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CN-122011879-A - High-stability lead frame for integrated circuit packaging and preparation method thereof

CN122011879ACN 122011879 ACN122011879 ACN 122011879ACN-122011879-A

Abstract

The invention relates to the technical field of lead frames, in particular to a high-stability lead frame for integrated circuit packaging and a preparation method thereof. According to the invention, graphene oxide, absolute ethyl alcohol, deionized water and modified POSS are mixed and stirred for reaction to obtain the reinforcing filler. Then eugenol, epichlorohydrin and ethylene glycol bis (3-mercaptopropionic acid) are added for reaction to obtain an intermediate product. And mixing the intermediate product with the composite heat-conducting filler, and stirring for reaction to obtain the epoxidized composite heat-conducting filler. And mixing the epoxy resin, the epoxidized composite heat conducting filler, the diluent, the auxiliary agent, the reinforcing filler and the polyether amine curing agent to obtain the epoxy coating. And (3) washing and drying the lead frame, coating the epoxy paint, and curing to form a high-stability coating to obtain the high-stability lead frame. The high-stability lead frame prepared by the invention has excellent corrosion resistance and thermal conductivity, and therefore has wide application prospect in the technical field of lead frames.

Inventors

  • SHEN JIAN
  • GAO YINGYANG
  • DU JIANG
  • ZHANG SONGLIN

Assignees

  • 泰州东田电子有限公司

Dates

Publication Date
20260512
Application Date
20260121

Claims (10)

  1. 1. A method for preparing a high-stability lead frame for packaging an integrated circuit is characterized by comprising the following steps of premixing epoxy resin, an epoxidized composite heat conducting filler, a diluent and an auxiliary agent, adding a reinforcing filler and a polyether amine curing agent for secondary mixing to obtain an epoxy coating, washing and drying the lead frame, coating the epoxy coating, and curing to form a high-stability coating to obtain the high-stability lead frame.
  2. 2. The method of manufacturing a high stability lead frame for integrated circuit package according to claim 1, wherein the pre-mixing parameters are mixed for 25-30min at 35-40deg.C and the secondary mixing parameters are mixed for 10-15min at 20-35deg.C.
  3. 3. The method for preparing the high-stability lead frame for integrated circuit packaging, which is characterized by comprising, by mass, 90-100 parts of epoxy resin, 20-30 parts of an epoxidized composite heat conducting filler, 5-10 parts of a diluent, 1-2 parts of an auxiliary agent, 8-12 parts of a reinforcing filler and 20-30 parts of a polyether amine curing agent, wherein the diluent is ethylene glycol diglycidyl ether, and the auxiliary agent is an antifoaming agent.
  4. 4. The method for manufacturing a high-stability lead frame for integrated circuit packaging according to claim 3, wherein the reinforcing filler is prepared by the following steps: Step S1, mixing methanol and 36-38wt% hydrochloric acid, adding gamma-mercaptopropyl trimethoxy silane while stirring, performing cyclic condensation reaction at 90-95 ℃ for 60-70h, and standing, washing, rotary steaming, dewatering and recrystallizing after the reaction is finished to obtain mercapto-POSS; Step S2, adding polyvinylpyrrolidone into ethanol, stirring uniformly, then sequentially adding mercapto-POSS and 3-isocyanatopropyl trimethoxy silane, stirring at 25-30 ℃ for reaction for 8-10h, and centrifuging, washing and drying after the reaction is finished to obtain modified POSS; And step S3, mixing graphene oxide, absolute ethyl alcohol, deionized water and modified POSS, adding a sodium hydroxide solution after ultrasonic dispersion is uniform, adjusting the pH of the solution to 10.0-10.5, stirring and reacting for 12-14h at 60-65 ℃, and washing, suction filtering and drying after the reaction is finished to obtain the reinforcing filler.
  5. 5. The method of manufacturing a high-stability lead frame for packaging an integrated circuit according to claim 4, wherein in the step S1, the reaction volume ratio of methanol, hydrochloric acid and gamma-mercaptopropyl trimethoxysilane is 20:2 (1.0-1.2), and in the step S2, the reaction mass ratio of mercapto-POSS and 3-isocyanatopropyl trimethoxysilane is 1 (1.7-1.9).
  6. 6. The method of manufacturing a high-stability lead frame for integrated circuit packaging according to claim 4, wherein in the step S3, the mass-volume ratio of graphene oxide, absolute ethyl alcohol, deionized water and modified POSS is (1.5-2.0) g, 120mL, 40mL and (5-6) g.
  7. 7. The method for manufacturing a high-stability lead frame for integrated circuit packaging according to claim 3, wherein the preparation process of the epoxidized composite heat conductive filler is as follows: Step S1, mixing eugenol and deionized water, uniformly stirring, adding epoxy chloropropane, adding tetrabutylammonium bromide, stirring for 1.0-1.5 hours at 25-30 ℃, heating to 75-80 ℃ after stirring is finished, slowly dropwise adding 25-30wt% of sodium hydroxide solution, continuously reacting for 2-3 hours after dropwise adding is finished, and performing rotary evaporation after the reaction is finished to obtain epoxidized eugenol; Adding Ti 3 AlC 2 into 12-13mol/L hydrofluoric acid, pre-reacting for 15-20min at 0-2 ℃, reacting for 20-25h at 25-30 ℃, centrifuging, washing and freeze-drying after the reaction is finished to obtain an MXene material, adding the MXene material into deionized water, performing ultrasonic dispersion for 40-60min, slowly adding silver nitrate aqueous solution, stirring and reacting for 2-3h at 0-2 ℃, and filtering, washing and drying after stirring is finished to obtain the composite heat conducting filler; And S3, adding the composite heat-conducting filler into ethanol, performing ultrasonic dispersion for 20-30min, then adding an intermediate product, stirring and reacting for 8-10h at 25-30 ℃ in a nitrogen environment, and performing suction filtration, washing and drying after the reaction is finished to obtain the epoxidized composite heat-conducting filler.
  8. 8. The method of manufacturing a high stability lead frame for integrated circuit package according to claim 7, wherein in step S1, the reaction molar ratio of eugenol to epichlorohydrin is (1.1-1.2): 1, and the reaction molar ratio of bis (3-mercaptopropionic acid) ethylene glycol to epoxidized eugenol is (0.95-1.0).
  9. 9. The method for manufacturing the high-stability lead frame for integrated circuit packaging according to claim 7, wherein in the step S2, the mass-volume ratio of Ti 3 AlC 2 to hydrofluoric acid is 1g (17-20) mL, the reaction mass ratio of MXene material to silver nitrate is 30 (1.5-1.7), and in the step S3, the reaction mass ratio of the composite heat conducting filler to the intermediate product is 1 (2-3).
  10. 10. A high stability lead frame for integrated circuit packaging, characterized in that it is prepared by the preparation method according to any one of claims 1 to 9.

Description

High-stability lead frame for integrated circuit packaging and preparation method thereof Technical Field The invention relates to the technical field of lead frames, in particular to a high-stability lead frame for integrated circuit packaging and a preparation method thereof. Background In the age of rapid development of modern technology, lead frames for integrated circuit packaging have immeasurable value. In the miniaturization process of electronic equipment, the lead frame can realize high-density pin layout by virtue of the fine design and manufacturing process, the integrated circuit chip is tightly connected with an external circuit, and complex electric transmission is completed in a limited space, so that powerful support is provided for miniaturization of the electronic equipment. However, in some environments where high temperatures, high humidity, or the presence of chemically corrosive substances, lead frames are extremely susceptible to attack. Once corrosion occurs, lead breakage is easily caused, signal transmission between the chip and an external circuit is interrupted, and the whole electronic equipment is further caused to be faulty. Moreover, corrosion products can affect the normal operating environment of the chip, and accelerate the aging and damage of the chip. Therefore, the corrosion resistance of the lead frame needs to be improved, the lead frame can be ensured to work stably for a long time in a severe environment, and the service life of the electronic equipment is prolonged. In addition, as the performance of integrated circuit chips is continuously improved, more and more heat is generated during operation. If the heat cannot be timely dissipated, the temperature of the chip can continuously rise. Excessive temperature can seriously affect the performance and stability of the chip, so that the operation speed of the chip is reduced, data processing errors are caused, and serious faults such as thermal breakdown and the like can be possibly caused. Therefore, the lead frame is used as a part of a heat dissipation channel between the chip and the outside, and needs to have good heat conduction performance, so that heat generated by the chip is quickly conducted out, the working temperature of the chip is reduced, and performance degradation and failure occurrence probability caused by overheating are reduced. In order to overcome the defects in the prior art, the invention provides a high-stability lead frame for integrated circuit packaging and a preparation method thereof. Disclosure of Invention The invention aims to provide a high-stability lead frame for integrated circuit packaging and a preparation method thereof, which are used for solving the problems in the prior art. In order to achieve the above purpose, the present invention provides the following technical solutions: A process for preparing the high-stability lead frame for packaging IC includes such steps as pre-mixing epoxy resin, epoxidized composite heat-conducting filler, diluent and assistant, adding reinforcing filler and polyether amine as solidifying agent, mixing again to obtain epoxy paint, washing, drying, coating epoxy paint, solidifying and high-stability coating. More preferably, the premixing parameters are 35-40 ℃ for 25-30min, and the secondary mixing parameters are 20-35 ℃ for 10-15min. The epoxy coating comprises, by mass, 90-100 parts of epoxy resin, 20-30 parts of an epoxidized composite heat conducting filler, 5-10 parts of a diluent, 1-2 parts of an auxiliary agent, 8-12 parts of a reinforcing filler and 20-30 parts of a polyether amine curing agent, wherein the diluent is ethylene glycol diglycidyl ether, and the auxiliary agent is a defoaming agent. More optimally, the preparation process of the reinforcing filler comprises the following steps: Step S1, mixing methanol and 36-38wt% hydrochloric acid, adding gamma-mercaptopropyl trimethoxy silane while stirring, performing cyclic condensation reaction at 90-95 ℃ for 60-70h, and standing, washing, rotary steaming, dewatering and recrystallizing after the reaction is finished to obtain mercapto-POSS; Step S2, adding polyvinylpyrrolidone into ethanol, stirring uniformly, then sequentially adding mercapto-POSS and 3-isocyanatopropyl trimethoxy silane, stirring at 25-30 ℃ for reaction for 8-10h, and centrifuging, washing and drying after the reaction is finished to obtain modified POSS; And step S3, mixing graphene oxide, absolute ethyl alcohol, deionized water and modified POSS, adding a sodium hydroxide solution after ultrasonic dispersion is uniform, adjusting the pH of the solution to 10.0-10.5, stirring and reacting for 12-14h at 60-65 ℃, and washing, suction filtering and drying after the reaction is finished to obtain the reinforcing filler. More optimally, in the step S1, the reaction volume ratio of methanol, hydrochloric acid and gamma-mercaptopropyl trimethoxy silane is 20:2 (1.0-1.2), and in the step S2, the reaction mass ratio