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CN-122011782-A - Low-density high-heat-conductivity solid-liquid transition type polymer-based thermal interface material and preparation method and application thereof

CN122011782ACN 122011782 ACN122011782 ACN 122011782ACN-122011782-A

Abstract

The invention provides a solid-liquid transition type polymer-based thermal interface material, and a preparation method and application thereof, wherein the preparation raw materials of the solid-liquid transition type polymer-based thermal interface material comprise the following components: the vinyl-terminated polydimethylsiloxane, the active hydrogen-terminated siloxane and the inorganic filler, wherein the inorganic filler comprises a spherical filler and a flaky filler, the weight ratio of the spherical filler to the flaky filler is 1.5-14:1, and the spherical filler can generate physical adsorption on the surface of the flaky filler through the cooperation of the spherical filler and the flaky filler, and is different from a heat conduction path formed by the spherical filler, and the heat conduction path formed by the flaky filler-spherical filler composite has an integration effect on the dispersed spherical filler with small particle size, so that the complete heat conduction path can be formed at a lower filling fraction. The solid-liquid transition type polymer-based thermal interface material has low density and high heat conduction performance, and effectively improves the workability and the lightweight performance in the thermal management of optical module equipment.

Inventors

  • ZENG XIAOLIANG
  • CHENG SIYUAN
  • FAN JIANFENG
  • SUN RONG

Assignees

  • 深圳先进电子材料国际创新研究院
  • 深圳先进技术研究院

Dates

Publication Date
20260512
Application Date
20260318

Claims (10)

  1. 1. The solid-liquid transition type polymer-based thermal interface material is characterized in that the preparation raw materials of the solid-liquid transition type polymer-based thermal interface material comprise the following components: Vinyl-terminated polydimethylsiloxane, active hydrogen-terminated siloxane and inorganic filler, wherein the inorganic filler comprises spherical filler and lamellar filler, and the weight ratio of the spherical filler to the lamellar filler is 1.5-14:1.
  2. 2. The solid-liquid transition polymer-based thermal interface material of claim 1, wherein the spherical filler is spherical aluminum nitride; Preferably, the platy filler is platy boron nitride; Preferably, the D50 particle size of the spherical filler is 0.1 μm to 120. Mu.m, and the D50 particle size of the flaky filler is 0.1 μm to 100. Mu.m.
  3. 3. The solid-liquid transition polymer-based thermal interface material according to claim 1 or 2, wherein the vinyl-terminated polydimethylsiloxane is selected from at least one of side-chain vinyl polydimethylsiloxane, single-end vinyl-terminated polydimethylsiloxane; preferably, the active hydrogen group-terminated siloxane is at least one selected from the group consisting of active hydrogen group-containing polydimethyl siloxane and single-end hydrogen-terminated polydimethyl siloxane.
  4. 4. A solid-liquid transition polymer-based thermal interface material as claimed in any one of claims 1-3, wherein the vinyl-terminated polydimethylsiloxane has a viscosity of 10-2500 mPa-s at 25 ℃,1s -1 ; Preferably, the active hydrogen radical blocked siloxane has a viscosity of 10 to 2500 mPas at 25℃and 1s -1 .
  5. 5. The solid-liquid transition polymer-based thermal interface material of any one of claims 1-4, wherein the active hydrogen-based blocked siloxane is present in an amount of 3.27-18.10%, the active hydrogen-based blocked siloxane is present in an amount of 1.19-18.10%, and the inorganic filler is present in an amount of 83.25-95.54% based on the total weight of the starting materials for the preparation of the solid-liquid transition polymer-based thermal interface material.
  6. 6. The solid-liquid transition polymer-based thermal interface material of any one of claims 1-5, wherein the solid-liquid transition polymer-based thermal interface material has a density of 2.0g/cm 3 -3.0 g/cm 3 .
  7. 7. The solid-liquid transition polymer-based thermal interface material of any one of claims 1-6, wherein the solid-liquid transition polymer-based thermal interface material has an accelerated creep time of 10-100 s measured on a rotational rheometer using 1500 Pa stress; Preferably, the thermal conductivity of the solid-liquid transition polymer-based thermal interface material is 0.2-20W/(m.k).
  8. 8. The method for producing a solid-liquid transition type polymer-based thermal interface material according to any one of claims 1 to 7, characterized in that the production method comprises the steps of: And mixing the spherical filler and the platy filler, and then mixing the spherical filler and the platy filler with vinyl-terminated polydimethylsiloxane and active hydrogen-terminated siloxane to obtain the solid-liquid transition type polymer-based thermal interface material.
  9. 9. The method of claim 8, wherein the spherical filler and the flaky filler are mixed and dried at a temperature of 125 ℃ to 175 ℃ for a time of 30 to 60 min; preferably, the mixture with the vinyl-terminated polydimethylsiloxane and the active hydrogen-terminated siloxane is spun at high speeds of 800r/min and 1200r/min under vacuum for 30s-45s and 65s-85s, respectively.
  10. 10. Use of the solid-liquid transition polymer-based thermal interface material according to any one of claims 1-7, and/or the solid-liquid transition polymer-based thermal interface material prepared according to the preparation method of claims 8-9 in electronic devices.

Description

Low-density high-heat-conductivity solid-liquid transition type polymer-based thermal interface material and preparation method and application thereof Technical Field The invention belongs to the technical field of thermal interface materials, relates to a solid-liquid transition type polymer-based thermal interface material and a preparation method and application thereof, and particularly relates to a low-density high-heat-conductivity solid-liquid transition type polymer-based thermal interface material and a preparation method and application thereof. Background With the rapid development of artificial intelligence, cloud computing and 5G communication technologies, the demand for data transmission rates by data centers has increased exponentially, pushing optical modules to evolve from 400G, 800G to 1.6T and higher. Along with the jump of the speed, the power density and the heat flux density of core components such as a laser, a modulator, a driving chip and the like in the optical module are also increased sharply. However, in pursuit of high-density integration, the packaging forms (e.g., QSFP-DD, OSFP) of the optical modules are becoming compact, and the space available inside for heat dissipation is extremely limited. In this context, efficient and reliable thermal management has become a core bottleneck in determining optical module performance stability, signal accuracy and long-term service life （Bianco, V.; De Rosa, M.; Vafai, K. Phase-Change Materials for Thermal Management of Electronic Devices. Applied Thermal Engineering 2022, 214, 118839;Liu, X. et al. Integrated Thermal Dissipation Micro Structures for CDFP Optical Module. Optical and Quantum Electronics2020, 52 (2),Chen, H. et al. Thermal Management Enhancement of Electronic Chips Based on Novel Technologies. Energy 2025, 316, 134575.）. The thermal interface material (THERMAL INTERFACE MATERIAL, TIM) fills the microscopic gap between the heat-generating chip and the heat sink to remove air and reduce contact thermal resistance, which is a key ring in the heat dissipation path. In the optical module, the performance requirement of the TIM is particularly strict, and the optical module meets multiple requirements of optical path cleanliness, long-term reliability, automatic precision production and the like at the same time of high-efficiency heat conduction. Thermal Interface Materials (TIMs) play a key role in the thermal management scheme of optical modules. The material can effectively fill microscopic gaps of contact surfaces of the heating component and the radiator, improves heat conduction efficiency and reduces thermal resistance, thereby optimizing heat dissipation effect. Meanwhile, the thermal interface material can still maintain stable physical properties in repeated thermal cycles, and performance degradation caused by thermal fatigue is avoided, so that the thermal interface material is regarded as an important technical approach (Liu Wentao, li Zhenji, jin Danlei, and the like) for coping with the heat dissipation challenge of the optical module ,2025,49(08):1-7+60,Wei, B. et al.. Thermal Interface Materials: From Fundamental Research to Applications. SusMat 2024, 4 (6),Due, J.; Robinson, A. Reliability of Thermal Interface Materials: A Review. Applied Thermal Engineering 2013, 50 (1),455-463.）. Thermal interface materials with solid-liquid transition properties show great potential for development in various application scenarios. The solid-liquid transition reflects the destruction and reconstruction of the microstructure within the material. The method is characterized by simultaneously showing the yielding behavior of the material, the thixotropic property of the material, the creep behavior of the material and the like (Xu Gutong, zhou Ziyu, liao Qingyu, and the like. Determination of complex fluid yield stress: theory, method and application [ J ]. Polymer bulletin, 2025,38 (05): 689-717, yang Kai. Rheological study of yield stress fluid in large amplitude oscillatory shear flow field [ D ]. Shanghai university of traffic, 2017, yang Kai, yuwei. Nonlinear rheological study of yield stress fluid [ C ]// China chemical society, professional committee of China society of mechanical society of rheology, the university of national institute of rheology conference, university of Shanghai traffic chemical institute, and British instrumentation, 2016:221-222). Due to the special properties of such materials, they are widely used in mobile electronic devices, flexible electronic devices, optical modules, etc. When the chip is highly integrated, huge heat is generated during the operation of the electronic device. Because a certain gap exists between the heat sink and the heating device, and a thermal expansion coefficient mismatch phenomenon exists between the devices in the heating process, the thermal interface material capable of filling the gap and improving the thermal expansion coefficient mismatch phenomenon is parti