CN-122011778-A - Gel-type thermal interface material

CN122011778ACN 122011778 ACN122011778 ACN 122011778ACN-122011778-A

Abstract

The present application relates to gel-type thermal interface materials. The present disclosure provides a thermal interface material that may be used to transfer heat from a heat-generating electronic device (such as a computer chip) to a heat-dissipating structure (such as a heat spreader and heat sink). The thermal interface material comprises at least one silicone oil, at least one catalyst, at least one thermally conductive filler having a relatively large surface area, a solvent, at least one inhibitor, and at least one cross-linking agent. The at least one thermally conductive filler reduces oil leakage of the TIM, and the solvent increases the flow rate of the TIM without counteracting the reduction in oil leakage achieved by the thermally conductive filler.

Inventors

SHEN LING
ZHANG JIE
ZHANG LIQIANG
LIU YAQUN
ZHANG XIN

Assignees

霍尼韦尔国际公司

Dates

Publication Date: 20260512
Application Date: 20190213
Priority Date: 20190204

Claims (10)

1. A thermal interface material comprising: a low molecular weight silicone oil having a weight average molecular weight (M w ) of less than 50,000 daltons; at least one thermally conductive filler having a surface area of greater than 1.0m 2 /g, and A high molecular weight silicone oil, wherein the high molecular weight silicone oil comprises a vinyl functional silicone oil having a weight average molecular weight (M w ) of at least 60,000 daltons.
2. The thermal interface material of claim 1, wherein the thermal interface material has a viscosity greater than 1500 pa.s.
3. The thermal interface material of claim 1, further comprising a solvent having a boiling point between 60 ℃ and 220 ℃ and a viscosity between 0.2cSt and 50 cSt.
4. A thermal interface material as defined in claim 3, wherein the thermal interface material has a viscosity between 150pa.s and 650 pa.s.
5. The thermal interface material of claim 1, wherein the thermal interface material comprises: 2 to 10% by weight of a low molecular weight silicone oil; 50 to 95% by weight of at least one thermally conductive filler, and 0.1 To 5% by weight of a high molecular weight silicone oil; 0.1 to 5% by weight of a solvent; 0.1 to 5% by weight of a coupling agent; 0.1 to 1% by weight of a crosslinking agent; 0.1 to 5% by weight of an inhibitor, and 0.1 To 5% by weight of a catalyst.
6. A thermal interface material comprising: a low molecular weight silicone oil having a weight average molecular weight (M w ) of less than 50,000 daltons; a first heat conductive filler, a second heat conductive filler and a third heat conductive filler, Wherein the first thermally conductive filler is a metal oxide having a surface area between 0.1m 2 /g and 1.0m 2 /g, the second thermally conductive filler is a metal oxide having a surface area between 0.5m 2 /g and 2.0m 2 /g, and the third thermally conductive filler is a metal oxide having a surface area between 5.0m 2 /g and 10.0m 2 /g, and A high molecular weight silicone oil, wherein the high molecular weight silicone oil comprises a vinyl functional silicone oil having a weight average molecular weight (M w ) of at least 60,000 daltons, and A solvent having a boiling point between 60 ℃ and 220 ℃ and a viscosity between 0.2cSt and 50 cSt.
7. The thermal interface material of claim 6, wherein the thermal interface material comprises: 2 to 10% by weight of a low molecular weight silicone oil; 25 to 50 weight percent of a first thermally conductive filler having a surface area between 0.1m 2 /g to 1.0m 2 /g; 25 to 50 wt% of a second thermally conductive filler having a surface area between 0.5m 2 /g and 2.0m 2 /g, and 25 To 50 weight percent of a third thermally conductive filler having a surface area between 5.0m 2 /g and 10.0m 2 /g; 0.1 to 5% by weight of a high molecular weight silicone oil; 0.1 to 5% by weight of a solvent; 0.1 to 5% by weight of a coupling agent; 0.1 to 1% by weight of a crosslinking agent; 0.1 to 5% by weight of an inhibitor, and 0.1 To 5% by weight of a catalyst.
8. The thermal interface material of claim 6, wherein the low molecular weight silicone oil comprises a vinyl functional silicone oil and the high molecular weight silicone oil is a vinyl silicone oil having a kinematic viscosity of 2,000,000 cst.
9. The thermal interface material of claim 6, wherein the thermal interface material has a bleed mark value between 1mm and 5mm and a flow rate between 20g/min and 50 g/min.
10. An electronic component, comprising: A heat sink; An electronic chip; A thermal interface material positioned between the heat sink and the electronic chip, the thermal interface material comprising: a low molecular weight silicone oil having a weight average molecular weight (M w ) of less than 50,000 daltons; at least one thermally conductive filler having a surface area of greater than 1.0m 2 /g, and A high molecular weight silicone oil, wherein the high molecular weight silicone oil comprises a vinyl functional silicone oil having a weight average molecular weight (M w ) of at least 60,000 daltons.

Description

Gel-type thermal interface material The application is a divisional application of an application patent application with the application date of 2019, 2-month and 13-date, the application number of 201980019415.4 and the name of gel type thermal interface material. Technical Field The present disclosure relates generally to thermal interface materials, and more particularly, to gel-type thermal interface materials. Background Thermal Interface Materials (TIMs) are widely used to dissipate heat from electronic components such as central processing units, video graphics arrays, servers, game consoles, smart phones, LED boards, and the like. Thermal interface materials are commonly used to transfer excess heat from an electronic component to a heat sink, such as a heat sink. A typical electronic package structure 10 containing a thermal interface material is shown in fig. 1. The electronic package structure 10 illustratively includes a heat-generating component (such as the electronic chip 12) and one or more heat-dissipating components (such as the heat sink 14 and the heat sink 16). Exemplary heat sinks 14 and fins include metals, metal alloys, or metallized substrates such as copper, copper alloys, aluminum alloys, or nickel-plated copper. TIM materials, such as TIM 18 and TIM 20, provide thermal connection between the heat generating component and one or more heat dissipating components. The electronic package 10 includes a first TIM 18 connecting the electronic chip 12 and the heat spreader 14. TIM 18 is commonly referred to as "TIM 1". The electronic package 10 includes a second TIM 20 connecting the heat spreader 14 and the heat sink 16. TIM 20 is commonly referred to as "TIM 2". In another embodiment, the electronic package structure 10 does not include a heat spreader 14, and a TIM (not shown) connects the electronic chip 12 directly to the heat sink 16. Such a TIM that connects electronic chip 12 directly to heat sink 16 is commonly referred to as TIM 1.5. Conventional thermal interface materials include components such as gap pads. However, the gap pads have certain drawbacks such as being unable to meet very small thickness requirements and being difficult to use for automated production. Other thermal interface materials include gel products. The gel product may be automatically dispensed for mass production and may be formed into a desired shape and thickness. However, typical gel products with good flow characteristics can potentially experience oil leakage (also known as "bleed out"). Improvements in the foregoing aspects are desired. Disclosure of Invention The present disclosure provides thermal interface materials that can be used to transfer heat from a heat-generating electronic device (such as a computer chip) to a heat-dissipating structure (such as a heat spreader and heat sink). The thermal interface material comprises at least one silicone oil, at least one catalyst, at least one thermally conductive filler having a relatively large surface area, a solvent, at least one inhibitor, and at least one cross-linking agent. The at least one thermally conductive filler reduces oil leakage of the TIM, and the solvent increases the flow rate of the TIM without counteracting the reduction in oil leakage achieved by the thermally conductive filler. In one exemplary embodiment, a thermal interface material is provided. The thermal interface material comprises a low molecular weight silicone oil having a weight average molecular weight (M w) of less than 50,000 daltons, at least one thermally conductive filler having a surface area of greater than 1.0M 2/g, and a high molecular weight silicone oil, wherein the high molecular weight silicone oil comprises a vinyl functional silicone oil having a weight average molecular weight (M w) of at least 60,000 daltons. In a more specific embodiment, the thermal interface material has a viscosity greater than 1500 pa.s. In a more specific embodiment, the thermal interface material further comprises a solvent having a boiling point between 60 ℃ and 220 ℃ and a viscosity between 0.2cSt and 50 cSt. In a more specific embodiment, the thermal interface material has a viscosity between 150pa.s and 650 pa.s. In a more specific embodiment, the at least one thermally conductive filler comprises a first thermally conductive filler, a second thermally conductive filler, and a third thermally conductive filler, wherein the first thermally conductive filler is a metal oxide having a surface area between 0.1m 2/g and 1.0m 2/g, the second thermally conductive filler is a metal oxide having a surface area between 0.5m 2/g and 2.0m 2/g, and the third thermally conductive filler is a metal oxide having a surface area between 5.0m 2/g and 10.0m 2/g. In a more specific embodiment, the first thermally conductive filler has an average particle size of at least 10 microns, the second thermally conductive filler has an average particle size between 1 micron and 10 microns, and the