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CN-122011988-A - Glue composition and packaging adhesive film

CN122011988ACN 122011988 ACN122011988 ACN 122011988ACN-122011988-A

Abstract

In order to improve the interface binding force and stability of an encapsulation adhesive film and realize rapid encapsulation under mild conditions, the invention provides a glue composition, which comprises, by mass, 21-56 parts of alicyclic epoxy resin, 5-40 parts of hydrogenated epoxy resin, 5-45 parts of aromatic epoxy resin, 0.51-10.5 parts of photoinitiator, 2.01-12 parts of free radical initiator and 10-40 parts of auxiliary agent.

Inventors

  • ZHOU SHAOHONG
  • WU JIAHUA
  • KONG BEIBEI
  • ZHENG HAITING

Assignees

  • 广州慧谷新材料科技股份有限公司

Dates

Publication Date
20260512
Application Date
20260213

Claims (10)

  1. 1. The glue composition is characterized by comprising, by mass, 21-56 parts of alicyclic epoxy resin, 5-40 parts of hydrogenated epoxy resin, 5-45 parts of aromatic epoxy resin, 0.51-10.5 parts of photoinitiator, 2.01-12 parts of free radical initiator and 10-40 parts of auxiliary agent.
  2. 2. The glue composition according to claim 1, wherein the glue composition comprises, by mass, 41-56 parts of an alicyclic epoxy resin, 25-40 parts of a hydrogenated epoxy resin, 35-45 parts of an aromatic epoxy resin, 0.6-10.5 parts of a photoinitiator, 2.1-12 parts of a free radical initiator and 10-35 parts of an auxiliary agent.
  3. 3. The glue composition according to claim 1, wherein the cycloaliphatic epoxy resin comprises an epoxy compound comprising at least one cycloaliphatic backbone; The cycloaliphatic epoxy resin is selected from one or more of 3, 4-epoxycyclohexylmethyl-3, 4-epoxycyclohexylformate, bis ((3, 4-epoxycyclohexyl) methyl) adipate, 1, 2-epoxy-4-vinylcyclohexane, 3, 4-epoxy-4-cyclohexylmethyl methacrylate, 3-ethyl-3-epoxypropanemethanol, 3'- [ oxybis methylene ] bis [ 3-ethyl ] oxetane, 1-methyl-4- (2-methyl oxiranyl) -7-oxabicyclo [4.1.0] heptane, 2-bis- (3, 4-epoxycyclohexyl) -propane, 3' -dicyclohexen-3, 3', 4' -diepoxide, cyclohexane-1, 2-dicarboxylic acid bis (epoxyethylmethyl) ester, vinylcyclohexene dioxide, dicyclopentadiene dioxide, 4, 5-epoxytetrahydrophthalic acid diglycidyl ester.
  4. 4. Glue composition according to claim 1, wherein the hydrogenated epoxy resin meets at least one of the following conditions: the hydrogenated epoxy resin is solid at 25-30 ℃; the hydrogenated epoxy resin comprises a glycidol epoxy resin, and the hydrogenated epoxy resin does not contain benzene rings; the epoxy equivalent of the hydrogenated epoxy resin is 400-1500g/eq; the hydrogenated epoxy resin is selected from one or two of hydrogenated bisphenol A epoxy resin and hydrogenated bisphenol F epoxy resin.
  5. 5. The glue composition according to claim 1, wherein the aromatic epoxy resin is selected from one or more of bisphenol a type epoxy resin, bisphenol a type phenolic epoxy resin, bisphenol S type epoxy resin, bisphenol F type epoxy resin, biphenyl epoxy resin, ortho-resol type epoxy resin, dicyclopentadiene phenol epoxy resin, naphthalene type epoxy resin.
  6. 6. The glue composition according to claim 1, further comprising, in parts by mass, 1-50 parts of a toughening agent, 0.01-10 parts of a sensitizer, 0.01-5 parts of a silane coupling agent and 0-50 parts of a light diffusing powder.
  7. 7. The glue composition of claim 6, wherein the toughening agent is selected from one or more of alkyl polyols, polyether polyols, polyester polyols, polycarbonate polyols, polycaprolactone polyols, polyurethane polyols, carboxyl terminated nitrile rubbers, core shell polymers, hyperbranched polymers; And/or the sensitizer is selected from one or more of 9, 10-dibutoxyanthracene, 9, 10-diethoxy-2-ethylanthracene, 3-benzoyl-7-diethylaminocoumarin, 7-diethylamino-4-methylcoumarin, 3' -carbonylbis (7-diethylaminocoumarin), thioxanthone, camphorquinone; And/or the silane coupling agent is selected from one or more of gamma- (methacryloyloxy) propyl trimethoxysilane, gamma- (2, 3-glycidoxy) propyl trimethoxysilane, gamma-mercaptopropyl trimethoxysilane, 3- (2, 3-glycidoxy) propyl triethoxysilane and gamma-aminopropyl triethoxysilane; and/or the light diffusion powder is selected from one or more of spherical silicon dioxide, organic silicon microspheres and polymethyl methacrylate microspheres.
  8. 8. The glue composition according to claim 1, wherein the photoinitiator is selected from one or more of aromatic sulfonium hexafluorophosphate, aromatic iodonium hexafluorophosphate, aromatic sulfonium hexafluoroantimonate, aromatic sulfonium tetrakis (pentafluorophenyl) borate, aromatic ferrocenium hexafluorophosphate.
  9. 9. The glue composition according to claim 1, wherein the free radical initiator comprises a peroxide type thermal free radical initiator selected from one or more of t-butyl peroxy-2-ethylhexanoate, t-butyl peroxyacetate, t-butyl peroxybenzoate, t-butyl peroxy-3, 5-trimethylhexanoate, dicumyl peroxide, dicumyl hydroperoxide, di-t-butyl peroxide.
  10. 10. A packaging adhesive film comprising a first release film, a second release film, and a glue layer formed from the glue composition of any one of claims 1-9, the glue layer disposed between the first release film and the second release film.

Description

Glue composition and packaging adhesive film Technical Field The invention relates to the technical field of optical cement, in particular to a glue composition and a packaging adhesive film. Background With the rapid development of Mini LED display technology to the direction of micro-spacing, the chip size has been reduced to the order of 50-200 microns, which puts higher demands on the accuracy and reliability of packaging technology. The traditional mould pressing packaging technology depends on thermosetting materials such as epoxy resin and the like, needs to be cured for a long time in a high-temperature high-pressure environment with the temperature of more than 150 ℃, has the problems of high energy consumption, long period, easiness in generating flow marks and the like, and is difficult to meet the requirements of high-precision and high-efficiency mass production. The adhesive film packaging is a preferred scheme of micro-spacing Mini LEDs due to strong process suitability, but the existing adhesive film products still face some technical bottlenecks, such as insufficient process compatibility, most adhesive films need high-temperature melting and secondary high-temperature curing (such as more than 150 ℃), thermal stress is generated in the process to easily cause module warpage and chip thermal damage, in addition, the material performance is limited, the problems of short room-temperature applicable period, harsh laminating parameters, weak interface binding force and the like exist, and the moisture and heat resistance, ultraviolet resistance and ink color consistency are poor, so that the long-term reliability and visual uniformity of the product are influenced. Therefore, there is a need to develop a glue composition and a packaging adhesive film that can achieve rapid packaging under mild conditions and have both excellent interfacial bonding force and stability. Disclosure of Invention The invention aims to provide a glue composition and a packaging adhesive film, which are used for solving the problems of high temperature, long time, low production efficiency, poor storage stability of packaging materials and insufficient packaging strength of a Mini LED packaging process in the prior art. The technical scheme adopted by the invention for solving the technical problems is as follows: In a first aspect, the invention provides a glue composition, which comprises, by mass, 21-56 parts of alicyclic epoxy resin, 5-40 parts of hydrogenated epoxy resin, 5-45 parts of aromatic epoxy resin, 0.51-10.5 parts of photoinitiator, 2.01-12 parts of free radical initiator and 10-40 parts of auxiliary agent. Optionally, the epoxy resin comprises, by mass, 41-56 parts of alicyclic epoxy resin, 25-40 parts of hydrogenated epoxy resin, 35-45 parts of aromatic epoxy resin, 0.6-10.5 parts of photoinitiator, 2.1-12 parts of free radical initiator and 10-35 parts of auxiliary agent. Optionally, the cycloaliphatic epoxy resin comprises an epoxy compound comprising at least one cycloaliphatic backbone; The cycloaliphatic epoxy resin is selected from one or more of 3, 4-epoxycyclohexylmethyl-3, 4-epoxycyclohexylformate, bis ((3, 4-epoxycyclohexyl) methyl) adipate, 1, 2-epoxy-4-vinylcyclohexane, 3, 4-epoxy-4-cyclohexylmethyl methacrylate, 3-ethyl-3-epoxypropanemethanol, 3'- [ oxybis methylene ] bis [ 3-ethyl ] oxetane, 1-methyl-4- (2-methyl oxiranyl) -7-oxabicyclo [4.1.0] heptane, 2-bis- (3, 4-epoxycyclohexyl) -propane, 3' -dicyclohexen-3, 3', 4' -diepoxide, cyclohexane-1, 2-dicarboxylic acid bis (epoxyethylmethyl) ester, vinylcyclohexene dioxide, dicyclopentadiene dioxide, 4, 5-epoxytetrahydrophthalic acid diglycidyl ester. Optionally, the hydrogenated epoxy resin meets at least one of the following conditions: the hydrogenated epoxy resin is solid at 25-30 ℃; the hydrogenated epoxy resin comprises a glycidol epoxy resin, and the hydrogenated epoxy resin does not contain benzene rings; the epoxy equivalent of the hydrogenated epoxy resin is 400-1500g/eq; the hydrogenated epoxy resin is selected from one or two of hydrogenated bisphenol A epoxy resin and hydrogenated bisphenol F epoxy resin. Optionally, the aromatic epoxy resin is selected from one or more of bisphenol A type epoxy resin, bisphenol A type phenolic epoxy resin, bisphenol S type epoxy resin, bisphenol F type epoxy resin, biphenyl epoxy resin, o-cresol type epoxy resin, dicyclopentadiene phenol epoxy resin and naphthalene type epoxy resin. Optionally, the glue composition further comprises, by mass, 1-50 parts of a toughening agent, 0.01-10 parts of a sensitizer, 0.01-5 parts of a silane coupling agent and 0-50 parts of light diffusion powder. Optionally, the toughening agent is selected from one or more of alkyl polyols, polyether polyols, polyester polyols, polycarbonate polyols, polycaprolactone polyols, polyurethane polyols, carboxyl terminated nitrile rubber, core-shell polymers, hyperbranched polymers; And/or the sensitizer is selected from one