations of insufficient flexibility and elastic recovery. This drawback makes it difficult to meet the application requirements that are extremely high in terms of dynamic fatigue performance, cushioning and comfort, such as high performance athletic shoe midsoles, high resilience seals, flexible wearable device structures, and precision components that need to withstand repeated impacts. At present, modification researches for improving the performance of polyamide are more, but the modification researches are mainly focused on the aspects of strengthening, toughening, reducing hygroscopicity and the like. Common toughening means such as adding elastomer (such as POE and EPDM) can improve the impact strength to a certain extent, but the rigidity, strength and heat resistance of the material are sacrificed, the rebound resilience of the material is improved only to a limited extent, and even permanent deformation is possibly increased. Another idea is by blending with other flexible polymers (such as polyether block amide PEBA), but such materials are costly and compatibility issues may affect the performance stability of the final product. Therefore, developing a novel polyamide modified material, which significantly improves the rebound resilience and maintains good processability and cost controllability, has become a technical problem to be solved by the technicians in the field, and has huge market application value. Disclosure of Invention The present invention aims to solve the above-mentioned technical problems and provide a polyamide alloy material having excellent rebound resilience. Another object of the present invention is to provide a process for preparing the above polyamide alloy material. It is a further object of the present invention to provide an automotive component. The invention is realized by the following technical scheme: The polyamide alloy material comprises the following components in parts by weight: 50-95 parts of polyamide; 8-30 parts of carboxylate-sulfonate-acrylate terpolymer; 2-15 parts of compatilizer; 0.3-3 parts of stabilizer. The polyamide of the present invention includes, but is not limited to, any of the following: (a) Homopolymers formed by ring-opening polymerization of one or more lactams, such as PA4, PA6, PA7, PA8, PA9, PA11, PA12, PA13; (b) Polyamides formed from polycondensation of one or more dicarboxylic acids with one or more diamines, including aliphatic polyamides such as PA36、PA46、PA56、PA510、PA511、PA512、PA66、PA69、PA610、PA611、PA612、PA613、PA614、PA1010、PA1012、PA1212、PA1313; and semiaromatic polyamides, i.e., polyterephthalamides such as PA4T, PA5T, PA6T, PA7T, PA8T, PA9T, PA10T, PA T, PA T, and copolymers thereof with aliphatic polyamides such as PA6T/66, PA6T/6I, PA T/XT; (c) Polyamides formed from polycondensation of one or more amino acids, such as PA4, PA6, PA11, PA12; (d) Copolymers formed by copolymerization of the above types of monomers, such as PA6/66, PA6/12, and mixtures of any two or more of the foregoing polyamides. In addition, the polyamide of the present invention also includes polyamides prepared by other synthetic methods such as interfacial polycondensation, solution polycondensation, phosphoric acid catalyzed polycondensation, specifically including: A wholly aromatic polyamide which comprises a polyamide compound, such as poly (paraphenylene terephthalamide) PPTA, poly (m-phenylene isophthalamide) PMIA; polyterephthalimide such as PA6T and copolymers thereof; Biobased polyamides, meaning pol