CN-122011955-A - Protective adhesive tape for semiconductor device processing

Abstract

The invention relates to the technical field of adhesive tapes, in particular to a semiconductor device processing protective adhesive tape. The semiconductor device processing protective tape sequentially comprises a substrate layer and an adhesive layer, wherein the adhesive layer is prepared from an adhesive, and the adhesive comprises an acrylic copolymer, an oligomer, a curing agent and a photoinitiator, wherein the acrylic copolymer contains a functional monomer with a polar group, and the curing agent is an isocyanate curing agent. The adhesive tape has good initial adhesion performance and water resistance, the stripping force is obviously reduced after UV illumination, and the stripping has no residual adhesive, and is suitable for cutting or grinding processing protection of semiconductor devices.

Inventors

• WANG QIYOU
• LIN QINGHUANG
• LUO CONG
• ZHOU FENG
• FAN YAQIN
• MAI QIBO

Assignees

• 江苏皇冠新材料科技有限公司

Dates

Publication Date

20260512

Application Date

20260313

Claims (10)

1. 1. The semiconductor device processing protective adhesive tape is characterized by sequentially comprising a substrate layer and an adhesive layer, wherein the adhesive layer is prepared from an adhesive, and the adhesive comprises the following components: an acrylic copolymer containing a functional monomer having a polar group; Oligomers, including polyurethane-based oligomers; the curing agent is isocyanate curing agent.
2. 2. The protective tape for semiconductor device processing according to claim 1, wherein the functional monomer content is 2 to 20 wt% based on 100 wt% of the total amount of the polymerized monomers of the acrylic copolymer.
3. 3. The protective tape for semiconductor device processing according to claim 1 or 2, wherein the glass transition temperature of the acrylic copolymer is-30 to 0 ℃.
4. 4. The protective tape for semiconductor device processing according to claim 3, wherein the urethane oligomer is used in an amount of 10 to 50 parts by weight based on 100 parts by weight of the acrylic copolymer.
5. 5. The protective tape for semiconductor device processing according to claim 4, wherein the oligomer further comprises bisphenol a-based oligomer, and the amount of the bisphenol a-based oligomer is 0 to 120 parts by weight based on 100 parts by weight of the acrylic copolymer.
6. 6. The protective tape for semiconductor device processing according to claim 1, wherein the hydroxyl value of the urethane oligomer is 10 to 160 mgKOH/g.
7. 7. The protective tape for semiconductor device processing according to claim 5, wherein the bisphenol a oligomer has a hydroxyl value of 10 to 160 mgKOH/g.
8. 8. The protective tape for semiconductor device processing according to claim 1, wherein the curing agent is used in an amount of 0.1 to 5 parts by weight based on 100 parts by weight of the acrylic copolymer.
9. 9. The semiconductor device processing protective tape of claim 1, wherein the adhesive further comprises a catalyst; The catalyst is used in an amount of 0.1 to 0.5 parts by weight relative to 100 parts by weight of the acrylic copolymer.
10. 10. The protective tape for semiconductor device processing according to claim 9, wherein the catalyst is an organotin-based catalyst.

Description

Protective adhesive tape for semiconductor device processing Technical Field The invention relates to the technical field of adhesive tapes, in particular to a semiconductor device processing protective adhesive tape. Background In the dicing or grinding process of semiconductor devices (e.g., wafers), UV-curable adhesive tapes are currently used to attach and fix the devices, and after the process is completed, the adhesive tape is cured by UV light irradiation to facilitate the peeling of the adhesive tape. In order to avoid damage to devices caused by heat generated in the processing process, cooling water is generally required to be used for washing and cooling. However, the UV-curable adhesive tape has poor water resistance, and the adhesive property of the adhesive tape is attenuated when the adhesive tape is rinsed with cooling water, which affects the fixation of the device, and further affects the cutting or grinding precision of the device, and even leads to disqualification of the device. Therefore, how to improve the water resistance of the UV adhesive-reducing tape while ensuring that the UV adhesive-reducing tape has good initial adhesive force and light irradiation viscosity reduction becomes a key for ensuring the processing yield and reliability of the semiconductor device. In view of this, the present invention has been made. Disclosure of Invention The invention aims to provide a semiconductor device processing protective adhesive tape, which has good initial adhesion performance and water resistance, obviously reduces peeling force after UV illumination, has no residual adhesive after peeling, and is suitable for cutting or grinding processing protection of semiconductor devices. In order to achieve the above object, the invention provides a semiconductor device processing protective tape, which sequentially comprises a substrate layer and an adhesive layer, wherein the adhesive layer is prepared from an adhesive, and the adhesive comprises the following components: an acrylic copolymer containing a functional monomer having a polar group; Oligomers, including polyurethane-based oligomers; the curing agent is isocyanate curing agent. Further, the functional monomer content is 2-20 wt% based on the total amount of polymerized monomers of the acrylic copolymer being 100 wt%. Further, the glass transition temperature (Tg) of the acrylic copolymer is-30 to 0 ℃. Further, the urethane oligomer is used in an amount of 10 to 50 parts by weight based on 100 parts by weight of the acrylic copolymer. Further, the oligomers also include bisphenol a type oligomers. Further, the bisphenol A oligomer is used in an amount of 0 to 120 parts by weight based on 100 parts by weight of the acrylic copolymer. Further, the hydroxyl value of the bisphenol A oligomer is 10 to 160 mgKOH/g. Further, the hydroxyl value of the polyurethane oligomer is 10-160 mgKOH/g. Further, the curing agent is used in an amount of 0.1 to 5 parts by weight relative to 100 parts by weight of the acrylic copolymer. Further, the adhesive also comprises a catalyst. Further, the catalyst is used in an amount of 0.1 to 0.5 parts by weight relative to 100 parts by weight of the acrylic copolymer. Further, the catalyst is an organotin catalyst. Compared with the prior art, the invention has the beneficial effects that: The adhesive layer of the semiconductor device processing protective tape is prepared by introducing polyurethane oligomer into acrylic copolymer containing functional monomer. The Tg of the acrylic copolymer is beneficial to guaranteeing cohesive strength of the adhesive layer, the polyurethane oligomer introduced on the basis can resist water molecules from entering between a to-be-adhered object and the adhesive layer due to good wettability, so that water resistance of the adhesive tape is improved, hydroxyl groups of the polyurethane oligomer and polar groups of the acrylic copolymer can react with isocyanate groups of isocyanate curing agents, cohesive strength of the adhesive is further improved, the adhesive layer has good water resistance while good wettability and adhesiveness are maintained, double bond cross-linking polymerization can be carried out among the oligomers when viscosity reduction is needed, the cohesive strength is further enhanced, volume shrinkage of the adhesive layer is caused, and viscosity reduction is achieved, and the problem of residual adhesive stripping is effectively avoided due to no precipitation of small molecules. Detailed Description The technical solution of the present invention will be clearly and completely described in conjunction with the specific embodiments, but it will be understood by those skilled in the art that the examples described below are some, but not all, examples of the present invention, and are intended to be illustrative only and should not be construed as limiting the scope of the present invention. All other embodiments, which can be made by those skilled i