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CN-122011946-A - Circuit board structure and composition for forming insulating substrate

CN122011946ACN 122011946 ACN122011946 ACN 122011946ACN-122011946-A

Abstract

A composition for forming an insulating substrate comprises 100 parts by weight of a modified liquid crystal polymer and 0.5 to 85 parts by weight of a dielectric filler. The modified liquid crystal polymer has a repeating unit structure of Wherein Ar is 1, 4-phenylene, 1, 3-phenylene, 2, 6-naphthalene, or 4,4' -biphenylene, Y is-O-or-NH-, and X is an amide group, an imide group, an amidino group, an aminocarbonylamino group, an aminothiocarbonyl group, an aminocarbonyloxy group, an aminosulfonyl group, an aminosulfonyloxy group, an aminosulfonylamino group, a carboxylate, (carboxylate) amino, (alkoxycarbonyl) oxy group, alkoxycarbonyl, hydroxyamino, alkoxyamino, cyanooxy group, isocyanato group, or a combination thereof. The insulating substrate formed using the above composition can be applied to form a circuit board structure. The composition can improve the dielectric constant of the insulating substrate and maintain a low dielectric loss factor.

Inventors

  • LI HONGRONG

Assignees

  • 佳胜科技股份有限公司

Dates

Publication Date
20260512
Application Date
20180808
Priority Date
20180724

Claims (10)

  1. 1. A composition for forming an insulating substrate, comprising: 100 parts by weight of a modified liquid crystal polymer having a repeating unit structure as follows: Wherein Ar is 、 、 Or (b) Y is Or (b) And X is 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 Or a combination thereof, wherein R 1 、R 2 and R 3 are C n H 2n+1 and n is a positive integer, and And 0.5 to 85 parts by weight of a dielectric filler, wherein the dielectric filler is selected from the group consisting of a modified ceramic material, conductive particles, and an organic material, and the modified ceramic material comprises silane groups.
  2. 2. The composition of claim 1, wherein the dielectric filler is the organic material selected from the group consisting of conductive polyaniline and copper phthalocyanine.
  3. 3. The composition of claim 1, wherein the dielectric filler is the organic material, the organic material is a modified organic material, the modified organic material comprises a modifying group selected from the group consisting of sulfonic acid groups, hydroxyl groups, ether groups, amino groups, and (p-chloromethyl styrene) based groups.
  4. 4. The composition of claim 1, wherein the dielectric filler is the conductive particle, the conductive particle is a modified conductive particle, the modified conductive particle comprises a modified carbon particle, the modified carbon particle comprises a modified group, the modified group is selected from the group consisting of an amino group, an anilino group, an amido group, a carboxyl group, and a hydroxyl group.
  5. 5. The composition of claim 1, wherein the dielectric filler is the conductive particles, the conductive particles comprising carbon-based particles and metal particles.
  6. 6. The composition of claim 5, wherein the carbon-based particles are selected from the group consisting of carbon sixty, graphene, carbon black, carbon fibers, and carbon nanotubes.
  7. 7. The composition of claim 5, wherein the metal particles are selected from the group consisting of silver, aluminum, copper, nickel, zinc, and iron.
  8. 8. The composition according to claim 1, characterized in that X is 、 、 、 、 、 、 Or (b) 。
  9. 9. The composition according to claim 1, wherein Ar is 。
  10. 10. A circuit board structure, comprising: at least one insulating substrate comprising a composition for forming an insulating substrate according to claim 1, and At least one rewiring layer is positioned on the insulating substrate.

Description

Circuit board structure and composition for forming insulating substrate The application is a divisional application of patent application filed on 2018, 08 and 08 with the application number 201810895875.0 and the application name of 'circuit board structure and composition for forming insulating substrate'. Technical Field The invention relates to a composition for forming an insulating substrate and a circuit board structure. Background For consumer electronics, the major features that the systematic packaging (SYSTEM IN PACKAGE, SIP) technology should exhibit are cost savings and miniaturization. The substrate is used as a platform for the integrated device, and has two directions. One is a substrate made of a common organic material or a multilayer printed wiring Board (PRINTED WIRING Board, PWB), and the other is a substrate made of an inorganic material, such as a silicon substrate. The latter generally has the advantage of miniaturization in combination with the wafer circuitry or processes, but cost is an indicator of concern. In addition to the low cost, the former technology can be combined with special materials by using fine process technology, such as High-Density Interconnection (HDI) technology, and the like, so as to meet the requirement of systematic packaging. In addition, as information products move to higher speeds and higher frequencies, substrate materials having high glass transition temperatures (Glass Transition Temperature, tg), low loss factors (Dissipation Factor, df), and low dielectric constants (DIELECTRIC CONSTANT, dk) are required for future development of new generation of products, such as wireless communication networks, satellite communication equipment, high power and broadband products, high-speed computers and computer workstations, and the like. At present, the copper foil substrate used for the printed circuit board (printed circuit board, PCB) is mainly made of the FR-4 board made of the epoxy resin in terms of quantity or technical level, but the electrical properties such as dielectric constant, loss factor and the like of the FR-4 are gradually unable to meet the requirement of high frequency. Therefore, there is a need for a substrate material having a high dielectric constant and maintaining a low loss factor. Disclosure of Invention In one aspect of the present invention, a composition for forming an insulating substrate is provided, wherein the dielectric constant value of the insulating substrate can be controlled by adjusting the composition of the composition. The composition for forming an insulating substrate contains 100 parts by weight of a modified liquid crystal polymer and 0.5 to 85 parts by weight of a dielectric filler. The modified liquid crystal polymer has a repeating unit structure ofWherein Ar is(1, 4-Phenylene,1, 4-phenylene),(1, 3-Phenylene,1, 3-phenylene),(2, 6-Naphtalene, 2, 6-naphthyl) or(4, 4'-Biphenylene, 4' -biphenylene) Y isOr (b)And X is(Amide group),(Imino) group,(Amidino) group,(Aminocarbonylamino) s,(Aminothiocarbonyl) a,(Aminocarbonyloxy),(Aminosulfonyl),(Aminosulfonyloxy),(Aminosulfonylamino),(Carboxylic acid ester),((Carboxylate) amino),((Alkoxycarbonyl) oxy),(Alkoxycarbonyl) a functional group,(Hydroxyamino) radical,(Alkoxyamino) group,(Cyanooxy) radical,(Isocyanato) or combinations thereof, wherein R 1、R2 and R 3 can be C nH2n+1, and n is a positive integer. The dielectric filler is selected from the group consisting of modified ceramic materials, conductive particles, and organic materials, the modified ceramic materials comprising silane groups. According to some embodiments of the invention, the dielectric filler is an organic material selected from the group consisting of conductive polyaniline and copper phthalocyanine (CuPc). According to some embodiments of the invention, the dielectric filler is an organic material, the organic material is a modified organic material, the modified organic material comprises a modifying group, the modifying group is selected from the group consisting of sulfonic acid groups, hydroxyl groups, ether groups, amino groups, and (p-chloromethyl styrene) vinyl groups. According to some embodiments of the invention, the dielectric filler is a conductive particle, the conductive particle is a modified conductive particle, the modified conductive particle comprises a modified carbon particle, the modified carbon particle comprises a modified group, and the modified group is selected from the group consisting of an amino group, an anilino group, an amido group, a carboxyl group, and a hydroxyl group. According to some embodiments of the invention, the dielectric filler is a conductive particle comprising carbon-based particles and metal particles. According to some embodiments of the invention, the carbon-based particles are selected from the group consisting of carbon sixty (C 60), graphene, carbon black, carbon fibers, and carbon nanotubes (Carbon Nanotube, CNT). According to some embodimen