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CN-122011964-A - Weldable high-damping glue and application thereof

CN122011964ACN 122011964 ACN122011964 ACN 122011964ACN-122011964-A

Abstract

The invention discloses a weldable high-damping glue and application thereof, and the weldable high-damping glue comprises, by weight, 100 parts of damping rubber, 50 parts of bisphenol A epoxy resin, 30-150 parts of conductive damping function filler, 5-25 parts of latent curing agent, 10-40 parts of toughening agent, 1-5 parts of coupling agent and 1-10 parts of thixotropic agent, wherein the conductive damping function filler is a hollow microsphere with a core-shell structure, the hollow microsphere with the core-shell structure consists of a hollow polystyrene microsphere or a hollow glass microsphere with an inner layer and a metal coating with an outer layer, and the inner cavity of the hollow microsphere with the core-shell structure is air. The structural adhesive can simultaneously realize high damping vibration attenuation, strong bonding stability, reliable welding performance and excellent processing suitability, is applied to damping composite metal plates, and can still resist stamping forming processing after long-term storage without adhesive layer cracking or layering risks.

Inventors

  • Ren hancheng
  • HE CHAO
  • LIANG QIXING

Assignees

  • 东莞希乐斯科技有限公司

Dates

Publication Date
20260512
Application Date
20260309

Claims (10)

  1. 1. The weldable high-damping glue is characterized by comprising, by weight, 100 parts of damping rubber, 50 parts of bisphenol A epoxy resin, 30-150 parts of conductive damping function filler, 5-25 parts of latent curing agent, 10-40 parts of toughening agent, 1-5 parts of coupling agent and 1-10 parts of thixotropic agent, wherein the conductive damping function filler is a core-shell structure hollow microsphere, the core-shell structure hollow microsphere is composed of an inner layer hollow polystyrene microsphere or hollow glass microsphere and an outer layer metal coating, and the inner cavities of the hollow polystyrene microsphere and the hollow glass microsphere are air.
  2. 2. The weldable high-damping glue according to claim 1, wherein the hollow microspheres of the core-shell structure have a particle size of 50-1000nm, the hollow polystyrene microspheres and the hollow glass microspheres have a thickness of 30-50nm, and the metal coating has a thickness of 10-50nm.
  3. 3. The solderable high damping glue of claim 1, wherein the metal plating is gold plating or silver plating.
  4. 4. The weldable high-damping glue of claim 1, wherein the damping rubber is at least one of nitrile rubber, solution polymerized styrene-butadiene rubber, butyl rubber, brominated butyl rubber.
  5. 5. The weldable high-damping glue of claim 1, wherein the latent curing agent is at least one of dicyandiamide, adipic acid dihydrazide, modified amine microcapsule curing agent and imidazole latent accelerator.
  6. 6. The weldable high-damping glue of claim 1, wherein the toughening agent is at least one of carboxyl-terminated nitrile rubber, polyurethane modified epoxy resin, thermoplastic polyamide particles, and styrene-butadiene core-shell rubber particles.
  7. 7. The weldable high-damping glue of claim 1, wherein the coupling agent is at least one of KH-550, KH-560, KH-792, and the thixotropic agent is at least one of fumed silica, organobentonite, and polyamide wax.
  8. 8. The welding high-damping glue according to claim 1, further comprising a solvent, wherein the solvent is at least one of ethyl acetate, methylcyclohexane, methyl ethyl ketone and methyl isobutyl ketone, and the solid content of the welding high-damping glue is 25-35%.
  9. 9. The application of the weldable high-damping glue is characterized in that the weldable high-damping glue is applied to a damping composite metal plate, the damping composite metal plate comprises at least two layers of metal plates and a damping constraint layer positioned between the metal plates, and the damping constraint layer is formed by curing the weldable high-damping glue according to any one of claims 1-8.
  10. 10. The application of a solderable high damping glue according to claim 9, wherein the application comprises the steps of: S1, cleaning, degreasing and roughening the surfaces to be bonded of at least two layers of metal plates in sequence, wherein the roughening is sand blasting or phosphating, and the surface roughness Ra of the metal plates after the roughening is 1.5-3.0 mu m; S2, coating the weldable high-damping glue on the treatment surface of at least one layer of metal plate to form a glue layer with the thickness of 0.05-1.0 mm; S3, aligning and attaching another layer of metal plate, applying pressure of 0.1-1.5MPa, maintaining pressure for 5-10 minutes to remove bubbles, heating for 10-60 minutes at 120-180 ℃, and curing for 24 hours at 80-100 ℃ to obtain the damping composite metal plate.

Description

Weldable high-damping glue and application thereof Technical Field The invention relates to the field of adhesives, in particular to a weldable high-damping glue and application thereof. Background Damping gel is used as a core functional material compounded by laminating metal plates, reduces structural vibration and noise through an energy loss mechanism, and has been widely applied to the scenes of automobile body panels, engine hoods, aerospace structural members, building curtain walls and the like. Along with the continuous upgrading of the industrial field to the requirement of product performance, not only damping adhesive is required to have good vibration and noise reduction effects, but also structural bonding strength, environmental stability and subsequent processing suitability (such as welding and stamping forming) are required to be considered. Various damping-related adhesives and composite boards have been disclosed in the prior art. Such as: CN 119775939A discloses a lightweight vibration-damping noise-reducing structure adhesive, which uses epoxy resin as a matrix, and high damping resin, rubber and filler, adopts a low-temperature curing system, can be cured at 130 ℃, solves the problems of insufficient vibration-damping noise-reducing and bonding performances, but does not relate to the optimal design of welding performance; Although the polyurethane adhesive disclosed in CN 112280453A emphasizes the bonding strength and ageing resistance, the damping performance is weak, and the requirement of high vibration reduction is difficult to meet; the wide-temperature-range high-damping epoxy resin structural adhesive disclosed in CN 109321228A realizes the balance of damping and strength through polyurethane@hollow glass microsphere composite particles, but does not consider the influence of conductivity on the welding process; Although the damping composite steel plate disclosed in CN 110591261A has excellent damping, adhesion and flame retardant properties, the phenomenon of cracking or delamination of the adhesive layer is easy to occur when stamping is performed after long-term storage, and the welding suitability of the damping composite steel plate is not clear. In addition, in the prior art, part of damping rubber has a short performance plate, and when common conductive filler (such as conductive silver powder) is adopted, the requirement of welding conductivity can be met, but the damping performance is obviously reduced, and the damping effect and the bonding toughness are difficult to be simultaneously achieved by a single damping rubber component, so that the long-term stability of the composite board is influenced. Therefore, developing a structural adhesive and a corresponding composite metal plate capable of simultaneously realizing high damping vibration attenuation, strong bonding stability, reliable welding performance and excellent processing suitability becomes a technical problem to be solved in the field. Disclosure of Invention The invention aims to overcome the defects of the prior art, provides a weldable high-damping glue, which realizes the organic unification of high damping loss factor, excellent bonding strength, environmental stability and reliable conductive welding performance through the collaborative design of components, is applied to damping composite metal plates, and can still resist stamping forming processing after long-term storage, and no risk of cracking or layering of a glue layer. In order to achieve the aim of the invention, the invention adopts the following technical scheme: The invention provides weldable high-damping glue, which comprises, by weight, 100 parts of damping rubber, 50 parts of bisphenol A epoxy resin, 30-150 parts of conductive damping function filler, 5-25 parts of latent curing agent, 10-40 parts of toughening agent, 1-5 parts of coupling agent and 1-10 parts of thixotropic agent, wherein the conductive damping function filler is a core-shell structure hollow microsphere, the core-shell structure hollow microsphere is composed of an inner layer hollow polystyrene microsphere or hollow glass microsphere and an outer layer metal coating, and the inner cavity of the hollow polystyrene microsphere or the hollow glass microsphere is air. Further, the particle size of the hollow microsphere with the core-shell structure is 50-1000nm, the thicknesses of the hollow polystyrene microsphere and the hollow glass microsphere are 30-50nm, and the thickness of the metal coating is 10-50nm. Preferably, the particle size of the hollow microsphere with the core-shell structure is 200-800nm, more preferably 500-600nm, and the thickness of the metal coating is 20-40nm, more preferably 30nm. Further, the metal plating layer is a gold plating layer or a silver plating layer. Further, the damping rubber is at least one of nitrile rubber, solution polymerized styrene-butadiene rubber, butyl rubber and brominated butyl rubber. Further, the latent cu