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CN-122011987-A - Glue composition and packaging adhesive film

CN122011987ACN 122011987 ACN122011987 ACN 122011987ACN-122011987-A

Abstract

The invention provides a glue composition for improving high-density packaging yield and reliability of a packaging glue film, which comprises, by mass, 45-60 parts of an epoxy resin mixture, 1-2.2 parts of an initiator, 7-14 parts of a mercaptan curing agent and 16.5-72 parts of an auxiliary agent, wherein the epoxy equivalent of the epoxy resin mixture is 120-200g/eq, and the viscosity of the epoxy resin mixture is 800-2000 mPa.s.

Inventors

  • WU JIAHUA
  • ZHOU SHAOHONG
  • KONG BEIBEI
  • ZHENG HAITING

Assignees

  • 广州慧谷新材料科技股份有限公司

Dates

Publication Date
20260512
Application Date
20260213

Claims (10)

  1. 1. The glue composition is characterized by comprising, by mass, 45-60 parts of an epoxy resin mixture, 1-2.2 parts of an initiator, 7-14 parts of a mercaptan curing agent and 16.5-72 parts of an auxiliary agent; The epoxy resin mixture has an epoxy equivalent of 120-200g/eq and a viscosity of 800-2000 mPa.s.
  2. 2. The glue composition according to claim 1, wherein the molar ratio of epoxy groups in the epoxy resin mixture to mercapto groups of the thiol curing agent is 1:1.05-1.1.
  3. 3. Glue composition according to claim 1, wherein the epoxy resin mixture is selected from one or more of liquid bisphenol a epoxy resin, liquid cycloaliphatic epoxy resin, liquid hydrogenated bisphenol a epoxy resin.
  4. 4. A glue composition according to claim 3, wherein the epoxy mixture comprises a liquid bisphenol a type epoxy resin and a liquid cycloaliphatic epoxy resin; The mass ratio of the liquid bisphenol A epoxy resin to the liquid alicyclic epoxy resin is 2:1-3:1.
  5. 5. The glue composition according to claim 1, wherein the thiol curing agent has a thiol content of 3-4 mmol/g and a thermal decomposition temperature of not less than 280 ℃.
  6. 6. The glue composition of claim 5, wherein the thiol curing agent comprises one or more of trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptopropionate), dipentaerythritol hexa (3-mercaptopropionate).
  7. 7. The glue composition according to claim 6, wherein the mass ratio of trimethylolpropane tri (3-mercaptopropionate) to pentaerythritol tetra (3-mercaptopropionate) is 2:1-3:1.
  8. 8. The glue composition according to claim 1, further comprising 0.5-2 parts of a curing auxiliary agent, 10-20 parts of a toughening agent, 0.1-0.5 part of a photo sensitizer, 4-9 parts of a semi-solid modifier and 0-35 parts of a light diffusing powder.
  9. 9. The glue composition of claim 8, wherein the initiator comprises a photo-cationic initiator comprising a triarylsulfonium salt initiator; And/or the curing auxiliary comprises one or more of tertiary amine compounds and organic phosphine compounds, wherein the tertiary amine compounds comprise one or more of triethanolamine and dimethylbenzylamine, and the organic phosphine compounds comprise triphenylphosphine; and/or the toughening agent comprises one or more of an epoxy modified toughening agent and a sulfhydryl modified toughening agent, and the functionality of the toughening agent is 1-2.
  10. 10. A packaging adhesive film comprising a first release film, a second release film and a glue layer, wherein the glue layer is formed from the glue composition of any one of claims 1-9, and the glue layer is located between the first release film and the second release film.

Description

Glue composition and packaging adhesive film Technical Field The invention relates to the technical field of optical cement, in particular to a glue composition and a packaging adhesive film. Background With rapid iteration of Mini LED technology to high resolution and small chip direction, pixel spacing has entered sub-millimeter level, chip size is increasingly miniaturized, which puts high precision and high reliability requirements on core packaging materials. The Mini LED COB substrate as a chip direct carrier is extremely fine in circuit wiring, has strict requirements on flatness, and is difficult to adapt to the requirements of high-density packaging due to the defects of strong inherent fluidity, low molding precision, insufficient process stability and the like of the traditional liquid packaging material. Therefore, the film packaging technology with higher process precision becomes an important development direction, however, the current mainstream film products still have some key technical defects, and the application of the film products in the Mini LED COB field is restricted. Firstly, the solvent-based adhesive film is easy to generate volatile organic matter pollution in the preparation and use processes, residual solvents are easy to form bubbles at the packaging interface, so that the yield is reduced and the long-term reliability of a circuit is possibly influenced, secondly, the all-solid-state adhesive film is usually required to be melted and pressed at high temperature, the process is high in energy consumption and low in efficiency, the thermal warping of a substrate is possibly caused, the connection integrity of a fine circuit is possibly damaged, furthermore, the heat curing system (such as anhydride or common amine) adopted by most of the semi-solid-state adhesive films is poor in latency, the storage period of the adhesive film is short, the viscosity is attenuated, and small molecular byproducts are possibly precipitated during high-temperature curing, and the circuit is corroded or the long-term stability of the packaging interface is possibly influenced. In addition, part of the adhesive film adopting the free radical photo-curing system is affected by the oxygen polymerization inhibition effect, and uniform and thorough curing is difficult to realize. Therefore, there is a need for a solvent-free packaging film that combines high precision processability, excellent storage stability, low process temperature, and high packaging reliability. Disclosure of Invention The invention aims to provide a glue composition and a packaging adhesive film, which are used for solving the problems of low high-density packaging yield and low reliability in the prior art. The technical scheme adopted by the invention for solving the technical problems is as follows: in a first aspect, the invention provides a glue composition, which comprises, by mass, 45-60 parts of an epoxy resin mixture, 1-2.2 parts of an initiator, 7-14 parts of a mercaptan curing agent and 16.5-72 parts of an auxiliary agent; The epoxy resin mixture has an epoxy equivalent of 120-200g/eq and a viscosity of 800-2000 mPa.s. Optionally, the molar ratio of the epoxy group in the epoxy resin mixture to the mercapto group of the thiol curing agent is 1:1.05-1.1. Optionally, the epoxy resin mixture is selected from one or more of liquid bisphenol a epoxy resin, liquid cycloaliphatic epoxy resin, liquid hydrogenated bisphenol a epoxy resin. Optionally, the epoxy mixture comprises a liquid bisphenol a type epoxy resin and a liquid cycloaliphatic epoxy resin; The mass ratio of the liquid bisphenol A epoxy resin to the liquid alicyclic epoxy resin is 2:1-3:1. Optionally, the thiol curing agent has a thiol content of 3-4 mmol/g, and the thermal decomposition temperature of the thiol curing agent is more than or equal to 280 ℃. Optionally, the thiol curing agent includes one or more of trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptopropionate), dipentaerythritol hexa (3-mercaptopropionate). Optionally, the mass ratio of the trimethylolpropane tri (3-mercaptopropionate) to the pentaerythritol tetra (3-mercaptopropionate) is 2:1-3:1. Optionally, the glue composition further comprises 0.5-2 parts of curing auxiliary agent, 10-20 parts of toughening agent, 0.1-0.5 part of light sensation agent, 4-9 parts of semi-solid modifier and 0-35 parts of light diffusion powder. Optionally, the initiator comprises a photo-cationic initiator comprising a triarylsulfonium salt initiator; And/or the curing auxiliary comprises one or more of tertiary amine compounds and organic phosphine compounds, wherein the tertiary amine compounds comprise one or more of triethanolamine and dimethylbenzylamine, and the organic phosphine compounds comprise triphenylphosphine; and/or the toughening agent comprises one or more of an epoxy modified toughening agent and a sulfhydryl modified toughening agent, and the functionality o