Search

CN-122011848-A - Radiation cooling paint, coating, preparation method and application

CN122011848ACN 122011848 ACN122011848 ACN 122011848ACN-122011848-A

Abstract

The application discloses a radiation cooling coating, a coating and a preparation method and application thereof, wherein the coating comprises, by mass, 8-15 parts of P (VDF-HFP) resin, 3-5 parts of first fluorocarbon resin, 0.3-0.5 part of curing agent, 85-92 parts of first solvent and 7-13 parts of non-solvent, wherein the first solvent comprises at least three small molecular compound solutions with different boiling points, and the absolute value of the difference of the boiling points between any two small molecular compound solutions is more than or equal to 20 ℃ and less than or equal to 180 ℃. According to the application, the volatilization speeds of different small molecular compounds in the first solvent are different, so that a multistage pore structure can be constructed through volatilization-induced phase separation under different time nodes, the coating has sufficient time to permeate and wet the bottom substrate, the mechanical embedding effect between the two layers is improved, the adhesive force is improved, and the adhesion effect of the coating to the substrate is indirectly improved.

Inventors

  • MAO ZEPENG
  • LIN CHU
  • TAO LINYU
  • Tang Junhang
  • XIE YING
  • CHENG YI
  • SHI YUQI

Assignees

  • 南京工业大学

Dates

Publication Date
20260512
Application Date
20260319

Claims (10)

  1. 1. The radiation cooling coating is characterized by comprising the following components in parts by weight: 8-15 parts of P (VDF-HFP) resin; 3-5 parts of a first fluorocarbon resin; 0.3-0.5 parts of a curing agent; 85-92 parts of a first solvent; 7-13 parts of a non-solvent; The first solvent is used for being mixed with the P (VDF-HFP) resin to form a P (VDF-HFP) resin solution, wherein the first solvent comprises at least three small molecular compound solutions with different boiling points, and the absolute value of the difference of the boiling points of any different small molecular compound solutions is more than or equal to 20 ℃ and less than or equal to 180 ℃.
  2. 2. The radiation cooled coating of claim 1 wherein the first solvent is comprised of a first compound solution, a second compound solution, and a third compound solution, wherein the first compound solution has a boiling point of T 1 ℃, the second compound solution has a boiling point of T 2 ℃, and the third compound solution has a boiling point of T 3 ℃, the mixed solvent further satisfying at least one of the following characteristics: a)T 1 ＜T 2 ＜T 3 ; b)39°C≤T 1 ≤66°C; c)70°C≤T 2 ≤120°C; d)130°C≤T 3 ≤210°C。
  3. 3. the radiation cooling coating according to claim 2, wherein the mass ratio of the first compound solution to the second compound solution to the third compound solution is 3-6:2-5:2.
  4. 4. A radiation-cooled coating according to claim 2, wherein the first compound is selected from at least one of acetone, tetrahydrofuran, dichloromethane, and/or The second compound is at least one selected from butanone, methyl isobutyl ketone, sec-butyl acetate, 1-methoxy-2-propanol, and/or The third compound is at least one selected from N, N-dimethylformamide, N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, gamma-butyrolactone and dimethylcyclohexylamine.
  5. 5. The radiation cooling coating according to claim 1, wherein the number average molecular weight of the first fluorocarbon resin is 5000-50000, and the solid content of the first fluorocarbon resin is 50-55%; The number average molecular weight of the P (VDF-HFP) resin is 50000-300000; the curing agent is selected from any one of hexamethylene diisocyanate, isophorone diisocyanate, naphthalene diisocyanate, toluene diisocyanate and diphenylmethane diisocyanate; The non-solvent is selected from deionized water.
  6. 6. The method for preparing the radiation cooling coating according to any one of claims 1 to 5, comprising the following steps: mixing corresponding parts by mass of P (VDF-HFP) resin, a non-solvent and a first solvent, and stirring until the P (VDF-HFP) resin is fully dissolved to obtain a P (VDF-HFP) resin solution; Mixing corresponding parts by mass of a first fluorocarbon resin and a curing agent, and dripping the mixture into a P (VDF-HFP) resin solution, stopping dripping immediately when the mixed solution is changed from clear and transparent to turbid, and continuously stirring until the whole solution is uniform and stable, thereby obtaining the radiation cooling coating; wherein the first solvent is composed of a first compound solution, a second compound solution, and a third compound solution.
  7. 7. A radiation-cooled coating comprising a substrate and a first coating disposed on the substrate, wherein the first coating comprises the radiation-cooled coating of any one of claims 1-5, or wherein the first coating is obtained by applying the radiation-cooled coating prepared by the method of claim 6 to a surface of a substrate.
  8. 8. The radiant cooling coating of claim 7, further comprising a second coating disposed between and coupled to the first coating and the substrate, respectively, wherein the second coating is comprised of a second fluorocarbon resin having a solids content of 30-55%, wherein the second fluorocarbon resin has a number average molecular weight of 5000-50000 and a fluorine content of greater than 20%.
  9. 9. The radiation cooled coating of claim 7 wherein said first coating has a plurality of pores formed by volatilization of a first compound solution, a second compound solution and a third compound solution in said first solvent; Wherein the aperture of a hole formed after the first compound solution volatilizes is 150-400 nm; the aperture of a hole formed after the second compound solution volatilizes is 400-1100 nm; And the aperture of a hole formed after the third compound solution volatilizes is 1100-2500 nm.
  10. 10. Use of the radiation cooling coating according to any one of claims 7-9 for construction, wire and cable and automotive marine surfaces.

Description

Radiation cooling paint, coating, preparation method and application Technical Field The application belongs to the technical field of coatings, and particularly relates to a radiation cooling coating, a preparation method and application. Background Passive Radiative Cooling (PRC) is a technology that can effectively mitigate the greenhouse effect and the urban heat island effect by reflecting sunlight and transmitting heat flow to space through an atmospheric transparent window. The (polyvinylidene fluoride-hexafluoroethylene) copolymer P (VDF-HFP) can be used as a radiation cooling material due to the unique molecular structure and the controllable physical form. But even though P (VDF-HFP) has excellent film forming properties, mechanical properties, chemical stability and weather resistance, its poor adhesion to the substrate limits its application in the coating field. Acetone is a good solvent for P (VDF-HFP) and has a relatively high rate of evaporation, and is therefore often selected as the preferred solvent for the evaporation-induced phase separation process. However, too fast volatilization of acetone causes a large shrinkage stress in the coating, which easily leads to the coating falling off from the substrate surface. Disclosure of Invention The application aims to provide a radiation cooling coating, a coating and a preparation method thereof, and simultaneously solve the problem of poor adhesion with a substrate when P (VDF-HFP) is used as the coating. In some embodiments, a radiation-cooled coating comprises, in parts by weight: 8-15 parts of P (VDF-HFP) resin; 3-5 parts of a first fluorocarbon resin; 0.3-0.5 parts of a curing agent; 85-92 parts of a first solvent; 7-13 parts of a non-solvent; The first solvent is used for being mixed with the P (VDF-HFP) resin to form a P (VDF-HFP) resin solution, wherein the first solvent comprises at least three small molecular compound solutions with different boiling points, and the absolute value of the difference of the boiling points of any different small molecular compound solutions is more than or equal to 20 ℃ and less than or equal to 180 ℃. In some embodiments, the first solvent consists of a first compound solution, a second compound solution, and a third compound solution, wherein the first compound solution has a boiling point of T 1 ℃, the second compound solution has a boiling point of T 2 ℃, and the third compound solution has a boiling point of T 3 ℃, the mixed solvent further satisfying at least one of the following characteristics: a)T1＜T2＜T3; b)39°C≤T1≤66°C; c)70°C≤T2≤120°C; d)130°C≤T3≤210°C。 In some embodiments, the mass ratio of the first compound solution to the second compound solution to the third compound solution is 3-6:2-5:2. In some embodiments, the first compound is selected from at least one of acetone, tetrahydrofuran, methylene chloride, and/or The second compound is at least one selected from butanone, methyl isobutyl ketone, sec-butyl acetate, 1-methoxy-2-propanol, and/or The third compound is at least one selected from N, N-dimethylformamide, N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, gamma-butyrolactone and dimethylcyclohexylamine. In some embodiments, the number average molecular weight of the first fluorocarbon resin is 5000-50000, and the solid content of the first fluorocarbon resin is 50-55%; The number average molecular weight of the P (VDF-HFP) resin is 50000-300000; the curing agent is selected from any one of hexamethylene diisocyanate, isophorone diisocyanate, naphthalene diisocyanate, toluene diisocyanate and diphenylmethane diisocyanate; The non-solvent is selected from deionized water. In some embodiments, there is also provided a method of preparing a radiation-cooled coating, comprising the steps of: mixing corresponding parts by mass of P (VDF-HFP) resin, a non-solvent and a first solvent, and stirring until the P (VDF-HFP) resin is fully dissolved to obtain a P (VDF-HFP) resin solution; Mixing corresponding parts by mass of a first fluorocarbon resin and a curing agent, and dripping the mixture into a P (VDF-HFP) resin solution, stopping dripping immediately when the mixed solution is changed from clear and transparent to turbid, and continuously stirring until the whole solution is uniform and stable, thereby obtaining the radiation cooling coating; wherein the first solvent is composed of a first compound solution, a second compound solution, and a third compound solution. In some embodiments, a radiation cooling coating is also provided, which comprises a substrate and a first coating layer arranged on the substrate, wherein the first coating layer comprises the radiation cooling coating, or the radiation cooling coating prepared by the method is obtained by coating the surface of the substrate. In some embodiments, the radiation-cooled coating further comprises a second coating layer positioned between and respectively connected to the first coating layer and the substrate, w