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CN-122011986-A - Low-temperature quick-drying type bar planting adhesive and preparation method thereof

CN122011986ACN 122011986 ACN122011986 ACN 122011986ACN-122011986-A

Abstract

The application belongs to the technical field of bar planting glue, and particularly relates to low-temperature quick-drying bar planting glue which comprises, by weight, 18-22 parts of epoxy resin, 4.8-5.3 parts of diluent, 0.5-0.6 part of first white carbon black, 18-22 parts of first silica micropowder, 10-12 parts of curing agent, 0.1 part of coupling agent, 0.5-0.8 part of second white carbon black, 6.5-11.5 parts of second silica micropowder and 0.03-0.06 part of color paste. The integral structure provided by the embodiment of the application has certain thixotropy, no flowing during construction, good bonding performance with most structural materials, no crystallization, low-temperature solidification, capability of better meeting various requirements specified in national standards, and meeting the construction requirement of low temperature-10 ℃, capability of being stressed in 2 hours at normal temperature of 23 ℃, strong corrosion resistance, no flowing during construction and higher bonding performance.

Inventors

  • HUANG ZIXIU
  • LIU YONG
  • XU BAOYU
  • LI WENXUAN

Assignees

  • 南京曼卡特科技有限公司

Dates

Publication Date
20260512
Application Date
20260212

Claims (9)

  1. 1. The low-temperature quick-drying type bar planting adhesive comprises a material A and a material B and is characterized by comprising the following components in parts by weight: 18-22 parts of epoxy resin, 4.8-5.3 parts of diluent, 0.5-0.6 part of first white carbon black and 18-22 parts of first silicon micropowder; And the material B comprises 10-12 parts of curing agent, 0.1 part of coupling agent, 0.5-0.8 part of second white carbon black, 6.5-11.5 parts of second silicon micropowder and 0.03-0.06 part of color paste.
  2. 2. The low-temperature quick-drying type bar planting adhesive of claim 1, wherein the epoxy resin comprises mixed resin of 1828 resin and 170 resin, and the weight ratio of 1828 resin to 170 resin is 4:1.
  3. 3. The low-temperature quick-drying bar coating adhesive of claim 1, wherein the diluent comprises a mixed diluent of 692 diluent and 622 diluent, wherein the weight ratio of 692 diluent to 622 diluent is 1:4.
  4. 4. The low-temperature quick-drying bar planting adhesive and the application method thereof according to claim 1, wherein the particle size of the first silicon micro powder comprises mixed silicon micro powder of first 400-mesh silicon micro powder and first 1500-mesh silicon micro powder, and the weight ratio of the first 400-mesh silicon micro powder to the first 1500-mesh silicon micro powder is 1:1.
  5. 5. The low-temperature quick-drying type bar planting adhesive and the application method thereof according to claim 1, wherein the particle size of the second silicon micro powder comprises mixed silicon micro powder of second 400-mesh silicon micro powder and second 1500-mesh silicon micro powder, and the weight ratio of the second 400-mesh silicon micro powder to the second 1500-mesh silicon micro powder is 1:1.
  6. 6. The low-temperature quick-drying type bar planting adhesive and the use method thereof according to claim 1, wherein the materials A and B are respectively specifically: 1828 resin, 170 resin, 692 diluent, 622 diluent, first N20 white carbon black, first 400-mesh silica powder and first 1500-mesh silica powder; And the material B comprises 5230B curing agent, KH-550 coupling agent, second N20 white carbon black, second 400-mesh silica micropowder, second 1500-mesh silica micropowder and SB2008 blue slurry.
  7. 7. The low-temperature quick-drying type bar planting adhesive of claim 6, wherein the optimal parts by weight of the material A and the material B respectively comprise the following components in parts by weight: Material A comprises 16 parts of 1828 resin, 4 parts of 170 resin, 1 part of 692 diluent, 4 parts of 622 diluent, 0.6 part of first N20 white carbon black, 10 parts of first 400-mesh silica micropowder and 10 parts of first 1500-mesh silica micropowder; 5230B curing agent 10.91 parts, KH-550 coupling agent 0.1 part, second N20 white carbon black 0.65 part, second 400 mesh silicon micro powder 4.55 parts, second 1500 mesh silicon micro powder 4.55 parts, SB2008 blue pulp 0.05 parts.
  8. 8. The low-temperature quick-drying type bar planting adhesive of claim 1, wherein the A material and the B material are mixed before use, and the mixing volume ratio of the A material to the B material is 2:1.
  9. 9. The preparation method of the low-temperature quick-drying type bar planting adhesive is characterized by comprising the following steps of: S1, preparing a material A and a material B: The preparation method of the material A comprises the steps of firstly adding a set amount of mixed resin into a stirring tank, adding a set amount of mixed diluent, opening a power switch of the stirring machine, starting the stirring switch, stirring for 2min, then closing the stirring machine, adding a set amount of first N20 white carbon black, stirring for 5min, adding a set amount of mixed first silica micropowder, stirring for 20min, adding the first N20 white carbon black, stirring, adding the first silica micropowder, discharging, returning to the pot, continuing stirring, and closing the stirring machine after colloid stirring is uniform. The preparation of the material B comprises the steps of firstly adding a set amount of 5230B curing agent into a stirring tank, adding a set amount of accelerator and a set amount of SB2008 blue slurry, starting a power switch of the stirring machine, starting the stirring machine, stirring for 2min, adding a set amount of KH-550 coupling agent, stirring for 2min, closing the stirring machine, adding a set amount of second N20 white carbon black, stirring for 5min, adding a set amount of second silica powder, stirring for 20min, returning to the kettle after discharging, continuing stirring until the colloid is uniform, and closing the stirring machine. S2, grinding materials A and B: starting the grinder, opening a discharge valve of the stirrer, starting a discharge switch and a stirring switch, adjusting the distance between three rollers of the grinder to a proper distance so as to realize optimal discharge, placing a transfer barrel at a discharge port of the grinder, respectively injecting materials A and B into the grinder, and respectively pouring full barrels of sizing materials into a sizing hopper of a A, B sizing machine. S3, glue filling: The power supply and the high-pressure air pump of the glue filling machine are connected, a power supply switch of the glue filling machine is turned on, the material A reading of the glue regulating valve is regulated to 7745, the material B reading is regulated to 8812, and double groups of glue bottles are placed under the discharge port of the glue filling machine, wherein each 500mL of double groups of glue bottles are packaged, wherein the material A is 333mL, and the material B is 167mL.

Description

Low-temperature quick-drying type bar planting adhesive and preparation method thereof Technical Field The application relates to the technical field of bar planting glue, in particular to low-temperature quick-drying bar planting glue and a preparation method thereof. Background The chemical method is used for planting the tendons, which are also called planting tendons for short. The method comprises the steps of drilling holes in hard base materials such as concrete, wall rock and the like, then injecting reinforcing bar planting anchoring glue, then implanting common reinforcing bars or bolts, and integrating the reinforcing bars or bolts with the base materials after the anchoring glue is solidified, so that the reinforcing and strengthening effects are achieved, the connection between the concrete and the reinforcing bars is enhanced, and the concrete and the reinforcing bars can work together to bear various stresses. The safety identification of the low-temperature quick-fixing anchoring adhesive is specially regulated in technical Specification for safety identification of engineering structural reinforcing materials in GB 50728-2011, the low-temperature quick-fixing anchoring adhesive is required to be matched and bonded in the lowest temperature environment marked in the use specification, a test piece is cured and maintained for a regulated time in a low-temperature state, and the reduction percentage of the tensile shear strength of the anchoring adhesive colloid steel to steel in the low-temperature environment is required to be not more than 10 percent. The epoxy resin anchoring adhesive has the lowest use temperature of 5 ℃ and the least part of products of-5 ℃, can be used in an environment of-10 ℃ and cured and can reach the performance index required by the specification, thus the construction can be carried out even in northern areas in winter, the construction period of the north is prolonged, the curing speed of the adhesive at normal temperature is very high, the strength development is rapid, the main materials of the quick-curing anchoring adhesive are vinyl esters or acrylic esters and the like, and the main characteristics are quick curing and short construction period. However, the method has the great disadvantages that the taste is heavy, particularly the construction is carried out under the condition of poor ventilation condition of a tunnel, the pungent smell is very unfriendly to human body, the brittleness after solidification is large, the toughness is poor, and the colloid is easy to crack or is adhered to a substrate to fail under dynamic load or vibration environment for a long time, so that potential safety hazard is caused. The anchoring adhesive developed by Mankott according to the current situation is prepared by taking modified epoxy resin as a main material and matching with nano-scale materials, has low odor, has toughness far superior to that of vinyl esters and other quick-drying anchoring adhesives after curing, is designed into hard injection type anchoring adhesive packages, is convenient to construct, has extremely rapid curing speed which is close to that of a vinyl ester system, is cured in an environment of about 23 ℃ at normal temperature, can bear force after curing for 2-3 hours after chemical anchors or reinforcing steel bars are planted, can be used for traffic, is used for some projects at present, particularly for quick repair and fixation of shield, high-speed rail, subway tunnels and the like, has a construction period of only 3-4 hours, is generally vinyl ester system or acrylic ester, has high brittleness and toughness although the curing is rapid from the aspect of product characteristics, is easy to crack and age, and has heavier taste during construction. Disclosure of Invention The application provides a low-temperature quick-drying type bar planting adhesive and a preparation method thereof, which aim to solve the problems. The application provides low-temperature quick-drying bar planting glue which comprises a material A and a material B, wherein the material A and the material B respectively comprise the following components in parts by weight: 18-22 parts of epoxy resin, 4.8-5.3 parts of diluent, 0.5-0.6 part of first white carbon black and 18-22 parts of first silicon micropowder; And the material B comprises 10-12 parts of curing agent, 0.1 part of coupling agent, 0.5-0.8 part of second white carbon black, 6.5-11.5 parts of second silicon micropowder and 0.03-0.06 part of color paste. Preferably, the epoxy resin comprises a blend of 1828 resin and 170 resin, wherein the weight ratio of 1828 resin to 170 resin is 4:1. Preferably, the diluents include a mixed diluent of 692 and 622 diluents, wherein the weight ratio of 692 and 622 diluents is 1:4. Preferably, the particle size of the first silicon micropowder comprises mixed silicon micropowder of first 400-mesh silicon micropowder and first 1500-mesh silicon micropowder, wherein th