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CN-122011956-A - Waterproof semiconductor device processing protective adhesive tape

CN122011956ACN 122011956 ACN122011956 ACN 122011956ACN-122011956-A

Abstract

The invention relates to the technical field of adhesive tapes, in particular to a waterproof protective adhesive tape for processing semiconductor devices. The waterproof semiconductor device processing protective adhesive tape sequentially comprises a substrate layer and an adhesive layer, wherein the adhesive layer is prepared from an adhesive, and the adhesive comprises an acrylic copolymer, an oligomer, a curing agent and a photoinitiator, wherein the acrylic copolymer contains a functional monomer with a polar group, and the oligomer comprises bisphenol A oligomer, and the curing agent is isocyanate curing agent. The adhesive tape has good initial adhesion performance and water resistance, the stripping force is obviously reduced after UV illumination, and the stripping has no residual adhesive, and is suitable for cutting or grinding processing protection of semiconductor devices.

Inventors

  • WANG QIYOU
  • LIN QINGHUANG
  • LUO CONG
  • ZHOU FENG
  • FAN YAQIN
  • MAI QIBO

Assignees

  • 江苏皇冠新材料科技有限公司

Dates

Publication Date
20260512
Application Date
20260313

Claims (10)

  1. 1. The waterproof semiconductor device processing protective adhesive tape is characterized by sequentially comprising a substrate layer and an adhesive layer, wherein the adhesive layer is prepared from an adhesive, and the adhesive comprises the following components: an acrylic copolymer containing a functional monomer having a polar group; the presence of an oligomer of the polymer, the oligomer comprises bisphenol A oligomer; the curing agent is isocyanate curing agent.
  2. 2. The water-resistant protective tape for semiconductor device processing according to claim 1, wherein the functional monomer is contained in an amount of 2 to 20 wt% based on 100 wt% of the total amount of the polymerized monomers of the acrylic copolymer.
  3. 3. The water-resistant protective tape for semiconductor device processing according to claim 1 or 2, wherein the glass transition temperature of the acrylic copolymer is not higher than-30 ℃.
  4. 4. The water-resistant protective tape for semiconductor device processing according to claim 3, wherein the bisphenol a oligomer is used in an amount of 10 to 60 parts by weight based on 100 parts by weight of the acrylic copolymer.
  5. 5. The water-resistant protective tape for semiconductor device processing according to claim 1 or 4, wherein the bisphenol a oligomer has a hydroxyl value of 10 to 160 mgKOH/g.
  6. 6. The water-resistant protective tape for semiconductor device processing according to claim 4, wherein the oligomer further comprises a urethane oligomer in an amount of 0 to 10 parts by weight relative to 100 parts by weight of the acrylic copolymer.
  7. 7. The water-resistant protective tape for semiconductor device processing according to claim 6, wherein the hydroxyl value of the polyurethane oligomer is 10 to 160 mgKOH/g.
  8. 8. The water-resistant protective tape for semiconductor device processing according to claim 1, wherein the curing agent is used in an amount of 0.1 to 5 parts by weight based on 100 parts by weight of the acrylic copolymer.
  9. 9. The water-resistant semiconductor device processing protective tape of claim 1, wherein the adhesive further comprises a catalyst; The catalyst is used in an amount of 0.1 to 0.5 parts by weight relative to 100 parts by weight of the acrylic copolymer.
  10. 10. The water-resistant semiconductor device processing protective tape of claim 9, wherein the catalyst is an organotin-based catalyst.

Description

Waterproof semiconductor device processing protective adhesive tape Technical Field The invention relates to the technical field of adhesive tapes, in particular to a waterproof protective adhesive tape for processing semiconductor devices. Background In the manufacturing process of semiconductor devices (e.g., wafers, resistive elements, package substrates, ceramics, etc.), an adhesive tape is often used to protect and secure the surface of the device, then a dicing or polishing process is performed, and after dicing or polishing is completed, the adhesive tape is peeled from the surface of the device. To facilitate peeling, UV-curable adhesive tapes, typically acrylic pressure sensitive adhesives, are often used for curing by UV illumination. Because a large amount of heat and scraps are generated in the cutting and grinding processes of the device, the device needs to be flushed with water to cool down and flush scraps. However, the acrylic pressure-sensitive adhesive in the prior art has poor water resistance, and the adhesiveness of the pressure-sensitive adhesive is lowered during flushing, which affects the fixation of devices and further affects the processing accuracy thereof. Therefore, it is important to improve the water resistance of UV-reducing adhesive tapes. The main methods for improving the water resistance of the pressure-sensitive adhesive in the prior art comprise the steps of reducing the content of hydrophilic monomers, introducing hydrophobic monomers or adding hydrophobic auxiliary agents. However, reducing the hydrophilic monomer content or introducing hydrophobic monomers reduces the adhesion of the pressure sensitive adhesive, while adding hydrophobic auxiliaries increases the risk of adhesive residue after UV irradiation. Therefore, it is important to develop an adhesive tape which is compatible with adhesion, peelability and water resistance. In view of this, the present invention has been made. Disclosure of Invention The invention aims to provide a waterproof protective adhesive tape for processing a semiconductor device, which has good initial adhesion performance and water resistance, obviously reduces the peeling force after UV illumination, has no residual adhesive after peeling, and is suitable for cutting or grinding processing protection of the semiconductor device. In order to achieve the above purpose, the invention provides a waterproof semiconductor device processing protective adhesive tape, which sequentially comprises a substrate layer and an adhesive layer, wherein the adhesive layer is prepared from an adhesive, and the adhesive comprises the following components: an acrylic copolymer containing a functional monomer having a polar group; the presence of an oligomer of the polymer, the oligomer comprises bisphenol A oligomer; the curing agent is isocyanate curing agent. Further, the content of the functional monomer is 2-20wt% based on the total amount of the polymerized monomers of the acrylic copolymer being 100 wt%. Further, the glass transition temperature (Tg) of the acrylic copolymer is not higher than-30 ℃. Further, the bisphenol A oligomer is used in an amount of 10 to 60 parts by weight based on 100 parts by weight of the acrylic copolymer. Further, the hydroxyl value of the bisphenol A oligomer is 10 to 160 mgKOH/g. Further, the oligomer also includes polyurethane-based oligomers. Further, the urethane oligomer is used in an amount of 0 to 10 parts by weight based on 100 parts by weight of the acrylic copolymer. Further, the hydroxyl value of the polyurethane oligomer is 10-160 mgKOH/g. Further, the curing agent is used in an amount of 0.1 to 5 parts by weight relative to 100 parts by weight of the acrylic copolymer. Further, the adhesive also comprises a catalyst. Further, the catalyst is used in an amount of 0.1 to 0.5 parts by weight relative to 100 parts by weight of the acrylic copolymer. Further, the catalyst is an organotin catalyst. Compared with the prior art, the invention has the beneficial effects that: The waterproof protective adhesive tape for the semiconductor device is characterized in that bisphenol A oligomer is introduced into an acrylic copolymer containing polar group functional monomers, the low Tg of the acrylic copolymer is beneficial to guaranteeing the wettability of the adhesive layer, the bisphenol A oligomer has high structural strength, the capability of the adhesive layer for resisting water molecule permeation can be effectively improved, the hydroxyl groups of the bisphenol A oligomer and the polar groups of the acrylic copolymer can react with isocyanate groups of isocyanate curing agents, the cohesive strength of the adhesive is improved, the adhesive layer has good water resistance while good wettability and adhesiveness are maintained, double bond cross-linking polymerization can be carried out between the oligomers when viscosity reduction is needed, the cohesive strength is further enhanced, the volume shrinkage