Search

CN-122011769-A - Preparation method of thermal interface material of double-surface modified hexagonal boron nitride filler

CN122011769ACN 122011769 ACN122011769 ACN 122011769ACN-122011769-A

Abstract

A preparation method of a thermal interface material of double surface modified hexagonal boron nitride filler comprises the following steps of (1) sequentially adding hexagonal boron nitride and dopamine hydrochloride into Tris solution to obtain dopamine hydrochloride modified hexagonal boron nitride, (2) adding dopamine hydrochloride modified hexagonal boron nitride into a mixed solution of ethanol and deionized water, adjusting pH, (3) stirring uniformly the double modified hexagonal boron nitride and polydimethylsiloxane, adding a curing agent, stirring and mixing, and drying to obtain the thermal interface material of double surface modified hexagonal boron nitride filler. According to the invention, the polydopamine and gamma-aminopropyl triethoxysilane are adopted to modify the hexagonal boron nitride surface, the preparation method is simple, and the heat conduction performance of the prepared polydimethylsiloxane composite material is obviously improved.

Inventors

  • LI HU
  • WANG LIANG

Assignees

  • 山东大学

Dates

Publication Date
20260512
Application Date
20260304

Claims (10)

  1. 1. The preparation method of the thermal interface material of the double surface modified hexagonal boron nitride filler is characterized by comprising the following steps of: (1) Adding Tris into deionized water to obtain Tris solution, regulating pH value with acetic acid, adding hexagonal boron nitride and dopamine hydrochloride into Tris solution successively, magnetically stirring, suction filtering, washing and vacuum drying to obtain dopamine hydrochloride modified hexagonal boron nitride; (2) Adding dopamine hydrochloride modified hexagonal boron nitride into a mixed solution of ethanol and deionized water, and regulating the pH value by acetic acid, then adding gamma-aminopropyl triethoxysilane into the mixed solution of ethanol and deionized water in a dropwise manner, and carrying out suction filtration, washing and vacuum drying after magnetic stirring to obtain the hexagonal boron nitride which is subjected to double modification by dopamine hydrochloride and gamma-aminopropyl triethoxysilane; (3) Uniformly stirring the hexagonal boron nitride and the polydimethylsiloxane which are subjected to double modification by dopamine hydrochloride and gamma-aminopropyl triethoxysilane through magnetic force, then adding a curing agent, continuously and fully stirring and mixing, and drying at high temperature to obtain the thermal interface material of the double surface modified hexagonal boron nitride filler.
  2. 2. The method for preparing a thermal interface material of double surface-modified hexagonal boron nitride filler according to claim 1, wherein the concentration of Tris in the Tris solution in step (1) is 10 mM.
  3. 3. The method for preparing a thermal interface material of a double surface-modified hexagonal boron nitride filler according to claim 1, wherein the pH is adjusted to 8.5 with acetic acid in step (1), and the pH is adjusted to 4.5 with acetic acid in step (2).
  4. 4. The method for preparing a thermal interface material of double surface-modified hexagonal boron nitride filler according to claim 1, wherein in the step (1), the particle size of hexagonal boron nitride is 5-10 μm.
  5. 5. The method for preparing a thermal interface material of a double surface-modified hexagonal boron nitride filler according to claim 1, wherein in the step (1), the rotation speed of the magnetic stirring is 600rpm for 6 hours, and the vacuum drying is performed at 60 ℃ for 12 hours.
  6. 6. The method for preparing a thermal interface material of a dual surface-modified hexagonal boron nitride filler according to claim 1, wherein in the step (2), the volume ratio of ethanol to deionized water in the mixed solution of ethanol and deionized water is 9:1.
  7. 7. The method for preparing a thermal interface material of a double surface-modified hexagonal boron nitride filler according to claim 1, wherein the rotation speed of the magnetic stirring in the step (2) is 600rpm, the time is 6 hours, the vacuum drying is performed at 60 ℃ for 12 hours, the rotation speed of the magnetic stirring in the step (3) is 1000rpm, the time is 1 hour, and the vacuum drying is performed at 100 ℃ for 40 minutes.
  8. 8. The method for preparing the thermal interface material of the double surface-modified hexagonal boron nitride filler according to claim 1, wherein the proportion of the mixed solution of the dopamine hydrochloride modified hexagonal boron nitride, ethanol and deionized water and gamma-aminopropyl triethoxysilane in the step (1) is 300ml, the mass of the hexagonal boron nitride is 3g, the mass of the dopamine hydrochloride is 0.3g, the mass of the dopamine hydrochloride modified hexagonal boron nitride is 5g, the volume of the mixed solution of ethanol and deionized water is 200ml, and the volume of the gamma-aminopropyl triethoxysilane is 1ml.
  9. 9. The method for preparing a thermal interface material of a double surface-modified hexagonal boron nitride filler according to claim 1, wherein in the step (3), the mass ratio of dopamine hydrochloride to gamma-aminopropyl triethoxysilane to the double modified hexagonal boron nitride to polydimethylsiloxane to the curing agent is (0.58-3.47): 5.15:0.515.
  10. 10. The thermal interface material of the double-surface-modified hexagonal boron nitride filler is characterized by being prepared by the preparation method of the thermal interface material of the double-surface-modified hexagonal boron nitride filler in any one of claims 1-9, wherein the weight percentage of the double-modified hexagonal boron nitride of dopamine hydrochloride and gamma-aminopropyl triethoxysilane in the thermal interface material is 10-40%.

Description

Preparation method of thermal interface material of double-surface modified hexagonal boron nitride filler Technical Field The invention relates to the technical field of heat conduction and insulation composite materials and thermal interface materials, in particular to a hexagonal boron nitride filler realizing double surface modification through cooperation of polydopamine and gamma-aminopropyl triethoxysilane, a thermal interface material containing the filler and a preparation method of the thermal interface material. Background With the rapid development of electronic devices toward high power density, integration and miniaturization, the heat generation per unit area inside the devices continues to rise, and the heat often needs to be transferred across multiple levels of interfaces, such as chips/packages, thermal Interface Materials (TIMs), heat sinks, and the like. In this process, interfacial thermal resistance (especially thermal contact resistance between TIM and substrate) often becomes a critical bottleneck limiting overall heat dissipation efficiency and long-term device reliability. The polymer-based thermal interface material is widely applied due to the advantages of being convenient to form and process, flexible and compressible, capable of filling microscopic gaps, adapting to complex interface morphology and the like, but has low intrinsic heat conductivity, and is difficult to meet the heat dissipation requirement in a high heat flux density scene. Hexagonal boron nitride (h-BN) has high intrinsic heat conductivity and excellent electrical insulation, is chemically stable and relatively controllable in cost, and is considered to be an ideal ceramic filler for improving the heat conducting property of the polymer. Meanwhile, the lack of strong interface action between the filler and the polymer leads to discontinuous heat transmission and enhanced phonon scattering at the interface, and the interface thermal resistance is accumulated with the increase of the filler content, which finally shows limited heat conduction enhancement efficiency and even accompanies deterioration of processing rheology and reduction of mechanical property. Therefore, there is an urgent need to develop a highly efficient surface modification strategy that is simple in process, scalable, has both improved dispersion, enhanced interface bonding and reduced interface thermal resistance, so as to still construct a continuous and stable thermal conduction path under higher filling or lower interface pressure conditions, and meet the requirements of advanced electronic packaging and thermal management applications. Disclosure of Invention Aiming at the defects of the prior art, the invention provides a preparation method of a thermal interface material of a double surface modified hexagonal boron nitride filler, which is used for improving the dispersion stability and interface compatibility of hexagonal boron nitride in a polymer matrix, reducing interface thermal resistance, constructing a continuous heat conduction path and improving the heat conduction performance of the polymer matrix. The preparation method of the thermal interface material of the double surface modified hexagonal boron nitride filler comprises the following steps: (1) Adding Tris (Tris (hydroxymethyl aminomethane) into deionized water to obtain a Tris solution, and regulating the pH value by acetic acid, sequentially adding hexagonal boron nitride and dopamine hydrochloride (PDA) into the Tris solution, and carrying out suction filtration, washing and vacuum drying after magnetic stirring to obtain dopamine hydrochloride modified hexagonal boron nitride (PDA-BN); (2) Adding dopamine hydrochloride modified hexagonal boron nitride into a mixed solution of ethanol and deionized water, and regulating the pH value by acetic acid, then adding gamma-aminopropyl triethoxysilane into the mixed solution of ethanol and deionized water in a dropwise manner, and carrying out suction filtration, washing and vacuum drying after magnetic stirring to obtain dopamine hydrochloride and gamma-aminopropyl triethoxysilane double modified hexagonal boron nitride (KBN); (3) Uniformly stirring the hexagonal boron nitride and the polydimethylsiloxane which are subjected to double modification by dopamine hydrochloride and gamma-aminopropyl triethoxysilane through magnetic force, then adding a curing agent, continuously and fully stirring and mixing, and drying at high temperature to obtain the thermal interface material of the double surface modified hexagonal boron nitride filler. According to a preferred embodiment of the present invention, the concentration of Tris in the Tris solution in step (1) is 10 mM. According to the present invention, it is preferable that in the step (1), the pH is adjusted to 8.5 with acetic acid, and in the step (2), the pH is adjusted to 4.5 with acetic acid. According to the present invention, in the step (1), the particle size of the